Datasheet BTA24, BTB24, BTA25 BTA26, BTB26, T25 (STMicroelectronics)

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BTA24, BTB24, BTA25 BTA26, BTB26, T25
25 A standard and Snubberless™ triacs
Features A2
■ High current triac ■ Low thermal resistance with clip bonding
G
■ High commutation (4 quadrant) or very high
A1 A2
commutation (3 quadrant) capability ■ BTA series UL1557 certified (File ref: 81734) ■ Packages are RoHS (2002/95/EC) compliant
A1A2 A1 G A2G Applications TO-220AB Insulated TO-220AB (BTA24) (BTB24)
Applications include the ON/OFF function in
A1
applications such as static relays, heating
G A2
regulation, induction motor starting circuits, etc., or for phase control operation in light dimmers, motor speed controllers, and silmilar.
A1 A2 G
The snubberless versions (BTA/BTB...W and T25
RD91 TOP3 Insulated
series) are especially recommended for use on
(BTA25) (BTA26)
inductive loads, due to their high commutation performances. The BTA series provides an A2 insulated tab (rated at 2500 V
A2
RMS).
Description A1 A2 G A1 A2
Available either in through-hole or surface-mount
G
packages, the
BTA24, BTB24, BTA25, BTA26, D2PAK TOP3 (T25) BTB26
and
T25
triac series is suitable for general
(BTB26)
purpose mains power AC switching.
Table 1. Device summary Symbol Parameter BTA24(1) BTB24 BTA25(1) BTA26(1) BTB26 T25 Unit
RMS on-state IT(RMS) 25 25 25 25 25 25 A current Repetitive peak VDRM/VRRM 600 / 800 600 / 800 600 / 800 600(2) / 800 600 600 / 800 V off-state voltage Triggering gate IGT (Snubberless) 35 / 50 35 / 50 50 35 / 50 - 35 mA current Triggering gate IGT (Standard) - 50 50 50 50 - mA current 1. Insulated packages 2. 600 V version available only with IGT = 50 mA (Snubberless and Standard) TM: Snubberless is a trademark of STMicroelectronics July 2007 Rev 10 1/12 www.st.com 12 Document Outline Table 1. Device summary 1 Characteristics Table 2. Absolute maximum ratings Table 3. Electrical characteristics (Tj = 25˚ C, unless otherwise specified), Snubberless and logic level (3 quadrants) T25, BTA/BTB24...W, BTA25...W, BTA26...W Table 4. Electrical characteristics (Tj = 25˚ C, unless otherwise specified), standard (4 quadrants), BTB24...B, BTA25...B, BTA26...B, BTB26...B Table 5. Static characteristics Table 6. Thermal resistance Figure 1. Maximum power dissipation versus RMS on-state current (full cycle) Figure 2. RMS on-state current versus case temperature (full cycle) Figure 3. D2PAK RMS on-state current versus ambient temperature (printed circuit board FR4, copper thickness: 35µm) (full cycle) Figure 4. Relative variation of thermal impedance versus pulse duration Figure 5. On-state characteristics (maximum values) Figure 6. Surge peak on-state current versus number of cycles Figure 7. Non-repetitive surge peak on-state current for a sinusoidal pulse with width tp < 10 ms and corresponding value of I2t Figure 8. Relative variation of gate trigger current, holding current and latching current versus junction temperature (typical values) Figure 9. Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values) Figure 10. Relative variation of critical rate of decrease of main current versus Tj Figure 11. D2PAK thermal resistance junction to ambient versus copper surface under tab (printed circuit board FR4, copper thickness: 35 µm) 2 Ordering information scheme Figure 12. BTA and BTB series Figure 13. T25 series 3 Package information Table 7. D2PAK dimensions Figure 14. D2PAK footprint dimensions (in millimeters) Table 8. RD91 dimensions Table 9. TOP3 (insulated and non_insulated) dimensions Table 10. TO-220AB (insulated and non-insulated) dimensions 4 Ordering information Table 11. Ordering information 5 Revision history Table 12. Revision history