Datasheet ZSSC4175D-01 (IDT) - 5
| 制造商 | IDT |
| 描述 | Automotive Sensor Signal Conditioner for Thermocouples with SENT Output |
| 页数 / 页 | 35 / 5 — 1. Pin Assignments. Figure 1. Pin Assignments for 4. 4 mm 24-QFN Package … |
| 修订版 | 20190607 |
| 文件格式/大小 | PDF / 783 Kb |
| 文件语言 | 英语 |
1. Pin Assignments. Figure 1. Pin Assignments for 4. 4 mm 24-QFN Package – Top View. ZSSC4175D. 2. Pin Descriptions. Table 1
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1. Pin Assignments
The ZSSC4175D-01 is available in a 24-QFN (4 4 mm; wet able flanks) RoHS-conformant package. Note: The backside of the 24-QFN package (exposed pad; see section 13) is electrically connected to VSSA. Recommendation: On the printed circuit board (PCB), the land pattern of the exposed pad should be shorted to the solder pad of the VSSA pin. The exposed pad of the 24-QFN package should be soldered to reduce thermal resistance.
Figure 1. Pin Assignments for 4
4 mm 24-QFN Package – Top View
P2 2 P 1 N1 T BR TS OT TS O BR B 18 17 16 15 14 13 BR2N 19 12 BR1P 20 11 21 10
ZSSC4175D
22 9 23 8 24 7 DOUT 1 2 3 4 5 6 A A L D A E S C E D S D S D SS V V S DV V
2. Pin Descriptions Table 1. Pin Descriptions 24-QFN Pin Pin Name Type Description
1 VDDA Supply Internal supply 2 VSSA Supply Internal ground 3 SDA [a], [b] I/O I2C data input/output with internal pull-up (optional for production purposes only) 4 SCL [a], [b] Input I2C clock, with internal pull-up (optional for production purposes only) 5 VDDE Supply External supply 6 VSSE Supply External ground 7 DOUT I/O SENT output and One-Wire Interface (OWI) input/output 8 to 11 n.c. – No connection – unused 12 BR1P Input Positive thermocouple input 13 BOT Supply High ohmic – unused 14 BR1N Input Negative thermocouple input 15 TS1 Input High ohmic – unused © 2019 Integrated Device Technology, Inc. 5 June 7, 2019 Document Outline 1. Pin Assignments 2. Pin Descriptions 3. Absolute Maximum Ratings 4. Operating Conditions 5. Electrical Characteristics 6. Interface Characteristics and Nonvolatile Memory 7. Circuit Description 7.1 General Operation Description 7.2 Signal Path 7.3 Signal Conditioning 7.3.1 Thermocouple Sensor Signal Conditioning 7.3.2 Internal Temperature Sensor Signal Conditioning 7.4 Analog Front-End 7.4.1 Overview 7.4.2 SCCM 7.4.3 Input Multiplexer 7.4.4 Programmable Gain Amplifier 7.4.5 Analog-to-Digital Converter 7.5 Signal Measurement 7.5.1 Thermocouple Element Measurement 7.5.2 Internal Temperature Measurement 7.5.3 Isolation Conductance Measurement (Giso) 7.5.4 Thermocouple Resistor Measurement (Ropen) 7.5.5 Measurement Cycle 7.6 SENT Output 7.6.1 Overview 7.6.2 SENT Fast Channel Modes and Frame Format 7.6.3 SENT SDM Channel Modes 7.6.4 SENT Output Operation Modes 7.6.5 SENT Pulse Shaping 7.7 NVM OEM Data Memory 7.8 Over-Voltage and Short-Circuit Protection 8. Fault-Safe Operation 8.1 Fault-Safe Operation Modes 8.2 Fault Messaging 8.2.1 Overview 8.2.2 SENT Fast Channel Fault Codes 8.2.3 SENT Status Bits 8.2.4 SENT SDM Channel Status Codes 8.2.5 Timing Definitions 9. Fault Checks 9.1 Overview 9.2 Hardware Fault Checks 9.3 Application Monitors 9.4 Transmission Fault Checks 10. Application Circuit and External Components 11. ESD Protection and EMC Specification 11.1 ESD Protection 11.2 Electromagnetic Emission 11.3 Conducted Susceptibility (DPI) 12. Reliability and RoHS Conformity 13. Package Outline Drawings 14. Marking Diagram 15. Glossary 16. Ordering Information 17. Revision History
1. Pin Assignments
The ZSSC4175D-01 is available in a 24-QFN (4 4 mm; wet able flanks) RoHS-conformant package. Note: The backside of the 24-QFN package (exposed pad; see section 13) is electrically connected to VSSA. Recommendation: On the printed circuit board (PCB), the land pattern of the exposed pad should be shorted to the solder pad of the VSSA pin. The exposed pad of the 24-QFN package should be soldered to reduce thermal resistance.
