Datasheet AD8209A (Analog Devices) - 5
| 制造商 | Analog Devices |
| 描述 | High Voltage, Precision Difference Amplifier |
| 页数 / 页 | 15 / 5 — Data Sheet. AD8209A. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. –IN. … |
| 修订版 | A |
| 文件格式/大小 | PDF / 458 Kb |
| 文件语言 | 英语 |
Data Sheet. AD8209A. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. –IN. +IN. GND. TOP VIEW. DNC. (Not to Scale). OUT. DNC = DO NOT CONNECT
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Data Sheet AD8209A PIN CONFIGURATION AND FUNCTION DESCRIPTIONS –IN +IN VS GND GND A1 –IN 1 8 +IN GND AD8209A 2 7 VS TOP VIEW A1 3 6 DNC (Not to Scale) OUT A2 A2 4 5 OUT
3 002 1- -00 1
DNC = DO NOT CONNECT
1451 451 1 Figure 2. Pin Configuration Figure 3. Metallization Photograph
Table 3. Pin Function Descriptions1 Coordinates Pin No. Mnemonic X Y Size (μm) Description
1 −IN −305 +375 70 × 70 Inverting Input. N/A OPEN −305 +282 70 × 70 Bond pads are not connected to any external pins. 2 GND −309 +149 70 × 142 Ground. 2 GND −326 −7 70 × 70 Ground. 3 A1 −321 −185 70 × 142 Preamplifier (A1) Output. 4 A2 −321 −375 70 × 70 Buffer (A2) Input. 5 OUT +321 −345 70 × 142 Buffer (A2) Output. N/A OPEN +322 −162 70 × 70 No Connect. N/A OPEN +327 −54 70 × 70 Bond pads are not connected to any external pins. 6 DNC Not applicable Not applicable Not applicable Do Not Connect. Do not connect to this pin; Pin 6 does not connect to any bond pads. 7 VS +309 +185 70 × 70 Supply. N/A OPEN +305 +375 70 × 70 Bond pads are not connected to any external pins. 8 +IN +305 +282 70 × 70 Noninverting Input. 1 N/A means not applicable. Rev. A | Page 5 of 15 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION HIGH-SIDE CURRENT SENSINGWITH A LOW-SIDE SWITCH HIGH RAIL CURRENT SENSING LOW-SIDE CURRENT SENSING 4 mA to 20 mA Current Loop Receiver GAIN ADJUSTMENT Gains Less than 14 Gains Greater than 14 GAIN TRIM Internal Signal Overload Considerations LOW-PASS FILTERING HIGH LINE CURRENT SENSING WITH LOW-PASS FILTERING AND GAIN ADJUSTMENT OUTLINE DIMENSIONS ORDERING GUIDE AUTOMOTIVE PRODUCTS
3 002 1- -00 1
DNC = DO NOT CONNECT
1451 451 1 Figure 2. Pin Configuration Figure 3. Metallization Photograph
Table 3. Pin Function Descriptions1 Coordinates Pin No. Mnemonic X Y Size (μm) Description
1 −IN −305 +375 70 × 70 Inverting Input. N/A OPEN −305 +282 70 × 70 Bond pads are not connected to any external pins. 2 GND −309 +149 70 × 142 Ground. 2 GND −326 −7 70 × 70 Ground. 3 A1 −321 −185 70 × 142 Preamplifier (A1) Output. 4 A2 −321 −375 70 × 70 Buffer (A2) Input. 5 OUT +321 −345 70 × 142 Buffer (A2) Output. N/A OPEN +322 −162 70 × 70 No Connect. N/A OPEN +327 −54 70 × 70 Bond pads are not connected to any external pins. 6 DNC Not applicable Not applicable Not applicable Do Not Connect. Do not connect to this pin; Pin 6 does not connect to any bond pads. 7 VS +309 +185 70 × 70 Supply. N/A OPEN +305 +375 70 × 70 Bond pads are not connected to any external pins. 8 +IN +305 +282 70 × 70 Noninverting Input. 1 N/A means not applicable. Rev. A | Page 5 of 15 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION HIGH-SIDE CURRENT SENSINGWITH A LOW-SIDE SWITCH HIGH RAIL CURRENT SENSING LOW-SIDE CURRENT SENSING 4 mA to 20 mA Current Loop Receiver GAIN ADJUSTMENT Gains Less than 14 Gains Greater than 14 GAIN TRIM Internal Signal Overload Considerations LOW-PASS FILTERING HIGH LINE CURRENT SENSING WITH LOW-PASS FILTERING AND GAIN ADJUSTMENT OUTLINE DIMENSIONS ORDERING GUIDE AUTOMOTIVE PRODUCTS