Datasheet TSSP950 (Vishay) - 5
| 制造商 | Vishay |
| 描述 | IR Sensor Module for Reflective Sensor, Light Barrier, and Fast Proximity Applications |
| 页数 / 页 | 11 / 5 — TSSP950.. PACKAGE DIMENSIONS. ASSEMBLY INSTRUCTIONS Reflow Soldering. … |
| 文件格式/大小 | PDF / 360 Kb |
| 文件语言 | 英语 |
TSSP950.. PACKAGE DIMENSIONS. ASSEMBLY INSTRUCTIONS Reflow Soldering. Manual Soldering
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TSSP950..
www.vishay.com Vishay Semiconductors
PACKAGE DIMENSIONS
in millimeters 6.8 6.6 ± 0.1 3.2 (3.4) Mold residue Mold residue 2.2 2.5 0.8 3 (1.8) 1.2 ± 0.2 (0.635) (1) 1.27 (3 x) 0.5 ± 0.1 (4 x) technical drawings 3 x 1.27 = 3.81 according to DIN specifications Marking area (2.2) Tool separation line Not indicated tolerances ± 0.15 Proposed pad layout from component side 2.2 (for reference only) (1.65) 3 x 1.27 = 3.81 1.27 (R1.3) Pick and place area 1.8 Drawing-No.: 6.550-5297.01-4 Issue: 4; 13.09.11 0.8 22608
ASSEMBLY INSTRUCTIONS Reflow Soldering Manual Soldering
• Reflow soldering must be done within 72 h while stored • Use a soldering iron of 25 W or less. Adjust the under a max. temperature of 30 °C, 60 % RH after temperature of the soldering iron below 300 °C opening the dry pack envelope • Finish soldering within 3 s • Set the furnace temperatures for pre-heating and heating • Handle products only after the temperature has cooled off in accordance with the reflow temperature profile as shown in the diagram. Exercise extreme care to keep the maximum temperature below 260 °C. The temperature shown in the profile means the temperature at the device surface. Since there is a temperature difference between the component and the circuit board, it should be verified that the temperature of the device is accurately being measured • Handling after reflow should be done only after the work surface has been cooled off Rev. 1.1, 17-Apr-2019
5
Document Number: 82867 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
www.vishay.com Vishay Semiconductors
PACKAGE DIMENSIONS
in millimeters 6.8 6.6 ± 0.1 3.2 (3.4) Mold residue Mold residue 2.2 2.5 0.8 3 (1.8) 1.2 ± 0.2 (0.635) (1) 1.27 (3 x) 0.5 ± 0.1 (4 x) technical drawings 3 x 1.27 = 3.81 according to DIN specifications Marking area (2.2) Tool separation line Not indicated tolerances ± 0.15 Proposed pad layout from component side 2.2 (for reference only) (1.65) 3 x 1.27 = 3.81 1.27 (R1.3) Pick and place area 1.8 Drawing-No.: 6.550-5297.01-4 Issue: 4; 13.09.11 0.8 22608
ASSEMBLY INSTRUCTIONS Reflow Soldering Manual Soldering
• Reflow soldering must be done within 72 h while stored • Use a soldering iron of 25 W or less. Adjust the under a max. temperature of 30 °C, 60 % RH after temperature of the soldering iron below 300 °C opening the dry pack envelope • Finish soldering within 3 s • Set the furnace temperatures for pre-heating and heating • Handle products only after the temperature has cooled off in accordance with the reflow temperature profile as shown in the diagram. Exercise extreme care to keep the maximum temperature below 260 °C. The temperature shown in the profile means the temperature at the device surface. Since there is a temperature difference between the component and the circuit board, it should be verified that the temperature of the device is accurately being measured • Handling after reflow should be done only after the work surface has been cooled off Rev. 1.1, 17-Apr-2019
5
Document Number: 82867 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000