Datasheet ZSSC4175D-01 (IDT) - 6

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24-QFN Pin Pin Name Type Description
16 TOP Supply High ohmic – unused 17 TS2 Input High ohmic – unused 18 BR2P Input Positive thermocouple input 2 19 BR2N Input Negative thermocouple input 2 20 to 24 n.c. – No connection – unused 25 EPAD [c] Supply Exposed pad – internally connected to VSSA [a] Internal pull-up. [b] No connection required. [c] Ground – should be shorted externally to VSSA (pin 2).
3. Absolute Maximum Ratings
The absolute maximum ratings are stress ratings only. Stresses greater than those listed below can cause permanent damage to the device. Functional operation of the ZSSC4175D-01 at absolute maximum ratings is not implied. Exposure to absolute maximum rating conditions might affect device reliability. In addition, extended exposure to stresses above the operating conditions given in section 4 might affect device reliability. See section 7.8 for information about over-voltage protection, reverse-polarity, and short-circuit protection.
Table 2. Absolute Maximum Ratings No. Symbol Parameter Conditions Min Max Unit
DS_001 VDDE_ABS Supply voltage -18 18 V DS_002 VDOUT_ABS Voltage at the DOUT pin -18 18 V DS_003 VPIN_ABS Pin voltage difference Voltage between any two of these pins: -18 18 V VDDE, OUT and VSSE DS_004 VDDA_ABS Analog supply voltage On-chip controlled voltage; do not supply -0.3 6 V externally DS_006 VPIN_ABS Voltage at all other pins Maximum voltage is VDDA + 0.3V -0.3 6 V DS_007 TJ_ABS Junction temperature Note: See section 7.8 regarding over- -40 160 [a] °C voltage protection DS_008 TSTOR_ABS Storage temperature -55 155 C [a] Required for DS_016 and DS_012. © 2019 Integrated Device Technology, Inc. 6 June 7, 2019 Document Outline 1. Pin Assignments 2. Pin Descriptions 3. Absolute Maximum Ratings 4. Operating Conditions 5. Electrical Characteristics 6. Interface Characteristics and Nonvolatile Memory 7. Circuit Description 7.1 General Operation Description 7.2 Signal Path 7.3 Signal Conditioning 7.3.1 Thermocouple Sensor Signal Conditioning 7.3.2 Internal Temperature Sensor Signal Conditioning 7.4 Analog Front-End 7.4.1 Overview 7.4.2 SCCM 7.4.3 Input Multiplexer 7.4.4 Programmable Gain Amplifier 7.4.5 Analog-to-Digital Converter 7.5 Signal Measurement 7.5.1 Thermocouple Element Measurement 7.5.2 Internal Temperature Measurement 7.5.3 Isolation Conductance Measurement (Giso) 7.5.4 Thermocouple Resistor Measurement (Ropen) 7.5.5 Measurement Cycle 7.6 SENT Output 7.6.1 Overview 7.6.2 SENT Fast Channel Modes and Frame Format 7.6.3 SENT SDM Channel Modes 7.6.4 SENT Output Operation Modes 7.6.5 SENT Pulse Shaping 7.7 NVM OEM Data Memory 7.8 Over-Voltage and Short-Circuit Protection 8. Fault-Safe Operation 8.1 Fault-Safe Operation Modes 8.2 Fault Messaging 8.2.1 Overview 8.2.2 SENT Fast Channel Fault Codes 8.2.3 SENT Status Bits 8.2.4 SENT SDM Channel Status Codes 8.2.5 Timing Definitions 9. Fault Checks 9.1 Overview 9.2 Hardware Fault Checks 9.3 Application Monitors 9.4 Transmission Fault Checks 10. Application Circuit and External Components 11. ESD Protection and EMC Specification 11.1 ESD Protection 11.2 Electromagnetic Emission 11.3 Conducted Susceptibility (DPI) 12. Reliability and RoHS Conformity 13. Package Outline Drawings 14. Marking Diagram 15. Glossary 16. Ordering Information 17. Revision History