Datasheet ICM7555 (NXP) - 10
| 制造商 | NXP |
| 描述 | General purpose CMOS timer |
| 页数 / 页 | 22 / 10 — NXP Semiconductors. ICM7555. General purpose CMOS timer |
| 文件格式/大小 | PDF / 125 Kb |
| 文件语言 | 英语 |
NXP Semiconductors. ICM7555. General purpose CMOS timer
该数据表的模型线
ICM7555
文件文字版本
NXP Semiconductors ICM7555 General purpose CMOS timer
002aae415 102 C (µF) 10 1 10−1 10−2 1 kΩ 10−3 10 kΩ 100 kΩ 1 MΩ 10−4 10 MΩ 10−5 10−1 1 106 105 104 103 102 10 107 f (Hz) VDD = 5 V; Tamb = +25 °C
Fig 12. Free-running frequency as a function of RA, RB resistance and external capacitance
002aae416 102 C (µF) 10 1 kΩ 10 kΩ 1 100 kΩ 1 MΩ 10 MΩ 10−1 10−2 10−3 10−4 10−5 10−7 10−1 10−2 10−3 10−4 10−5 10−6 1 10 td (s) VDD = 5 V; Tamb = +25 °C
Fig 13. Monostable time delay versus RA resistance and external capacitance
ICM7555_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 3 August 2009 10 of 22
Document Outline 1. General description 2. Features 3. Applications 4. Ordering information 5. Functional diagram 6. Pinning information 6.1 Pinning 6.2 Pin description 7. Functional description 7.1 Function selection 8. Limiting values 9. Characteristics 10. Typical performance curves 11. Application information 11.1 General 11.2 Power supply considerations 11.3 Output drive capability 11.4 Astable operation 11.5 Monostable operation 11.6 Control voltage 11.7 RESET 12. Package outline 13. Soldering of SMD packages 13.1 Introduction to soldering 13.2 Wave and reflow soldering 13.3 Wave soldering 13.4 Reflow soldering 14. Soldering of through-hole mount packages 14.1 Introduction to soldering through-hole mount packages 14.2 Soldering by dipping or by solder wave 14.3 Manual soldering 14.4 Package related soldering information 15. Abbreviations 16. Revision history 17. Legal information 17.1 Data sheet status 17.2 Definitions 17.3 Disclaimers 17.4 Trademarks 18. Contact information 19. Contents
002aae415 102 C (µF) 10 1 10−1 10−2 1 kΩ 10−3 10 kΩ 100 kΩ 1 MΩ 10−4 10 MΩ 10−5 10−1 1 106 105 104 103 102 10 107 f (Hz) VDD = 5 V; Tamb = +25 °C
Fig 12. Free-running frequency as a function of RA, RB resistance and external capacitance
002aae416 102 C (µF) 10 1 kΩ 10 kΩ 1 100 kΩ 1 MΩ 10 MΩ 10−1 10−2 10−3 10−4 10−5 10−7 10−1 10−2 10−3 10−4 10−5 10−6 1 10 td (s) VDD = 5 V; Tamb = +25 °C
Fig 13. Monostable time delay versus RA resistance and external capacitance
ICM7555_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 3 August 2009 10 of 22
Document Outline 1. General description 2. Features 3. Applications 4. Ordering information 5. Functional diagram 6. Pinning information 6.1 Pinning 6.2 Pin description 7. Functional description 7.1 Function selection 8. Limiting values 9. Characteristics 10. Typical performance curves 11. Application information 11.1 General 11.2 Power supply considerations 11.3 Output drive capability 11.4 Astable operation 11.5 Monostable operation 11.6 Control voltage 11.7 RESET 12. Package outline 13. Soldering of SMD packages 13.1 Introduction to soldering 13.2 Wave and reflow soldering 13.3 Wave soldering 13.4 Reflow soldering 14. Soldering of through-hole mount packages 14.1 Introduction to soldering through-hole mount packages 14.2 Soldering by dipping or by solder wave 14.3 Manual soldering 14.4 Package related soldering information 15. Abbreviations 16. Revision history 17. Legal information 17.1 Data sheet status 17.2 Definitions 17.3 Disclaimers 17.4 Trademarks 18. Contact information 19. Contents