Datasheet AD8205 (Analog Devices) - 5
| 制造商 | Analog Devices |
| 描述 | Single Supply 42 V System Difference Amplifier |
| 页数 / 页 | 12 / 5 — Data Sheet. AD8205. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. –IN. … |
| 修订版 | D |
| 文件格式/大小 | PDF / 461 Kb |
| 文件语言 | 英语 |
Data Sheet. AD8205. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. –IN. +IN. GND. VREF1. TOP VIEW. VREF2 3. (Not to Scale). OUT
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Data Sheet AD8205 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS –IN 1 8 +IN GND 2 AD8205 7 VREF1 TOP VIEW VREF2 3 6 V+ (Not to Scale) NC 4 5 OUT NC = NO CONNECT
04315-0-026 Figure 3. Pin Configuration
Table 3. Pin Function Descriptions Pin No. Mnemonic X Y
1 −IN −206 508 2 GND −447 57 3 VREF2 −432 −457 04315-0-002 4 NC N/A N/A Figure 2. Metallization Diagram 5 OUT 444 −472 6 V+ 444 −203 7 VREF1 456 434 8 +IN 203 509 Die size is 1170 µm by 1280 µm. Die thickness is 13 mil. Minimum passivation opening (minimum bond pad size) is 92 µm × 92 µm. Passivation type is 8KA USG (Oxide) + 10KA Oxynitride. Bond pad metal composition is 98.5% Al, 1% Si, and 0.5% Cu. Backside potential is V+. Rev. D | Page 5 of 12 Document Outline Features Excellent AC and DC Performance Applications Functional Block Diagram General Description Revision History Specifications Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Theory of Operation Output Offset Adjustment Unidirectional Operation Ground Referenced Output V+ Referenced Output Bidirectional Operation External Reference Output Splitting the Supply Splitting an External Reference Applications Information High-Side Current Sense with a Low-Side Switch High-Side Current Sense with a High-Side Switch Outline Dimensions Ordering Guide Automotive Products
04315-0-026 Figure 3. Pin Configuration
Table 3. Pin Function Descriptions Pin No. Mnemonic X Y
1 −IN −206 508 2 GND −447 57 3 VREF2 −432 −457 04315-0-002 4 NC N/A N/A Figure 2. Metallization Diagram 5 OUT 444 −472 6 V+ 444 −203 7 VREF1 456 434 8 +IN 203 509 Die size is 1170 µm by 1280 µm. Die thickness is 13 mil. Minimum passivation opening (minimum bond pad size) is 92 µm × 92 µm. Passivation type is 8KA USG (Oxide) + 10KA Oxynitride. Bond pad metal composition is 98.5% Al, 1% Si, and 0.5% Cu. Backside potential is V+. Rev. D | Page 5 of 12 Document Outline Features Excellent AC and DC Performance Applications Functional Block Diagram General Description Revision History Specifications Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Theory of Operation Output Offset Adjustment Unidirectional Operation Ground Referenced Output V+ Referenced Output Bidirectional Operation External Reference Output Splitting the Supply Splitting an External Reference Applications Information High-Side Current Sense with a Low-Side Switch High-Side Current Sense with a High-Side Switch Outline Dimensions Ordering Guide Automotive Products