T5808 Bottom-Port SoundWire® Digital Multi-Mode Microphone GENERAL DESCRIPTIONAPPLICATIONS • The T5808 is a multi-mode, low noise digital MEMS Smartphones • Microphone Arrays microphone in a small package. The T5808 consists of a • Smart Speakers MEMS microphone element and an impedance converter • Headsets amplifier followed by a fourth-order Σ-Δ modulator. The digital • Tablets and Notebook PCs interface is a MIPI Alliance SoundWire® compliant interface which allows bi-directional data flow. FEATURESSPECHIGH QUALITY MODELOW POWER LISTEN The T5808 has multiple modes of operation: High Quality, MODE Low Power Listen (Always-On), Concurrent and Idle (sleep). Sensitivity −41 dB FS ±1 dB −26 dB FS ±1 dB The T5808 has high SNR and high AOP in all operational SNR 66 dBA 62 dBA modes. Current 650 µA 215 µA AOP 135 dB SPL 120 dB SPL The T5808 is available in a standard 3.5 × 2.65 × 0.98 mm Microphone Data 2.4 Mbps or 3.072 Mbps1 0.6 Mbps or 0.768 Mbps1 surface-mount package. It is reflow solder compatible with Rate no sensitivity degradation. SoundWire Bus Integer Multiple of Microphone data rate up to 9.6 MHz or Clock Frequency 12.288 MHz Note 1: Acoustic performance for 2.4MHz, 0.768MHz • 3.5 × 2.65 × 0.98 mm surface-mount package • Extended frequency response from 40 Hz to 20 kHz • Low power: 215 µA in Low Power Listen Mode • Sleep (ClockStop) Mode: 9 µA • MIPI Alliance SoundWire Slave v1.1 compliant • IDSEL pin for multi-microphone enumeration (up to 7 devices) • Compatible with Sn/Pb and Pb-free solder processes • RoHS/WEEE compliant FUNCTIONAL BLOCK DIAGRAMORDERING INFORMATIONPARTTEMP RANGEPACKAGINGMMICT5808-00-12 −40°C to +85°C 13” Tape and Reel TDK Corporation TDK, Inc. reserves the right to change the detail 1745 Technology Drive, San Jose, CA 95110 U.S.A Document Number: DS-000269 specifications as may be required to permit +1(408) 988–7339 Revision: 1.1 improvements in the design of its products. www.tdk.com Release Date: 1/2/2020