Datasheet TS Series (Littelfuse) - 4
制造商 | Littelfuse |
描述 | PolySwitch® Resettable PPTCs |
页数 / 页 | 11 / 4 — PolySwitch® Resettable PTCs. TS250/TSV250/TSM250/TSL250 – Physical … |
文件格式/大小 | PDF / 1.1 Mb |
文件语言 | 英语 |
PolySwitch® Resettable PTCs. TS250/TSV250/TSM250/TSL250 – Physical Specifications. Terminal Material
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文件文字版本
PolySwitch® Resettable PTCs
Telecom > Surface Mount > TS Series
TS250/TSV250/TSM250/TSL250 – Physical Specifications
Tin-plated Brass, Nickel Under-plating (TS250/TSV250/TSL250)
Terminal Material
Tin-plated Copper (TSM250)
Soldering Characteristics
IEC 60068-2-58
Note:
Devices are not intended to be placed through a reflow process.
TS250/TSV250/TSM250/TSL250 – Environmental Specifications Test Conditions
60°C, 1000 hrs
Passive Aging
85°C, 1000 hrs
Humidity Aging
85°C, 85% R.H., 500 hrs
Thermal Shock
125°C, -55°C (10 Times)
Solvent Resistance
MIL-STD-202, Method 215F
Moisture Resistance Level
Level 1, J-STD-020 40°C max, 70% RH max; devices should remain in original sealed bags prior to use.
Storage Conditions
Devices may not meet specified values if these storage conditions are exceeded.
TS600 – Physical Specifications Terminal Material
Tin-plated Brass
Insulating Material
Nylon Resin (UL94V-0), 1000V Dielectric Rating
Soldering Characteristics
ANSI/J-STD-002, Category 3
Solder Heat Withstand
IEC 60068-2-58, Test Tb, Section 8
TS600 – Environmental Specifications Test Conditions
60°C, 1000 hrs
Passive Aging
85°C, 1000 hrs
Humidity Aging
85°C, 85% R.H., 1000 hrs
Thermal Shock
125°C, -55°C (10 Times)
Solvent Resistance
MIL-STD-202, Method 215F
Moisture Resistance Level
Level 1, J-STD-020 40°C max, 70% RH max; devices should remain in original sealed bags prior to use.
Storage Conditions
Devices may not meet specified values if these storage conditions are exceeded. © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/27/19