Datasheet BM83 (Microchip) - 7

BM83 Quick References ...continued Acronyms/Abbreviations Description
CVSD Continuous Variable Slope Delta DAC Digital-to-Analog Converter DFU Device Firmware Upgrade DIS Device Information Service DLE Data Length Extension DPSK Differential Phase Shift Keying DQPSK Differential Quadrature Phase Shift Keying DR Receive Data DSP Digital Signal Processor DT Transmit Data EDR Enhanced Data Rate EMC Electromagnetic Compatibility EVB Evaluation Board FET Field Effect Transistor GAP General Access Profile GATT General Attribute Profile GFSK Gaussian Frequency Shift Keying GPIO General Purpose Input Output GUI Graphical User Interface HFP Hands-free Profile HPF High Pass Filter HSP Headset Profile HW Hardware I2C Inter-Integrated Circuit I2S Inter-IC Sound IC Integrated Circuit ICSP In-Circuit Serial Programming IDE Integrated Development Environment IF Intermediate Frequency IPE Integrated Programming Environment JTAG Joint Test Action Group LDO Low-Dropout LED Light Emitting Diode LNA Low-Noise Amplifier LPA Linear Power Amplifier LSB Least Significant Bit MAC Medium Access Control MB DRC Multiband Dynamic Range Compression MCLK Master Clock MCU Microcontroller © 2019 Microchip Technology Inc.
Datasheet
DS70005402B-page 7 Document Outline Introduction Features Table of Contents 1. Quick References 1.1. Reference Documentation 1.2. Design Packages 1.3. Acronyms/Abbreviations 2. Device Overview 2.1. BM83 Module Pin Diagram 2.2. BM83 Module Pin Description 3. Audio Subsystem 3.1. Digital Signal Processor 3.2. Codec 3.2.1. DAC Performance 3.2.2. ADC Performance 3.3. Auxiliary Port 3.4. Analog Speaker Output 3.5. Microphone Inputs 4. Bluetooth Transceiver 4.1. Transmitter 4.2. Receiver 4.3. Synthesizer 4.4. Modulator-Demodulator 4.5. Adaptive Frequency Hopping 5. Power Management Unit 5.1. Power Supply 5.2. SAR ADC 5.3. LED Drivers 6. Application Information 6.1. Power On/Off Sequence 6.2. Reset 6.3. Configuring and Programming 6.3.1. Test Mode 6.3.2. 2-wire JTAG Program and Debug 6.3.2.1. Serial Program Clock (TCK_CPU) 6.3.2.2. Serial Program Data (TDI_CPU) 6.4. General Purpose I/O Pins 6.5. I2S Interface 6.6. Host MCU Interface Over UART 7. PCB Antenna Information 7.1. Antenna Radiation Pattern 7.2. Module Placement Guidelines 8. Physical Dimensions 9. Electrical Specifications 9.1. Timing Specifications 10. Soldering Recommendations 11. Ordering Information 12. Appendix A: Regulatory Approval 12.1. United States 12.1.1. Labeling and User Information Requirements 12.1.2. RF Exposure 12.1.3. Helpful Web Sites 12.2. Canada 12.2.1. Labeling and User Information Requirements 12.2.2. RF Exposure 12.2.3. Helpful Web Sites 12.3. Europe 12.3.1. Labeling and User Information Requirements 12.3.2. Conformity Assessment 12.3.2.1. Simplified EU Declaration of Conformity 12.3.3. Helpful Websites 12.4. Japan 12.4.1. Labeling and User Information Requirements 12.4.2. Helpful Web Sites 12.5. Korea 12.5.1. Labeling and User Information Requirements 12.5.2. Helpful Websites 12.6. Taiwan 12.6.1. Labeling and User Information Requirements 12.6.2. Helpful Web Sites 12.7. China 12.7.1. Labeling and User Information Requirements 12.8. Other Regulatory Information 13. Document Revision History The Microchip Website Product Change Notification Service Customer Support Microchip Devices Code Protection Feature Legal Notice Trademarks Quality Management System Worldwide Sales and Service