Datasheet TS Series (Littelfuse) - 5

PolySwitch® Resettable PPTCs
Telecom > Surface Mount > TS Series
TSM600 – Physical Specifications Terminal Material
Tin-plated Brass
Insulating Material
Nylon Resin (UL94V-0), 1000V Dielectric Rating
Soldering Characteristics
IEC 60068-2-58, Method 7
Solder Heat Withstand
IEC 60068-2-58, Test Tb, Section 5 Method 1a
TSM600 – Environmental Specifications Test Conditions
60°C, 1000 hrs
Passive Aging
85°C, 1000 hrs
Humidity Aging
85°C, 85% R.H., 1000 hrs
Thermal Shock
125°C, -55°C (10 Times)
Solvent Resistance
MIL-STD-202, Method 215J
Moisture Resistance Level
Level 2A, J-STD-020 40°C max, 70% RH max; devices should remain in original sealed bags prior to use.
Storage Conditions
Devices may not meet specified values if these storage conditions are exceeded.
Solder Reflow Recommendations
tp
Profile Feature Pb-Free Assembly
Tp Critical Zone Ramp Up T to Tp L
Average ramp up rate (Ts to Tp)
3°C/s max
MAX
T L Ts t
Preheat
MAX L
e
• Temperature min (Ts ) 150°C
ur
MIN TsMIN
at
• Temperature max (Ts ) 200°C MAX ts Ramp Down Preheat
Temper
• Time (ts to ts ) 60-180 s MIN MAX 25
Time maintained above:
t 25˚C to Peak Reflow Profile
Time
• Temperature (T ) 217°C L • Time (t ) 60-150 s
Solder Reflow
L • Recommended reflow method: IR, vapor phase oven, hot air oven.
Peak/Classification temperature (Tp)
260°C • Surface-mount devices are not intended to be wave soldered to
Time within 5°C of actual peak temperature
the bottom side of the board. • Recommended maximum paste thickness of 0.25mm (0.010in). Time (tp) 20-40 s • Devices can be cleaned using standard industry methods and solvents.
Ramp down rate
6°C/s max
Rework Time 25°C to peak temperature
8min max • If a device is removed from the board, it should be discarded
Note:
All temperatures refer to topside of the package, measured on the package body and replaced with a new device. surface. © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 06/05/19