Datasheet DA9121 (Dialog Semiconductor) - 6

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DA9121 High-Performance, 10 A, Dual-Phase DC-DC Converter 2 Pinout Figure 4: DA9121 Pinout Diagram (Top View) Table 1: Pin Description Type Drive Reset Pin No. Pin Name Description (Table 2) (mA) State
Supply voltage for buck power stage, decouple A1, B1 PVDD1 PWR 5000 with 10 µF and connect to same source as AVDD Switch node of buck, connect a 100 nH inductor A2, B2 LX1 AIO 5000 between LX1 and output capacitor A3, B3 PGND1 GND 5000 Buck power stage VSS rail A4, B4 PGND2 GND 5000 Buck power stage VSS rail Switch node of buck, connect a 100 nH inductor A5, B5 LX2 AIO 5000 between LX1 and output capacitor Supply voltage for buck power stage, decouple A6, B6 PVDD2 PWR 5000 with 10 µF and connect to same source as AVDD C1 SCL/GPIO3 DIO 15 I2C clock or general purpose I/O C2 SDA/GPIO4 DIO 15 I2C data or general purpose I/O Powers up SW control interface and auxiliary C3 IC_EN AI 10 circuitry (including bandgap, oscillator, and references). C4 CONF/GPIO0 AI/DIO 10 Chip configuration or general purpose I/O C5 GPIO1 DIO 10 General purpose I/O C6 GPIO2 DIO 10 General purpose I/O Buck negative node of differential voltage D1 FB1N AI 10 feedback, connect to VSS at point of load Buck positive node of differential voltage D2 FB1P AI 10 feedback, connect to VOUT1 at point of load Supply rail for analog control circuitry, decouple D3 AVDD PWR 10 with 1 µF and connect to same source as PVDD
Datasheet Revision 2.0 18-Jul-2019
CFR0011-120-00 6 of 47 © 2019 Dialog Semiconductor Document Outline General Description Key Features Applications System Diagrams Contents 1 Terms and Definitions 2 Pinout 3 Characteristics 3.1 Absolute Maximum Ratings 3.2 Recommended Operating Conditions 3.3 Thermal Characteristics 3.3.1 Thermal Ratings 3.3.2 Power Dissipation 3.4 ESD Characteristics 3.5 Buck Characteristics 3.6 Performance and Supervision Characteristics 3.7 Digital IO Characteristics 3.8 Timing Characteristics 3.9 Typical Performance 4 Functional Description 4.1 DC-DC Buck Converter 4.1.1 Switching Frequency 4.1.2 Operation Modes and Phase Selection 4.1.3 Output Voltage Selection 4.1.4 Soft Start-Up and Shutdown 4.1.5 Current Limit 4.1.6 Thermal Protection 4.2 Internal Circuits 4.2.1 IC_EN/Chip Enable/Disable 4.2.2 nIRQ/Interrupt 4.2.3 GPIO 4.2.3.1 GPIO Pin Assignment 4.2.3.2 GPIO Function 4.2.3.3 Chip Configuration Select (CONF) 4.3 Operating Modes 4.3.1 ON 4.3.2 OFF 4.4 I2C Communication 4.4.1 I2C Protocol 5 Register Definitions 5.1 Register Map 5.1.1 System 5.1.2 Buck1 5.1.3 Serialization 6 Package Information 6.1 Package Outlines 6.2 Moisture Sensitivity Level 6.3 WLCSP Handling 6.4 Soldering Information 7 Ordering Information 8 Application Information 8.1 Capacitor Selection 8.2 Inductor Selection