Datasheet LTM8049 (Analog Devices) - 2
| 制造商 | Analog Devices |
| 描述 | Dual SEPIC or Inverting μModule DC/DC Converter |
| 页数 / 页 | 20 / 2 — ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1). ORDER INFORMATION. … |
| 修订版 | B |
| 文件格式/大小 | PDF / 2.0 Mb |
| 文件语言 | 英语 |
ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1). ORDER INFORMATION. PART MARKING*. PACKAGE. MSL. TEMPERATURE RANGE. PART NUMBER
该数据表的模型线
文件文字版本
LTM8049
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1)
VINn, RUNn, PGn ...20V TOP VIEW SYNCn, FBXn ..5V BANK 2 SSn ..2.5V BANK 4 A VIN1 SHAREn ..2V VOUT1P B RUN1 BANK 1 V GND OUTP (VOUTN = 0V) ..25V FBX1 C SS1 V PG1 OUTN (VOUTP = 0V) ..–25V D SYNC1 BANK 6 Maximum Internal Temperature .. 125°C V CLKOUT1 OUT1N E RT1 Maximum Solder Temperature ..260°C SHARE2 F Storage Temperature.. –55°C to 125°C SHARE1 G RT2 BANK 7 V CLKOUT2 OUT2N H SYNC2 PG2 FBX2 J SS2 K RUN2 BANK 5 VOUT2P BANK 3 L VIN2 1 2 3 4 5 6 7 BGA PACKAGE 77-LEAD (15mm × 9mm × 2.42mm) TJMAX = 125°C, θJA = 16.2°C/W, θJB = 3.8°C/W, θJCtop = 8.8°C/W, θJCbottom = 3.8°C/W, θJCboard = 4.6°C/W, WEIGHT = 0.8g, θ VALUES DETERMINED PER JEDEC 51-9, 51-12
ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTM8049EY#PBF SAC305 (RoHS) LTM8049Y e1 LTM8049IY#PBF BGA 3 –40°C to 125°C LTM8049IY SnPb (63/37) LTM8049 e0 • Device temperature grade is indicated by a label on the shipping container. • This product is not recommended for second side reflow. • Pad or ball finish code is per IPC/JEDEC J-STD-609. This product is moisture sensitive. For more information, go to Recommended BGA PCB Assembly and Manufacturing • BGA Package and Tray Drawings Procedures. Rev B 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Package Photo Revision History Typical Application Related Parts
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1)
VINn, RUNn, PGn ...20V TOP VIEW SYNCn, FBXn ..5V BANK 2 SSn ..2.5V BANK 4 A VIN1 SHAREn ..2V VOUT1P B RUN1 BANK 1 V GND OUTP (VOUTN = 0V) ..25V FBX1 C SS1 V PG1 OUTN (VOUTP = 0V) ..–25V D SYNC1 BANK 6 Maximum Internal Temperature .. 125°C V CLKOUT1 OUT1N E RT1 Maximum Solder Temperature ..260°C SHARE2 F Storage Temperature.. –55°C to 125°C SHARE1 G RT2 BANK 7 V CLKOUT2 OUT2N H SYNC2 PG2 FBX2 J SS2 K RUN2 BANK 5 VOUT2P BANK 3 L VIN2 1 2 3 4 5 6 7 BGA PACKAGE 77-LEAD (15mm × 9mm × 2.42mm) TJMAX = 125°C, θJA = 16.2°C/W, θJB = 3.8°C/W, θJCtop = 8.8°C/W, θJCbottom = 3.8°C/W, θJCboard = 4.6°C/W, WEIGHT = 0.8g, θ VALUES DETERMINED PER JEDEC 51-9, 51-12
ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTM8049EY#PBF SAC305 (RoHS) LTM8049Y e1 LTM8049IY#PBF BGA 3 –40°C to 125°C LTM8049IY SnPb (63/37) LTM8049 e0 • Device temperature grade is indicated by a label on the shipping container. • This product is not recommended for second side reflow. • Pad or ball finish code is per IPC/JEDEC J-STD-609. This product is moisture sensitive. For more information, go to Recommended BGA PCB Assembly and Manufacturing • BGA Package and Tray Drawings Procedures. Rev B 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Package Photo Revision History Typical Application Related Parts