Datasheet ADHV4702-1 (Analog Devices) - 7
| 制造商 | Analog Devices |
| 描述 | 24 V to 220 V, Precision Operational Amplifier |
| 页数 / 页 | 21 / 7 — Data Sheet. ADHV4702-1. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. P M. … |
| 修订版 | A |
| 文件格式/大小 | PDF / 1.5 Mb |
| 文件语言 | 英语 |
Data Sheet. ADHV4702-1. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. P M. IN–. RESERVED 1. 9 RADJ. TOP VIEW. IN+ 2. 8 SD. (Not to Scale)
文件文字版本
Data Sheet ADHV4702-1 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS ADHV4702-1 P M ND IN– CO DG 2 1 0 1 1 1 RESERVED 1 9 RADJ TOP VIEW IN+ 2 8 SD (Not to Scale) RESERVED 3 7 VCC 4 5 6 P M UT VEE T O NOTES 1. RESERVED. THESE PINS ARE INTERNALLY CONNECTED. FLOAT OR TIE THESE PINS TO THE DIGITAL GROUND.
3
2. EXPOSED THERMAL PAD. NO INTERNAL ELECTRICAL
-10
CONNECTION. TIE EPAD TO EXTERNAL GROUND PLANE AND/OR HEAT SINK FOR THERMAL MANAGEMENT.
16047 Figure 4. Pin Configuration
Table 4. Pin Function Descriptions Pin No. Mnemonic Description
1, 3 RESERVED Reserved. These pins are internally connected. Float or connect these pins to the digital ground. 2 IN+ Noninverting Input. 4 VEE Negative Power Supply Input. 5 TMP Temperature Monitor Output. 6 OUT Output. 7 VCC Positive Power Supply Input. 8 SD Shutdown (Active Low). SD is referenced to DGND. 9 RADJ Resistor Adjustable Quiescent Current. Connect RADJ to DGND to fully bias the amplifier. 10 DGND Logic Reference for RADJ and SD. Connect DGND to 0 V analog ground. 11 COMP External Compensation. 12 IN− Inverting Input. EPAD Exposed Thermal Pad. No internal electrical connection. Tie EPAD to external ground plane and/or heat sink for thermal management. Rev. A | Page 7 of 21 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION TYPICAL APPLICATION CIRCUIT TABLE OF CONTENTS REVISION HISTORY FUNCTIONAL BLOCK DIAGRAM SPECIFICATIONS ±12 V TO ±110 V SUPPLY ABSOLUTE MAXIMUM RATINGS MAXIMUM POWER DISSIPATION THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION INTERNAL ELECTROSTATIC DISCHARGE (ESD) PROTECTION SLEW BOOST CIRCUIT AND PROTECTION DIGITAL GROUND (DGND) RESISTOR ADJUSTABLE QUIESCENT CURRENT (RADJ) SHUTDOWN PIN (SDB) TEMPERATURE MONITOR (TMP) OVERTEMPERATURE PROTECTION OUTPUT CURRENT DRIVE AND SHORT-CIRCUIT PROTECTION EXTERNAL COMPENSATION AND CAPACITIVE LOAD (CLOAD) DRIVING SAFE OPERATING AREA LFCSP PACKAGE AND HIGH VOLTAGE PIN SPACING EXPOSED PAD (EPAD) APPLICATIONS INFORMATION POWER SUPPLY AND DECOUPLING HIGH VOLTAGE GUARD RING HIGH VOLTAGE DAC VOLTAGE SUBTRACTOR HIGH CURRENT OUTPUT DRIVER SIGNAL RANGE EXTENDER OUTLINE DIMENSIONS ORDERING GUIDE
3
2. EXPOSED THERMAL PAD. NO INTERNAL ELECTRICAL
-10
CONNECTION. TIE EPAD TO EXTERNAL GROUND PLANE AND/OR HEAT SINK FOR THERMAL MANAGEMENT.
16047 Figure 4. Pin Configuration
Table 4. Pin Function Descriptions Pin No. Mnemonic Description
1, 3 RESERVED Reserved. These pins are internally connected. Float or connect these pins to the digital ground. 2 IN+ Noninverting Input. 4 VEE Negative Power Supply Input. 5 TMP Temperature Monitor Output. 6 OUT Output. 7 VCC Positive Power Supply Input. 8 SD Shutdown (Active Low). SD is referenced to DGND. 9 RADJ Resistor Adjustable Quiescent Current. Connect RADJ to DGND to fully bias the amplifier. 10 DGND Logic Reference for RADJ and SD. Connect DGND to 0 V analog ground. 11 COMP External Compensation. 12 IN− Inverting Input. EPAD Exposed Thermal Pad. No internal electrical connection. Tie EPAD to external ground plane and/or heat sink for thermal management. Rev. A | Page 7 of 21 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION TYPICAL APPLICATION CIRCUIT TABLE OF CONTENTS REVISION HISTORY FUNCTIONAL BLOCK DIAGRAM SPECIFICATIONS ±12 V TO ±110 V SUPPLY ABSOLUTE MAXIMUM RATINGS MAXIMUM POWER DISSIPATION THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION INTERNAL ELECTROSTATIC DISCHARGE (ESD) PROTECTION SLEW BOOST CIRCUIT AND PROTECTION DIGITAL GROUND (DGND) RESISTOR ADJUSTABLE QUIESCENT CURRENT (RADJ) SHUTDOWN PIN (SDB) TEMPERATURE MONITOR (TMP) OVERTEMPERATURE PROTECTION OUTPUT CURRENT DRIVE AND SHORT-CIRCUIT PROTECTION EXTERNAL COMPENSATION AND CAPACITIVE LOAD (CLOAD) DRIVING SAFE OPERATING AREA LFCSP PACKAGE AND HIGH VOLTAGE PIN SPACING EXPOSED PAD (EPAD) APPLICATIONS INFORMATION POWER SUPPLY AND DECOUPLING HIGH VOLTAGE GUARD RING HIGH VOLTAGE DAC VOLTAGE SUBTRACTOR HIGH CURRENT OUTPUT DRIVER SIGNAL RANGE EXTENDER OUTLINE DIMENSIONS ORDERING GUIDE