Datasheet BC846S (NXP) - 5
| 制造商 | NXP |
| 描述 | NPN general purpose double transistor 65 V, 100 mA, SOT363 |
| 页数 / 页 | 7 / 5 — PACKAGE OUTLINE. Plastic surface mounted package; 6 leads. SOT363. … |
| 文件格式/大小 | PDF / 206 Kb |
| 文件语言 | 英语 |
PACKAGE OUTLINE. Plastic surface mounted package; 6 leads. SOT363. DIMENSIONS (mm are the original dimensions). UNIT. max
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NXP Semiconductors Product data sheet NPN general purpose double transistor BC846S
PACKAGE OUTLINE Plastic surface mounted package; 6 leads SOT363
D B E A X y HE v M A
6 5 4
Q pin 1 index A A1
1 2 3
c e1 b w M B p Lp e detail X 0 1 2 mm scale
DIMENSIONS (mm are the original dimensions) A1 UNIT A bp c D E e e v w max 1 HE Lp Q y
1.1 0.30 0.25 2.2 1.35 2.2 0.45 0.25 mm 0.1 1.3 0.65 0.2 0.2 0.1 0.8 0.20 0.10 1.8 1.15 2.0 0.15 0.15
REFERENCES OUTLINE EUROPEAN ISSUE DATE VERSION PROJECTION IEC JEDEC EIAJ
SOT363 SC-88 97-02-28 1999 Sep 01 5 Document Outline Features Applications Description Pinning Marking Limiting values Thermal characteristics Characteristics Package outline Data sheet status Disclaimers
PACKAGE OUTLINE Plastic surface mounted package; 6 leads SOT363
D B E A X y HE v M A
6 5 4
Q pin 1 index A A1
1 2 3
c e1 b w M B p Lp e detail X 0 1 2 mm scale
DIMENSIONS (mm are the original dimensions) A1 UNIT A bp c D E e e v w max 1 HE Lp Q y
1.1 0.30 0.25 2.2 1.35 2.2 0.45 0.25 mm 0.1 1.3 0.65 0.2 0.2 0.1 0.8 0.20 0.10 1.8 1.15 2.0 0.15 0.15
REFERENCES OUTLINE EUROPEAN ISSUE DATE VERSION PROJECTION IEC JEDEC EIAJ
SOT363 SC-88 97-02-28 1999 Sep 01 5 Document Outline Features Applications Description Pinning Marking Limiting values Thermal characteristics Characteristics Package outline Data sheet status Disclaimers