Datasheet BLP05H9S500P (Ampleon) - 4

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BLP05H9S500P Power LDMOS transistor
ZL drain 1 ZS gate 1 gate 2 ZS drain 2 ZL amp01005
Fig 1. Definition of transistor impedance 7.3 Application circuit
70 mm 70 mm C5 C4 C13 R2 C2 R1 C15 R3 C16 C6 C7 C14 C1 C11 60 mm C10 C12 C17 C8 C9 C3 amp00944 Printed-Circuit Board (PCB): Rogers RO4360G2; thickness = 0.610 mm; r = 6.15. See Table 9 for a list of components.
Fig 2. Component layout for class-AB application circuit Table 9. List of components
For test circuit see Figure 2.
Component Description Value Remarks
C1, C4, C11, C12, C13 multilayer ceramic chip capacitor 270 pF ATC800B C2, C3 multilayer ceramic chip capacitor 75 pF ATC800B C5, C14 multilayer ceramic chip capacitor 4.7 F, 100V C3225X7S2A475K200AE C6, C8 multilayer ceramic chip capacitor 27 pF ATC800B C7, C9 multilayer ceramic chip capacitor 18 pF ATC800B C10 multilayer ceramic chip capacitor 12 pF ATC800B C15 electrolytic capacitor 4.7 F, 63 V MAL203858471E3 C16, C17 multilayer ceramic chip capacitor 16 pF ATC800B R1 chip resistor 10 0806 R2, R4 chip resistor 9.1 1206 R3 shunt resistor 0.01 Ohmite: FC4L110R010FER BLP05H9S500P All information provided in this document is subject to legal disclaimers. © Ampleon Netherlands B.V. 2019. All rights reserved.
Product data sheet Rev. 1 — 10 September 2019 4 of 13
Document Outline 1. Product profile 1.1 General description 1.2 Features and benefits 1.3 Applications 2. Pinning information 3. Ordering information 4. Limiting values 5. Thermal characteristics 6. Characteristics 7. Test information 7.1 Ruggedness in class-AB operation 7.2 Impedance information 7.3 Application circuit 7.4 Graphical data 8. Package outline 9. Handling information 10. Abbreviations 11. Revision history 12. Legal information 12.1 Data sheet status 12.2 Definitions 12.3 Disclaimers 12.4 Trademarks 13. Contact information 14. Contents