Datasheet ICM7555 (NXP) - 3

制造商NXP
描述General purpose CMOS timer
页数 / 页22 / 3 — NXP Semiconductors. ICM7555. General purpose CMOS timer. Pinning …
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NXP Semiconductors. ICM7555. General purpose CMOS timer. Pinning information. 6.1 Pinning. ICM7555CD. ICM7555CN. ICM7555ID. ICM7555IN

NXP Semiconductors ICM7555 General purpose CMOS timer Pinning information 6.1 Pinning ICM7555CD ICM7555CN ICM7555ID ICM7555IN

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NXP Semiconductors ICM7555 General purpose CMOS timer 6. Pinning information 6.1 Pinning
GND 1 8 VDD GND 1 8 VDD TRIGGER 2 7 DISCHARGE
ICM7555CD
TRIGGER 2
ICM7555CN
7 DISCHARGE
ICM7555ID
OUTPUT 3 6 THRESHOLD
ICM7555IN
OUTPUT 3 6 THRESHOLD RESET 4 5 CONTROL_VOLTAGE RESET 4 5 CONTROL_VOLTAGE 002aae400 002aae401
Fig 2. Pin configuration for SO8 Fig 3. Pin configuration for DIP8 6.2 Pin description Table 2. Pin description Symbol Pin Description
GND 1 supply ground TRIGGER 2 start timer input; (active LOW) OUTPUT 3 timer logic level output RESET 4 timer inhibit input; (active LOW) CONTROL_VOLTAGE 5 timing capacitor upper voltage sense input THRESHOLD 6 timing capacitor lower voltage sense input DISCHARGE 7 timing capacitor discharge output VDD 8 supply voltage
7. Functional description
Refer to Figure 1 “Functional diagram”.
7.1 Function selection Table 3. Function selection THRESHOLD voltage TRIGGER voltage RESET[1] OUTPUT Discharge switch
don’t care don’t care L L on > 2⁄3 V+ > 1⁄3 V+ H L on Vth < 2⁄3 V+ Vtrig > 1⁄3 V+ H stable stable don’t care < 1⁄3 V+ H H off [1] RESET will dominate all other inputs; TRIGGER will dominate over THRESHOLD. ICM7555_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 3 August 2009 3 of 22
Document Outline 1. General description 2. Features 3. Applications 4. Ordering information 5. Functional diagram 6. Pinning information 6.1 Pinning 6.2 Pin description 7. Functional description 7.1 Function selection 8. Limiting values 9. Characteristics 10. Typical performance curves 11. Application information 11.1 General 11.2 Power supply considerations 11.3 Output drive capability 11.4 Astable operation 11.5 Monostable operation 11.6 Control voltage 11.7 RESET 12. Package outline 13. Soldering of SMD packages 13.1 Introduction to soldering 13.2 Wave and reflow soldering 13.3 Wave soldering 13.4 Reflow soldering 14. Soldering of through-hole mount packages 14.1 Introduction to soldering through-hole mount packages 14.2 Soldering by dipping or by solder wave 14.3 Manual soldering 14.4 Package related soldering information 15. Abbreviations 16. Revision history 17. Legal information 17.1 Data sheet status 17.2 Definitions 17.3 Disclaimers 17.4 Trademarks 18. Contact information 19. Contents