Datasheet ADT7422 (Analog Devices) - 5
| 制造商 | Analog Devices |
| 描述 | ±0.10°C Accuracy, 16-Bit, Digital I2C Temperature Sensor for VSM Applications |
| 页数 / 页 | 23 / 5 — Data Sheet. ADT7422. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table … |
| 文件格式/大小 | PDF / 378 Kb |
| 文件语言 | 英语 |
Data Sheet. ADT7422. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table 3. Parameter Rating. Table 4. Thermal Resistance
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Data Sheet ADT7422 ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
THERMAL RESISTANCE Table 3.
Thermal performance is directly linked to PCB design and operating environment. Close attention to PCB thermal design
Parameter Rating
is required. θ V JA and θJC are specified for a device soldered on a DD to GND −0.3 V to +7 V JEDEC 4-layer test board for surface-mount packages with SDA Voltage to GND −0.3 V to VDD + 0.3 V 16 thermal vias. The values listed in Table 4 are based on SCL Output Voltage to GND −0.3 V to VDD + 0.3 V simulated data. A0 Input Voltage to GND −0.3 V to VDD + 0.3 V A1 Input Voltage to GND −0.3 V to VDD + 0.3 V
Table 4. Thermal Resistance
CT and INT Output Voltage to GND −0.3 V to VDD + 0.3 V
Package Type θJA θJC Unit
Operating Temperature Range −40°C to +125°C CP-16-17 37 33 °C/W Storage Temperature Range −65°C to +150°C Maximum Junction Temperature 150°C ESD
ESD CAUTION
Human Body Model (HBM) 2 kV Field Induced Charge Device Model 1 kV (FICDM) Reflow Soldering (Pb-Free) JEDEC J-STD-020 Peak Temperature 260°C Time at Peak Temperature 10 sec to 40 sec Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. 0 | Page 5 of 23 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION PRODUCT HIGHLIGHTS FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS I2C TIMING SPECIFICATIONS Timing Diagram ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION CIRCUIT INFORMATION CONVERTER DETAILS NORMAL MODE ONE SHOT MODE CT and INT Operation in One Shot Mode 1 SPS MODE SHUTDOWN MODE FAULT QUEUE TEMPERATURE DATA FORMAT TEMPERATURE CONVERSION FORMULAS 16-Bit Temperature Data Format 13-Bit Temperature Data Format 10-Bit Temperature Data Format 9-Bit Temperature Data Format REGISTERS ADDRESS POINTER REGISTER TEMPERATURE VALUE REGISTERS STATUS REGISTER CONFIGURATION REGISTER THIGH SETPOINT REGISTERS TLOW SETPOINT REGISTERS TCRIT SETPOINT REGISTERS THYST SETPOINT REGISTER ID REGISTER SERIAL INTERFACE SERIAL BUS ADDRESS WRITING DATA READING DATA RESET GENERAL CALL INT AND CT OUTPUTS UNDERTEMPERATURE AND OVERTEMPERATURE DETECTION Comparator Mode Interrupt Mode APPLICATIONS INFORMATION THERMAL RESPONSE TIME SUPPLY DECOUPLING POWERING FROM A SWITCHING REGULATOR TEMPERATURE MEASUREMENT QUICK GUIDE TO MEASURING TEMPERATURE OUTLINE DIMENSIONS ORDERING GUIDE
Data Sheet ADT7422 ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
THERMAL RESISTANCE Table 3.
Thermal performance is directly linked to PCB design and operating environment. Close attention to PCB thermal design
Parameter Rating
is required. θ V JA and θJC are specified for a device soldered on a DD to GND −0.3 V to +7 V JEDEC 4-layer test board for surface-mount packages with SDA Voltage to GND −0.3 V to VDD + 0.3 V 16 thermal vias. The values listed in Table 4 are based on SCL Output Voltage to GND −0.3 V to VDD + 0.3 V simulated data. A0 Input Voltage to GND −0.3 V to VDD + 0.3 V A1 Input Voltage to GND −0.3 V to VDD + 0.3 V
Table 4. Thermal Resistance
CT and INT Output Voltage to GND −0.3 V to VDD + 0.3 V
Package Type θJA θJC Unit
Operating Temperature Range −40°C to +125°C CP-16-17 37 33 °C/W Storage Temperature Range −65°C to +150°C Maximum Junction Temperature 150°C ESD
ESD CAUTION
Human Body Model (HBM) 2 kV Field Induced Charge Device Model 1 kV (FICDM) Reflow Soldering (Pb-Free) JEDEC J-STD-020 Peak Temperature 260°C Time at Peak Temperature 10 sec to 40 sec Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. 0 | Page 5 of 23 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION PRODUCT HIGHLIGHTS FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS I2C TIMING SPECIFICATIONS Timing Diagram ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION CIRCUIT INFORMATION CONVERTER DETAILS NORMAL MODE ONE SHOT MODE CT and INT Operation in One Shot Mode 1 SPS MODE SHUTDOWN MODE FAULT QUEUE TEMPERATURE DATA FORMAT TEMPERATURE CONVERSION FORMULAS 16-Bit Temperature Data Format 13-Bit Temperature Data Format 10-Bit Temperature Data Format 9-Bit Temperature Data Format REGISTERS ADDRESS POINTER REGISTER TEMPERATURE VALUE REGISTERS STATUS REGISTER CONFIGURATION REGISTER THIGH SETPOINT REGISTERS TLOW SETPOINT REGISTERS TCRIT SETPOINT REGISTERS THYST SETPOINT REGISTER ID REGISTER SERIAL INTERFACE SERIAL BUS ADDRESS WRITING DATA READING DATA RESET GENERAL CALL INT AND CT OUTPUTS UNDERTEMPERATURE AND OVERTEMPERATURE DETECTION Comparator Mode Interrupt Mode APPLICATIONS INFORMATION THERMAL RESPONSE TIME SUPPLY DECOUPLING POWERING FROM A SWITCHING REGULATOR TEMPERATURE MEASUREMENT QUICK GUIDE TO MEASURING TEMPERATURE OUTLINE DIMENSIONS ORDERING GUIDE