Datasheet MAX25600 (Maxim) - 2
| 制造商 | Maxim |
| 描述 | Synchronous High Voltage 4 Switch Buck Boost LED Controller |
| 页数 / 页 | 24 / 2 — Absolute Maximum Ratings. Package Information. 28-TQFN. PACKAGE CODE. … |
| 文件格式/大小 | PDF / 1.3 Mb |
| 文件语言 | 英语 |
Absolute Maximum Ratings. Package Information. 28-TQFN. PACKAGE CODE. T2855Y+5C. 21-100130. 90-0027
该数据表的模型线
文件文字版本
MAX25600 Synchronous High-Voltage Four-Switch Buck- Boost LED Controller
Absolute Maximum Ratings
IN, UVEN to SGND ...-0.3V to +52V ICTRL, PWM, FB, and FLT to SGND...-0.3V to +6V INN, INP, ISP, ISN, and DIMOUT to PGND ...-0.3V to +65V PGND to SGND ..-0.3V to +0.3V ISP to ISN ...-0.3V to +0.6V VCC Short-Circuit Duration ..Continuous LX1, LX2 to PGND ..-1.0V to +65V Continuous Power Dissipation (TQFN) BST_ to LX_ ..-0.3V to +6V (TA = +70°C, derate, 28.6mW/°C above +70°C) ...2285mW DH_ to LX_ .. -0.3V to VBST+0.3V Continuous Power Dissipation (TSSOP) DL1, DL2 to PGND ... -0.3V to (VVCC+0.3)V (TA = +70°C, derate 27mW/°C above +70°C) ...2162mW CSP, CSN to SGND ..-2.5V to +6V Operating Junction-Temperature Range CSP to CSN ...-0.5V to +0.5V (Note 1, 2)... -40°C to +125°C IOUTV, COMP, RT, SS .. -0.3 to VVCC+0.3 Storage-Temperature Range .. -40°C to +150°C VCC to SGND ..-0.3V to +6V Soldering Temperature (reflow) ...+260°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Package Information 28-TQFN PACKAGE CODE T2855Y+5C
Outline Number
21-100130
Land Pattern Number
90-0027 Thermal Resistance, Single-Layer Board:
Junction to Ambient (θJA) 68°C/W Junction to Case (θJC) 11°C/W
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θJA) 60°C/W Junction to Case (θJC) 11°C/W
28-TSSOP PACKAGE CODE U28E+1C
Outline Number
21-100182
Land Pattern Number
90-100069 Thermal Resistance, Single-Layer Board:
Junction to Ambient (θJA) 78°C/W Junction to Case (θJC) 13°C/W
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θJA) 71.6°C/W Junction to Case (θJC) 13°C/W For the latest package outline information and land patterns (footprints), go to
www.maximintegrated.com/packages
. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial
. www.maximintegrated.com Maxim Integrated │ 2
Absolute Maximum Ratings
IN, UVEN to SGND ...-0.3V to +52V ICTRL, PWM, FB, and FLT to SGND...-0.3V to +6V INN, INP, ISP, ISN, and DIMOUT to PGND ...-0.3V to +65V PGND to SGND ..-0.3V to +0.3V ISP to ISN ...-0.3V to +0.6V VCC Short-Circuit Duration ..Continuous LX1, LX2 to PGND ..-1.0V to +65V Continuous Power Dissipation (TQFN) BST_ to LX_ ..-0.3V to +6V (TA = +70°C, derate, 28.6mW/°C above +70°C) ...2285mW DH_ to LX_ .. -0.3V to VBST+0.3V Continuous Power Dissipation (TSSOP) DL1, DL2 to PGND ... -0.3V to (VVCC+0.3)V (TA = +70°C, derate 27mW/°C above +70°C) ...2162mW CSP, CSN to SGND ..-2.5V to +6V Operating Junction-Temperature Range CSP to CSN ...-0.5V to +0.5V (Note 1, 2)... -40°C to +125°C IOUTV, COMP, RT, SS .. -0.3 to VVCC+0.3 Storage-Temperature Range .. -40°C to +150°C VCC to SGND ..-0.3V to +6V Soldering Temperature (reflow) ...+260°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Package Information 28-TQFN PACKAGE CODE T2855Y+5C
Outline Number
21-100130
Land Pattern Number
90-0027 Thermal Resistance, Single-Layer Board:
Junction to Ambient (θJA) 68°C/W Junction to Case (θJC) 11°C/W
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θJA) 60°C/W Junction to Case (θJC) 11°C/W
28-TSSOP PACKAGE CODE U28E+1C
Outline Number
21-100182
Land Pattern Number
90-100069 Thermal Resistance, Single-Layer Board:
Junction to Ambient (θJA) 78°C/W Junction to Case (θJC) 13°C/W
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θJA) 71.6°C/W Junction to Case (θJC) 13°C/W For the latest package outline information and land patterns (footprints), go to
www.maximintegrated.com/packages
. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial
. www.maximintegrated.com Maxim Integrated │ 2