Datasheet BAT41 (STMicroelectronics) - 4

Characteristics BAT41 Figure 7. Forward voltage drop versus Figure 8. Variation of thermal impedance forward current (typical values) junction to ambient versus pulse duration I Zth(j-a)(°C/W) FM(A)
1.E+00 1000 SOT323-6L Tj=125°C 1.E-01 Tj=100°C Tj=25°C 1.E-02 100 Single pulse 1.E-03
VFM(V) printed circuit board, epoxy FR4, e = 35 µm, SOT323-6L CU t (s) p
1.E-04 10 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02
Figure 9. Relative variation of thermal Figure 10. Relative variation of thermal impedance junction to ambient impedance junction to ambient versus pulse duration versus pulse duration Zth(j-a)/Rth(j-a) Zth(j-a)/Rth(j-a)
1.00 1.00
Allumine substrate, SOT-23
SOT-23 Alumine substrate SOD-523 10 x 8 x 0.5 mm Epoxy FR4 eCU = 35 µm Single pulse SOD-323 Single pulse 0.10 Epoxy FR4 0.10 SOT-666 SCU = 2.25 mm2 Epoxy FR4 eCU = 35 µm eCU = 35 µm
printed circuit board, epoxy FR4, e = 35 µm, SOT-666 and SOD-523 CU printed circuit board, epoxy Fr4, e = 35 µm, SOD-323 CU t (s) p t (s) p
0.01 0.01 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
Figure 11. Thermal resistance junction to ambient versus copper surface under each lead R (°C/W) th(j-a)
600
printed circuit board, epoxy Fr4, e = 35 µm, SOD-323 CU
550 500 450 400 350
S (mm²) CU
300 0 5 10 15 20 25 30 35 40 45 50 4/12 Doc ID 12633 Rev 2 Document Outline Table 1. Device summary 1 Characteristics Table 2. Absolute ratings (limiting values at Tj = 25 ˚C, unless otherwise specified) Table 3. Thermal parameters Table 4. Static electrical characteristics Table 5. Dynamic characteristics Figure 1. Average forward power dissipation versus average forward current Figure 2. Average forward current versus ambient temperature (d = 1) Figure 3. Reverse leakage current versus reverse applied voltage (typical values) Figure 4. Reverse leakage current versus junction temperature (typical values) Figure 5. Junction capacitance versus reverse applied voltage (typical values) Figure 6. Forward voltage drop versus forward current (typical values) Figure 7. Forward voltage drop versus forward current (typical values) Figure 8. Variation of thermal impedance junction to ambient versus pulse duration Figure 9. Relative variation of thermal impedance junction to ambient versus pulse duration Figure 10. Relative variation of thermal impedance junction to ambient versus pulse duration Figure 11. Thermal resistance junction to ambient versus copper surface under each lead 2 Ordering information scheme Figure 12. Ordering information scheme 3 Package information Table 6. SOD-123 dimensions Figure 13. SOD-123 footprint (dimensions in mm) Table 7. SOD-323 dimensions Figure 14. SOD-323 footprint (dimensions in mm) Table 8. SOD-523 dimensions Figure 15. SOD-523 footprint (dimensions in mm) Table 9. SOT-323 dimensions Figure 16. SOT-323 footprint (dimensions in mm) Table 10. SOT-666 dimensions Figure 17. SOT-666 footprint (dimensions in mm) 4 Ordering information Table 11. Ordering information 5 Revision history Table 12. Document revision history