Datasheet MIC4609 (Microchip) - 9

MIC4609 2.0 TYPICAL PERFORMANCE CURVES Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note:
Unless otherwise indicated, TA = +25°C with 10V  VDD  20V.
140 50 V = GND V = GND HS HS EN = V EN = V (μA) 120 DD 125°C DD (μA) 40 100 V = 20V HB V = 14V HB 30 80 60 25°C 20 -40°C 40 iescent Current Quiescent Current u Q 10 DD 20 V HBV V = 10V HB 0 0 10 11 12 13 14 15 16 17 18 19 20 -50 -25 0 25 50 75 100 125 V (V) Temperature (°C) DD FIGURE 2-1:
VDD Quiescent Current vs.
FIGURE 2-4:
VHB Quiescent Current vs. VDD Voltage. Temperature.
140 10 120 V = 20V DD (μA) (μA) 1 HI = LI = 0V 100 V = Floating HS 125°C EN = 0V 80 V = V DD HB n Current 0.1 60 V = 15V -40°C iescent Current 40 DD u V = 10V 0.01 DD Shutdow Q 20 B DD V = GND +H V HS EN = V DD 25°C 0 DD V 0.001 -50 -25 0 25 50 75 100 125 10 11 12 13 14 15 16 17 18 19 20 Temperature (°C) V (V) DD+HB FIGURE 2-2:
VDD Quiescent Current vs.
FIGURE 2-5:
VDD+HB Shutdown Current Temperature. vs. Voltage.
50 10 V = GND HS ) EN = VDD (μA) 40 1 125°C 30 0.1 V = 20V DD n Current V = 15V DD 20 0.01 25°C Shutdow HI = LI = 0V 10 Quiescent Current (μA -40°C B 0.001 V = Floating HS +H V = 10V DD EN = 0V HBV DD V = V DD HB 0 V 0.0001 10 12 14 16 18 20 -50 -25 0 25 50 75 100 125 V (V) Temperature (°C) HB FIGURE 2-3:
VHB Quiescent Current vs.
FIGURE 2-6:
VDD+HB Shutdown Current VHB Voltage. vs. Temperature.  2016-2019 Microchip Technology Inc. DS20005531C-page 9 Document Outline 600V 3-Phase MOSFET/IGBT Driver Features Typical Applications General Description Package Type Functional Block Diagram MIC4609 – Top Level Circuit Functional Block Diagram MIC4609 – Phase x Drive Circuit Typical Application Circuit MIC4609 – 300V, 3-Phase Motor Driver 1.0 Electrical Characteristics Absolute Maximum Ratings Operating Ratings AC/DC Electrical Characteristics Temperature Characteristics 2.0 Typical Performance Curves FIGURE 2-1: VDD Quiescent Current vs. VDD Voltage. FIGURE 2-2: VDD Quiescent Current vs. Temperature. FIGURE 2-3: VHB Quiescent Current vs. VHB Voltage. FIGURE 2-4: VHB Quiescent Current vs. Temperature. FIGURE 2-5: VDD+HB Shutdown Current vs. Voltage. FIGURE 2-6: VDD+HB Shutdown Current vs. Temperature. FIGURE 2-7: VDD+HB Shutdown Current vs. Voltage. FIGURE 2-8: VDD+HB Shutdown Current vs. Temperature. FIGURE 2-9: VDD Operating Current vs. Frequency. FIGURE 2-10: VHB Operating Current vs. Frequency – One Phase. FIGURE 2-11: HO Output Sink ON-Resistance vs. VDD. FIGURE 2-12: HO Output Sink ON-Resistance vs. Temperature. FIGURE 2-13: LO Output Sink ON-Resistance vs. VDD. FIGURE 2-14: LO Output Sink ON-Resistance vs. Temperature. FIGURE 2-15: HO Output Source ON-Resistance vs. VDD. FIGURE 2-16: HO Output Source ON-Resistance vs. Temperature. FIGURE 2-17: LO Output Source ON-Resistance vs. VDD. FIGURE 2-18: LO Output Source ON-Resistance vs. Temperature. FIGURE 2-19: VDD/VHB ULVO vs. Temperature. FIGURE 2-20: Propagation Delay vs. VDD Voltage. FIGURE 2-21: Propagation Delay vs. Temperature. FIGURE 2-22: HO Rise Time vs. VDD Voltage. FIGURE 2-23: HO Fall Time vs. VDD Voltage. FIGURE 2-24: LO Rise Time vs. VDD Voltage. FIGURE 2-25: LO Fall Time vs. VDD Voltage. FIGURE 2-26: Rise/Fall Time vs. Temperature (VDD = 10V). FIGURE 2-27: Rise/Fall Time vs. Temperature (VDD = 20V). FIGURE 2-28: Dead Time vs. VDD Voltage. FIGURE 2-29: Dead Time vs. Temperature (VDD = 10V). FIGURE 2-30: Dead Time vs. Temperature (VDD = 20V). FIGURE 2-31: Overcurrent Threshold vs. VDD Voltage. FIGURE 2-32: Overcurrent Threshold vs. Temperature. FIGURE 2-33: Overcurrent Propagation Delay vs. VDD Voltage. FIGURE 2-34: Overcurrent Propagation Delay vs. Temperature. 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 4.0 Functional Description 4.1 UVLO Protection 4.2 Startup and UVLO FIGURE 4-1: Startup and Fault Timing Diagram. TABLE 4-1: Operational Truth Table 4.3 Enable Inputs 4.4 Input Stage FIGURE 4-2: Input Stage Block Diagram. FIGURE 4-3: Minimum Pulse-Width Diagram. 4.5 Dead Time and Anti-Shoot-Through Protection FIGURE 4-4: Dead Time, Propagation Delay, and Rise/Fall-Time Diagram. 4.6 Low-Side Driver Output Stage FIGURE 4-5: Low-Side Driver Block Diagram. 4.7 High-Side Driver and Bootstrap Circuit FIGURE 4-6: High-Side Driver and Bootstrap Circuit Block Diagram. FIGURE 4-7: MIC4609 Motor Driver Typical Application – Phase A. 4.8 Overcurrent Protection Circuitry FIGURE 4-8: Overcurrent Fault Sequence. 5.0 Application Information 5.1 Bootstrap Circuit FIGURE 5-1: MIC4609 – Bootstrap Circuit. 5.2 HS Node Clamp FIGURE 5-2: Negative HS Pin Voltage. 5.3 Power Dissipation Considerations FIGURE 5-3: MIC4609 High-Side Driving an External IGBT. FIGURE 5-4: Typical Gate Charge vs. VGE. 5.4 Decoupling Capacitor Selection 5.5 Grounding, Component Placement, and Circuit Layout FIGURE 5-5: Turn-On Current Paths. FIGURE 5-6: Turn-Off Current Paths. 6.0 Packaging Information 6.1 Package Marking Information 28-Lead SOICW Package Outline and Recommended Land Pattern Appendix A: Revision History Revision C (September 2019) Revision B (November 2017) Revision A (March 2016) Product Identification System Trademark Worldwide Sales and Service