Datasheet BAT41 (STMicroelectronics) - 6
| 制造商 | STMicroelectronics |
| 描述 | 100 V, 200 mA Surface Mount General Purpose Signal Schottky Diode |
| 页数 / 页 | 12 / 6 — Package information. BAT41. 3 Package. information. Table 6. SOD-123 … |
| 文件格式/大小 | PDF / 149 Kb |
| 文件语言 | 英语 |
Package information. BAT41. 3 Package. information. Table 6. SOD-123 dimensions. Dimensions. Ref. Millimeters. Inches. Min. Max. Figure 13
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Package information BAT41 3 Package information
● Epoxy meets UL94, V0 ● Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.
Table 6. SOD-123 dimensions Dimensions Ref. Millimeters Inches H A2 A1 Min. Max. Min. Max. b
A 1.45 0.057
E
A1 0 0.1 0 0.004 A2 0.85 1.35 0.033 0.053
D A
b 0.55 Typ. 0.022 Typ.
c
c 0.15 Typ. 0.039 Typ. D 2.55 2.85 0.1 0.112 E 1.4 1.7 0.055 0.067
G
G 0.25 0.01 H 3.55 3.95 0.14 0.156
Figure 13. SOD-123 footprint (dimensions in mm) 4.45 0.65 0.97 2.51 0.97
6/12 Doc ID 12633 Rev 2 Document Outline Table 1. Device summary 1 Characteristics Table 2. Absolute ratings (limiting values at Tj = 25 ˚C, unless otherwise specified) Table 3. Thermal parameters Table 4. Static electrical characteristics Table 5. Dynamic characteristics Figure 1. Average forward power dissipation versus average forward current Figure 2. Average forward current versus ambient temperature (d = 1) Figure 3. Reverse leakage current versus reverse applied voltage (typical values) Figure 4. Reverse leakage current versus junction temperature (typical values) Figure 5. Junction capacitance versus reverse applied voltage (typical values) Figure 6. Forward voltage drop versus forward current (typical values) Figure 7. Forward voltage drop versus forward current (typical values) Figure 8. Variation of thermal impedance junction to ambient versus pulse duration Figure 9. Relative variation of thermal impedance junction to ambient versus pulse duration Figure 10. Relative variation of thermal impedance junction to ambient versus pulse duration Figure 11. Thermal resistance junction to ambient versus copper surface under each lead 2 Ordering information scheme Figure 12. Ordering information scheme 3 Package information Table 6. SOD-123 dimensions Figure 13. SOD-123 footprint (dimensions in mm) Table 7. SOD-323 dimensions Figure 14. SOD-323 footprint (dimensions in mm) Table 8. SOD-523 dimensions Figure 15. SOD-523 footprint (dimensions in mm) Table 9. SOT-323 dimensions Figure 16. SOT-323 footprint (dimensions in mm) Table 10. SOT-666 dimensions Figure 17. SOT-666 footprint (dimensions in mm) 4 Ordering information Table 11. Ordering information 5 Revision history Table 12. Document revision history
● Epoxy meets UL94, V0 ● Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.
Table 6. SOD-123 dimensions Dimensions Ref. Millimeters Inches H A2 A1 Min. Max. Min. Max. b
A 1.45 0.057
E
A1 0 0.1 0 0.004 A2 0.85 1.35 0.033 0.053
D A
b 0.55 Typ. 0.022 Typ.
c
c 0.15 Typ. 0.039 Typ. D 2.55 2.85 0.1 0.112 E 1.4 1.7 0.055 0.067
G
G 0.25 0.01 H 3.55 3.95 0.14 0.156
Figure 13. SOD-123 footprint (dimensions in mm) 4.45 0.65 0.97 2.51 0.97
6/12 Doc ID 12633 Rev 2 Document Outline Table 1. Device summary 1 Characteristics Table 2. Absolute ratings (limiting values at Tj = 25 ˚C, unless otherwise specified) Table 3. Thermal parameters Table 4. Static electrical characteristics Table 5. Dynamic characteristics Figure 1. Average forward power dissipation versus average forward current Figure 2. Average forward current versus ambient temperature (d = 1) Figure 3. Reverse leakage current versus reverse applied voltage (typical values) Figure 4. Reverse leakage current versus junction temperature (typical values) Figure 5. Junction capacitance versus reverse applied voltage (typical values) Figure 6. Forward voltage drop versus forward current (typical values) Figure 7. Forward voltage drop versus forward current (typical values) Figure 8. Variation of thermal impedance junction to ambient versus pulse duration Figure 9. Relative variation of thermal impedance junction to ambient versus pulse duration Figure 10. Relative variation of thermal impedance junction to ambient versus pulse duration Figure 11. Thermal resistance junction to ambient versus copper surface under each lead 2 Ordering information scheme Figure 12. Ordering information scheme 3 Package information Table 6. SOD-123 dimensions Figure 13. SOD-123 footprint (dimensions in mm) Table 7. SOD-323 dimensions Figure 14. SOD-323 footprint (dimensions in mm) Table 8. SOD-523 dimensions Figure 15. SOD-523 footprint (dimensions in mm) Table 9. SOT-323 dimensions Figure 16. SOT-323 footprint (dimensions in mm) Table 10. SOT-666 dimensions Figure 17. SOT-666 footprint (dimensions in mm) 4 Ordering information Table 11. Ordering information 5 Revision history Table 12. Document revision history