Figure 1. Pin Assignments for 4
4 mm 24-QFN Package – Top View
P2 2 P 1 N1 T BR TS OT TS O BR B 18 17 16 15 14 13 BR2N 19 12 BR1P 20 11 21 10
ZSSC4175D
22 9 23 8 24 7 DOUT 1 2 3 4 5 6 A A L D A E S C E D S D S D SS V V S DV V
2. Pin Descriptions Table 1. Pin Descriptions 24-QFN Pin Pin Name Type Description
1 VDDA Supply Internal supply 2 VSSA Supply Internal ground 3 SDA [a], [b] I/O I2C data input/output with internal pull-up (optional for production purposes only) 4 SCL [a], [b] Input I2C clock, with internal pull-up (optional for production purposes only) 5 VDDE Supply External supply 6 VSSE Supply External ground 7 DOUT I/O SENT output and One-Wire Interface (OWI) input/output 8 to 11 n.c. – No connection – unused 12 BR1P Input Positive thermocouple input 13 BOT Supply High ohmic – unused 14 BR1N Input Negative thermocouple input 15 TS1 Input High ohmic – unused © 2019 Integrated Device Technology, Inc. 5 June 7, 2019 Document Outline 1. Pin Assignments 2. Pin Descriptions 3. Absolute Maximum Ratings 4. Operating Conditions 5. Electrical Characteristics 6. Interface Characteristics and Nonvolatile Memory 7. Circuit Description 7.1 General Operation Description 7.2 Signal Path 7.3 Signal Conditioning 7.3.1 Thermocouple Sensor Signal Conditioning 7.3.2 Internal Temperature Sensor Signal Conditioning 7.4 Analog Front-End 7.4.1 Overview 7.4.2 SCCM 7.4.3 Input Multiplexer 7.4.4 Programmable Gain Amplifier 7.4.5 Analog-to-Digital Converter 7.5 Signal Measurement 7.5.1 Thermocouple Element Measurement 7.5.2 Internal Temperature Measurement 7.5.3 Isolation Conductance Measurement (Giso) 7.5.4 Thermocouple Resistor Measurement (Ropen) 7.5.5 Measurement Cycle 7.6 SENT Output 7.6.1 Overview 7.6.2 SENT Fast Channel Modes and Frame Format 7.6.3 SENT SDM Channel Modes 7.6.4 SENT Output Operation Modes 7.6.5 SENT Pulse Shaping 7.7 NVM OEM Data Memory 7.8 Over-Voltage and Short-Circuit Protection 8. Fault-Safe Operation 8.1 Fault-Safe Operation Modes 8.2 Fault Messaging 8.2.1 Overview 8.2.2 SENT Fast Channel Fault Codes 8.2.3 SENT Status Bits 8.2.4 SENT SDM Channel Status Codes 8.2.5 Timing Definitions 9. Fault Checks 9.1 Overview 9.2 Hardware Fault Checks 9.3 Application Monitors 9.4 Transmission Fault Checks 10. Application Circuit and External Components 11. ESD Protection and EMC Specification 11.1 ESD Protection 11.2 Electromagnetic Emission 11.3 Conducted Susceptibility (DPI) 12. Reliability and RoHS Conformity 13. Package Outline Drawings 14. Marking Diagram 15. Glossary 16. Ordering Information 17. Revision History