Datasheet ZSSC4175D-01 (IDT) - 9

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No. Symbol Parameter Conditions Min Typ Max Unit 5.2 Analog Front-End Characteristics
DP_003 VIN_SPAN Differential input span -5 60 mV Informal Bandgap voltage 1.129 V
5.3 Internal Temperature Measurement
DP_004 FALL_PTAT Internal temperature PTAT Calibration performed with PTAT raw data 2.0 K accuracy delivered by IDT in NVM.
5.4 Thermocouple Measurement
DP_044 TCRNG [a] Thermocouple temperature For N-type thermocouple. -45 1250 °C range DP_007 R TC_RNG [a] Thermocouple resistance 1 18 measurement range DP_009 RisoL_RNG [a] Thermocouple leakage Thermocouple isolation resistance to 20 1000 k measurement range VSSA. 0 DP_047 RisoH_RNG [a] Thermocouple leakage Thermocouple isolation resistance to 50 1000 k measurement range VDDA. 0 DP_016 Fabs Thermocouple measurement N-type thermocouple with standard ±0.3 K accuracy characteristic.[d] %±2. 0
5.5 SENT Output
Refer to SAE J2716 JAN2010 (SENT Rev. 3) and APR2016 (SENT Rev. 4) for detailed specifications for the SENT Physical and Software Layer. DS_048 tTICK Tick time Adjustment step = 1µs for tick times 2.4 90 µs ≥ 3µs. DS_049 tTICK_JITTER[a], [c] Tick time jitter Valid for tick time ≤ 10µs, 6-sigma value. 300 ns DS_050 nSDM Number of SDMs Absolute count of different messages. 0 32 Informal nSDM_CYC Number of SDM in SDM Message count in SDM cycle, including 0 64 cycle repeated SDMs. DS_052 nSDM_PRIO SDM transmission priority 1 3 levels DS_053 tPAUSE Pause length Fixed frame length. 12 768 tTICK Pause pulse disabled, 6 data nibble, 154 270 tTICK and variable frame length. DS_054 tFRAME Frame length Pause pulse enabled, 6 data nibble, 282 922 tTICK and fixed frame length. © 2019 Integrated Device Technology, Inc. 9 June 7, 2019 Document Outline 1. Pin Assignments 2. Pin Descriptions 3. Absolute Maximum Ratings 4. Operating Conditions 5. Electrical Characteristics 6. Interface Characteristics and Nonvolatile Memory 7. Circuit Description 7.1 General Operation Description 7.2 Signal Path 7.3 Signal Conditioning 7.3.1 Thermocouple Sensor Signal Conditioning 7.3.2 Internal Temperature Sensor Signal Conditioning 7.4 Analog Front-End 7.4.1 Overview 7.4.2 SCCM 7.4.3 Input Multiplexer 7.4.4 Programmable Gain Amplifier 7.4.5 Analog-to-Digital Converter 7.5 Signal Measurement 7.5.1 Thermocouple Element Measurement 7.5.2 Internal Temperature Measurement 7.5.3 Isolation Conductance Measurement (Giso) 7.5.4 Thermocouple Resistor Measurement (Ropen) 7.5.5 Measurement Cycle 7.6 SENT Output 7.6.1 Overview 7.6.2 SENT Fast Channel Modes and Frame Format 7.6.3 SENT SDM Channel Modes 7.6.4 SENT Output Operation Modes 7.6.5 SENT Pulse Shaping 7.7 NVM OEM Data Memory 7.8 Over-Voltage and Short-Circuit Protection 8. Fault-Safe Operation 8.1 Fault-Safe Operation Modes 8.2 Fault Messaging 8.2.1 Overview 8.2.2 SENT Fast Channel Fault Codes 8.2.3 SENT Status Bits 8.2.4 SENT SDM Channel Status Codes 8.2.5 Timing Definitions 9. Fault Checks 9.1 Overview 9.2 Hardware Fault Checks 9.3 Application Monitors 9.4 Transmission Fault Checks 10. Application Circuit and External Components 11. ESD Protection and EMC Specification 11.1 ESD Protection 11.2 Electromagnetic Emission 11.3 Conducted Susceptibility (DPI) 12. Reliability and RoHS Conformity 13. Package Outline Drawings 14. Marking Diagram 15. Glossary 16. Ordering Information 17. Revision History