Datasheet AL5814Q (Diodes) - 4
| 制造商 | Diodes |
| 描述 | Automotive Compliant 60V LED Linear Dimmable LED Controller |
| 页数 / 页 | 14 / 4 — AL5814Q. ESD Ratings. Symbol. Parameter. Rating. Unit. Recommended … |
| 文件格式/大小 | PDF / 561 Kb |
| 文件语言 | 英语 |
AL5814Q. ESD Ratings. Symbol. Parameter. Rating. Unit. Recommended Operating Conditions. Min. Max. OD R. Thermal Information. www.diodes.com
该数据表的模型线
文件文字版本
AL5814Q ESD Ratings Symbol Parameter Rating Unit
Human-Body Model (HMB), Per AEC Q100-002 (Note 6) ±2000 VESD Other Pins ±500 V Charged-Device Model (CDM), per AEC Q100-011 Corner Pins (1, 4, 5, 8,) ±750 Note: 6. AEC-Q100-002 indicates that HBM stressing shall be accordance with the ANSI/ESDA/JEDEC JS-001 specification
T Recommended Operating Conditions UC Symbol Parameter Min Max Unit
VVCC Supply Voltage Range Relative to GND Pin 4.5 60 V
OD R
VOUT OUT Voltage Range (Note 7) 0 3 V
P
IOUT OUT Pin Current (Note 7) 0 15 mA
W
VVSET VSET Pin Operating Input Voltage Range 0 0.6 V
E
TA Operating Ambient Temperature -40 +125 °C
N
Note: 7. The maximum source current and drive voltage out of the OUT pin is limited by an internal clamp as well as maximum recommended junction temperature not exceeding 150°C. OUT voltages greater than 3V are supported but at reduced output currents. As VCC reduces below 6V the maximum output voltage supporting output currents above 10mA also reduces; VCC-VOUT ≥ 3V.
Thermal Information
(Note 8)
Symbol Parameter Rating Unit
ϴJA Junction-To-Ambient Thermal Resistance 56 °C/W ϴJC Junction-To-Case (Top) Thermal Resistance 8 °C/W Note: 8. Device mounted on FR-4 PCB (51mm × 51mm 2oz copper); minimum recommended pad layout on top layer and thermal vias to bottom layer ground plane. For better thermal performance, larger copper pad for heat-sink is required. AL5814Q 4 of 14 April 2019 Document number: DS41792 Rev. 1 - 2
www.diodes.com
© Diodes Incorporated Document Outline Pin Assignments Description Applications Features Package Outline Dimensions Suggested Pad Layout
Human-Body Model (HMB), Per AEC Q100-002 (Note 6) ±2000 VESD Other Pins ±500 V Charged-Device Model (CDM), per AEC Q100-011 Corner Pins (1, 4, 5, 8,) ±750 Note: 6. AEC-Q100-002 indicates that HBM stressing shall be accordance with the ANSI/ESDA/JEDEC JS-001 specification
T Recommended Operating Conditions UC Symbol Parameter Min Max Unit
VVCC Supply Voltage Range Relative to GND Pin 4.5 60 V
OD R
VOUT OUT Voltage Range (Note 7) 0 3 V
P
IOUT OUT Pin Current (Note 7) 0 15 mA
W
VVSET VSET Pin Operating Input Voltage Range 0 0.6 V
E
TA Operating Ambient Temperature -40 +125 °C
N
Note: 7. The maximum source current and drive voltage out of the OUT pin is limited by an internal clamp as well as maximum recommended junction temperature not exceeding 150°C. OUT voltages greater than 3V are supported but at reduced output currents. As VCC reduces below 6V the maximum output voltage supporting output currents above 10mA also reduces; VCC-VOUT ≥ 3V.
Thermal Information
(Note 8)
Symbol Parameter Rating Unit
ϴJA Junction-To-Ambient Thermal Resistance 56 °C/W ϴJC Junction-To-Case (Top) Thermal Resistance 8 °C/W Note: 8. Device mounted on FR-4 PCB (51mm × 51mm 2oz copper); minimum recommended pad layout on top layer and thermal vias to bottom layer ground plane. For better thermal performance, larger copper pad for heat-sink is required. AL5814Q 4 of 14 April 2019 Document number: DS41792 Rev. 1 - 2
www.diodes.com
© Diodes Incorporated Document Outline Pin Assignments Description Applications Features Package Outline Dimensions Suggested Pad Layout