Datasheet PCMFxUSB3BA/C (Nexperia)
| 制造商 | Nexperia |
| 描述 | Common-mode EMI filter for differential channels with integrated bidirectional ESD protection |
| 页数 / 页 | 15 / 1 — PCMFxUSB3BA/C series. Common-mode EMI filter for differential channels … |
| 修订版 | 14082019 |
| 文件格式/大小 | PDF / 857 Kb |
| 文件语言 | 英语 |
PCMFxUSB3BA/C series. Common-mode EMI filter for differential channels with. integrated bidirectional ESD protection
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PCMFxUSB3BA/C series Common-mode EMI filter for differential channels with integrated bidirectional ESD protection Rev. 2 — 14 August 2019 Product data sheet 1. General description
Common-mode ElectroMagnetic Interference (EMI) filters with integrated bidirectional ElectroStatic Discharge (ESD) protection for one, two and three dif erential channels. The devices are designed to provide low insertion loss for dif erential high-speed signals on each channel while unwanted common-mode signals are attenuated. Each dif erential channel incorporates two signal lines that are coupled by integrated coils. Diodes provide protection to downstream components from ESD voltages up to ±15 kV on each signal line.
Table 1. Product overview Type number Number of channels Package Name
PCMF1USB3BA/C 1 WLCSP5 PCMF2USB3BA/C 2 WLCSP10 PCMF3USB3BA/C 3 WLCSP15
2. Features and benefits
• One, two and three dif erential channels common-mode EMI filters with integrated ESD protection • ESD protection up to ±15 kV contact discharge according to IEC 61000-4-2 • Superior common-mode suppression over a wide frequency range • Superior RF performance compared to other integrated filters or discrete filters with external ESD protection • Extremely high symmetry between line pairs • Industry-standard Wafer-Level Chip-Scale Packages: WLCSP5, 10 and 15 for smal er footprint
3. Applications
• Smartphone, cellular and cordless phone • USB3.2, USB2.0, HDMI2.0, HDMI1.4 • General-purpose downstream ESD protection for dif erential data lines • Tablet PC and Mobile Internet Device (MID) • MIPI M-PHY and D-PHY as used in Camera Serial Interface (CSI) and Display Serial Interface (DSI) Document Outline 1. General description 2. Features and benefits 3. Applications 4. Pinning information 5. Ordering information 6. Marking 7. Limiting values 8. Characteristics 8.1. Channel characteristics 8.2. Frequency characteristics 9. Application information 10. Package outline 11. Soldering 12. Revision history Contents
Common-mode ElectroMagnetic Interference (EMI) filters with integrated bidirectional ElectroStatic Discharge (ESD) protection for one, two and three dif erential channels. The devices are designed to provide low insertion loss for dif erential high-speed signals on each channel while unwanted common-mode signals are attenuated. Each dif erential channel incorporates two signal lines that are coupled by integrated coils. Diodes provide protection to downstream components from ESD voltages up to ±15 kV on each signal line.
Table 1. Product overview Type number Number of channels Package Name
PCMF1USB3BA/C 1 WLCSP5 PCMF2USB3BA/C 2 WLCSP10 PCMF3USB3BA/C 3 WLCSP15
2. Features and benefits
• One, two and three dif erential channels common-mode EMI filters with integrated ESD protection • ESD protection up to ±15 kV contact discharge according to IEC 61000-4-2 • Superior common-mode suppression over a wide frequency range • Superior RF performance compared to other integrated filters or discrete filters with external ESD protection • Extremely high symmetry between line pairs • Industry-standard Wafer-Level Chip-Scale Packages: WLCSP5, 10 and 15 for smal er footprint
3. Applications
• Smartphone, cellular and cordless phone • USB3.2, USB2.0, HDMI2.0, HDMI1.4 • General-purpose downstream ESD protection for dif erential data lines • Tablet PC and Mobile Internet Device (MID) • MIPI M-PHY and D-PHY as used in Camera Serial Interface (CSI) and Display Serial Interface (DSI) Document Outline 1. General description 2. Features and benefits 3. Applications 4. Pinning information 5. Ordering information 6. Marking 7. Limiting values 8. Characteristics 8.1. Channel characteristics 8.2. Frequency characteristics 9. Application information 10. Package outline 11. Soldering 12. Revision history Contents