Datasheet VOMA618A (Vishay) - 9
| 制造商 | Vishay |
| 描述 | Optocoupler, Phototransistor Output, Low Input Current, SOP-4, Mini-Flat Package |
| 页数 / 页 | 10 / 9 — VOMA618A. SOLDER PROFILES. HANDLING AND STORAGE CONDITIONS. DRYPACK. … |
| 文件格式/大小 | PDF / 236 Kb |
| 文件语言 | 英语 |
VOMA618A. SOLDER PROFILES. HANDLING AND STORAGE CONDITIONS. DRYPACK. FLOOR LIFE. DRYING
该数据表的模型线
文件文字版本
VOMA618A
www.vishay.com Vishay Semiconductors
SOLDER PROFILES HANDLING AND STORAGE CONDITIONS
Axis Title ESD level: HBM class 2 300 10000 Max. 260 °C
DRYPACK
255 °C 250 245 °C 240 °C Devices are packed in moisture barrier bags (MBB) to 217 °C prevent the products from moisture absorption during 200 1000 transportation and storage. Each bag contains a desiccant. Max. 30 s ine ne ne 150
FLOOR LIFE
1st li 2nd l 2nd li Max. 120 s Max. 100 s Floor life (time between soldering and removing from MBB) 100 100 Temperature (°C) Max. ramp down 6 °C/s must not exceed the time indicated on MBB label: 50 Max. ramp up 3 °C/s Floor life: 168 h Conditions: Tamb < 30 °C, RH < 60 % 0 10 Moisture sensitivity level 3, according to J-STD-020. 0 50 100 150 200 250 300 19841 Time (s)
DRYING
Fig. 22 - Lead (Pb)-free Reflow Solder Profile According to J-STD-020 for SMD Devices In case of moisture absorption devices should be baked before soldering. Conditions see J-STD-033D. Rev. 1.1, 05-Jul-2019
9
Document Number: 84949 For technical questions, contact: optocoupleranswers@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
www.vishay.com Vishay Semiconductors
SOLDER PROFILES HANDLING AND STORAGE CONDITIONS
Axis Title ESD level: HBM class 2 300 10000 Max. 260 °C
DRYPACK
255 °C 250 245 °C 240 °C Devices are packed in moisture barrier bags (MBB) to 217 °C prevent the products from moisture absorption during 200 1000 transportation and storage. Each bag contains a desiccant. Max. 30 s ine ne ne 150
FLOOR LIFE
1st li 2nd l 2nd li Max. 120 s Max. 100 s Floor life (time between soldering and removing from MBB) 100 100 Temperature (°C) Max. ramp down 6 °C/s must not exceed the time indicated on MBB label: 50 Max. ramp up 3 °C/s Floor life: 168 h Conditions: Tamb < 30 °C, RH < 60 % 0 10 Moisture sensitivity level 3, according to J-STD-020. 0 50 100 150 200 250 300 19841 Time (s)
DRYING
Fig. 22 - Lead (Pb)-free Reflow Solder Profile According to J-STD-020 for SMD Devices In case of moisture absorption devices should be baked before soldering. Conditions see J-STD-033D. Rev. 1.1, 05-Jul-2019
9
Document Number: 84949 For technical questions, contact: optocoupleranswers@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000