Datasheet BC847BPN (Nexperia) - 3
| 制造商 | Nexperia |
| 描述 | NPN/PNP general-purpose transistor pair in a very small SOT363 (SC-88) Surface-Mounted Device (SMD) plastic package. |
| 页数 / 页 | 14 / 3 — Nexperia. BC847BPN. 45 V, 100 mA NPN/PNP general-purpose transistor. Fig … |
| 修订版 | 07082018 |
| 文件格式/大小 | PDF / 589 Kb |
| 文件语言 | 英语 |
Nexperia. BC847BPN. 45 V, 100 mA NPN/PNP general-purpose transistor. Fig 1. Per device: Power derating curves SOT363 (SC-88)
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Nexperia BC847BPN 45 V, 100 mA NPN/PNP general-purpose transistor
006aab419 500 Ptot (mW) (1) 400 (2) 300 200 100 0−75 −25 25 75 125 175 Tamb (°C) (1) FR4 PCB, mounting pad for collector 1 cm2 (2) FR4 PCB, standard footprint
Fig 1. Per device: Power derating curves SOT363 (SC-88) 6. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Per transistor
Rth(j-a) thermal resistance from in free air [1] - - 568 K/W junction to ambient [2] - - 500 K/W Rth(j-sp) thermal resistance from - - 230 K/W junction to solder point
Per device
Rth(j-a) thermal resistance from in free air [1] - - 416 K/W junction to ambient [2] - - 313 K/W [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2. BC847BPN_4 © NNexperia B.V. 2017. All rights reserved
Product data sheet Rev. 04 — 18 February 2009 3 of 14
Document Outline 1. Product profile 1.1 General description 1.2 Features 1.3 Applications 1.4 Quick reference data 2. Pinning information 3. Ordering information 4. Marking 5. Limiting values 6. Thermal characteristics 7. Characteristics 8. Package outline 9. Packing information 10. Soldering 11. Revision history 12. Legal information 12.1 Data sheet status 12.2 Definitions 12.3 Disclaimers 12.4 Trademarks 13. Contact information 14. Contents
Nexperia BC847BPN 45 V, 100 mA NPN/PNP general-purpose transistor
006aab419 500 Ptot (mW) (1) 400 (2) 300 200 100 0−75 −25 25 75 125 175 Tamb (°C) (1) FR4 PCB, mounting pad for collector 1 cm2 (2) FR4 PCB, standard footprint
Fig 1. Per device: Power derating curves SOT363 (SC-88) 6. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Per transistor
Rth(j-a) thermal resistance from in free air [1] - - 568 K/W junction to ambient [2] - - 500 K/W Rth(j-sp) thermal resistance from - - 230 K/W junction to solder point
Per device
Rth(j-a) thermal resistance from in free air [1] - - 416 K/W junction to ambient [2] - - 313 K/W [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2. BC847BPN_4 © NNexperia B.V. 2017. All rights reserved
Product data sheet Rev. 04 — 18 February 2009 3 of 14
Document Outline 1. Product profile 1.1 General description 1.2 Features 1.3 Applications 1.4 Quick reference data 2. Pinning information 3. Ordering information 4. Marking 5. Limiting values 6. Thermal characteristics 7. Characteristics 8. Package outline 9. Packing information 10. Soldering 11. Revision history 12. Legal information 12.1 Data sheet status 12.2 Definitions 12.3 Disclaimers 12.4 Trademarks 13. Contact information 14. Contents