Datasheet DA9121 (Dialog Semiconductor) - 9
| 制造商 | Dialog Semiconductor |
| 描述 | High-Performance, 10 A, Dual-Phase DC-DC Converter |
| 页数 / 页 | 47 / 9 — DA9121. High-Performance, 10 A, Dual-Phase DC-DC Converter. 3.3. Thermal … |
| 文件格式/大小 | PDF / 1.4 Mb |
| 文件语言 | 英语 |
DA9121. High-Performance, 10 A, Dual-Phase DC-DC Converter. 3.3. Thermal Characteristics. 3.3.1. Thermal Ratings
该数据表的模型线
文件文字版本
link to page 9
DA9121 High-Performance, 10 A, Dual-Phase DC-DC Converter 3.3 Thermal Characteristics 3.3.1 Thermal Ratings Table 5: Package Ratings Parameter Description Conditions Min Typ Max Unit
JA Package thermal resistance 32.7 °C/W Note 1
Note 1
Obtained from package thermal simulation, 2S2P4L board (JEDEC), influenced by PCB technology and layout.
3.3.2 Power Dissipation Table 6: Power Dissipation Parameter Description Conditions Min Typ Max Unit
Derating factor above T P A = D Power dissipation 2140 mW 70°C : 30.6 mW/°C (1/θJA) 4.0 3.5
P = (T - T ) / θ D J A JA θ = 32.7 °C/W JA Still air (0 m/s)
3.0
▲T = 125 °C J(WARN)
◆
T = 140 °C J(CRIT)
2.5
) W(
2.0
DP
1.5 1.0 0.5 0.0 20 30 40 50 60 70 80 90 100 110 120 130 140
T (°C) A Figure 5: 24WLCSP Power Derating Curve 3.4 ESD Characteristics Table 7: ESD Characteristics Parameter Description Conditions Min Typ Max Unit
ESD protection, human VESD_HBM 2 kV body model (HBM)
Datasheet Revision 2.0 18-Jul-2019
CFR0011-120-00 9 of 47 © 2019 Dialog Semiconductor Document Outline General Description Key Features Applications System Diagrams Contents 1 Terms and Definitions 2 Pinout 3 Characteristics 3.1 Absolute Maximum Ratings 3.2 Recommended Operating Conditions 3.3 Thermal Characteristics 3.3.1 Thermal Ratings 3.3.2 Power Dissipation 3.4 ESD Characteristics 3.5 Buck Characteristics 3.6 Performance and Supervision Characteristics 3.7 Digital IO Characteristics 3.8 Timing Characteristics 3.9 Typical Performance 4 Functional Description 4.1 DC-DC Buck Converter 4.1.1 Switching Frequency 4.1.2 Operation Modes and Phase Selection 4.1.3 Output Voltage Selection 4.1.4 Soft Start-Up and Shutdown 4.1.5 Current Limit 4.1.6 Thermal Protection 4.2 Internal Circuits 4.2.1 IC_EN/Chip Enable/Disable 4.2.2 nIRQ/Interrupt 4.2.3 GPIO 4.2.3.1 GPIO Pin Assignment 4.2.3.2 GPIO Function 4.2.3.3 Chip Configuration Select (CONF) 4.3 Operating Modes 4.3.1 ON 4.3.2 OFF 4.4 I2C Communication 4.4.1 I2C Protocol 5 Register Definitions 5.1 Register Map 5.1.1 System 5.1.2 Buck1 5.1.3 Serialization 6 Package Information 6.1 Package Outlines 6.2 Moisture Sensitivity Level 6.3 WLCSP Handling 6.4 Soldering Information 7 Ordering Information 8 Application Information 8.1 Capacitor Selection 8.2 Inductor Selection
DA9121 High-Performance, 10 A, Dual-Phase DC-DC Converter 3.3 Thermal Characteristics 3.3.1 Thermal Ratings Table 5: Package Ratings Parameter Description Conditions Min Typ Max Unit
JA Package thermal resistance 32.7 °C/W Note 1
Note 1
Obtained from package thermal simulation, 2S2P4L board (JEDEC), influenced by PCB technology and layout.
3.3.2 Power Dissipation Table 6: Power Dissipation Parameter Description Conditions Min Typ Max Unit
Derating factor above T P A = D Power dissipation 2140 mW 70°C : 30.6 mW/°C (1/θJA) 4.0 3.5
P = (T - T ) / θ D J A JA θ = 32.7 °C/W JA Still air (0 m/s)
3.0
▲T = 125 °C J(WARN)
◆
T = 140 °C J(CRIT)
2.5
) W(
2.0
DP
1.5 1.0 0.5 0.0 20 30 40 50 60 70 80 90 100 110 120 130 140
T (°C) A Figure 5: 24WLCSP Power Derating Curve 3.4 ESD Characteristics Table 7: ESD Characteristics Parameter Description Conditions Min Typ Max Unit
ESD protection, human VESD_HBM 2 kV body model (HBM)
Datasheet Revision 2.0 18-Jul-2019
CFR0011-120-00 9 of 47 © 2019 Dialog Semiconductor Document Outline General Description Key Features Applications System Diagrams Contents 1 Terms and Definitions 2 Pinout 3 Characteristics 3.1 Absolute Maximum Ratings 3.2 Recommended Operating Conditions 3.3 Thermal Characteristics 3.3.1 Thermal Ratings 3.3.2 Power Dissipation 3.4 ESD Characteristics 3.5 Buck Characteristics 3.6 Performance and Supervision Characteristics 3.7 Digital IO Characteristics 3.8 Timing Characteristics 3.9 Typical Performance 4 Functional Description 4.1 DC-DC Buck Converter 4.1.1 Switching Frequency 4.1.2 Operation Modes and Phase Selection 4.1.3 Output Voltage Selection 4.1.4 Soft Start-Up and Shutdown 4.1.5 Current Limit 4.1.6 Thermal Protection 4.2 Internal Circuits 4.2.1 IC_EN/Chip Enable/Disable 4.2.2 nIRQ/Interrupt 4.2.3 GPIO 4.2.3.1 GPIO Pin Assignment 4.2.3.2 GPIO Function 4.2.3.3 Chip Configuration Select (CONF) 4.3 Operating Modes 4.3.1 ON 4.3.2 OFF 4.4 I2C Communication 4.4.1 I2C Protocol 5 Register Definitions 5.1 Register Map 5.1.1 System 5.1.2 Buck1 5.1.3 Serialization 6 Package Information 6.1 Package Outlines 6.2 Moisture Sensitivity Level 6.3 WLCSP Handling 6.4 Soldering Information 7 Ordering Information 8 Application Information 8.1 Capacitor Selection 8.2 Inductor Selection