Datasheet ADT7312 (Analog Devices) - 7
| 制造商 | Analog Devices |
| 描述 | Automotive, ±1°C Accurate, 16-Bit, 175°C Digital SPI Temperature Sensor in Die Form |
| 页数 / 页 | 24 / 7 — Data Sheet. ADT7312. DIE BOND PAD COORDINATES. Table 5. Bond Pad … |
| 修订版 | A |
| 文件格式/大小 | PDF / 540 Kb |
| 文件语言 | 英语 |
Data Sheet. ADT7312. DIE BOND PAD COORDINATES. Table 5. Bond Pad Coordinates Pad No. Pad Name. X Coordinate (µm). Y Coordinate (µm)
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Data Sheet ADT7312 DIE BOND PAD COORDINATES
The following X and Y coordinates refer to the center of the bond pad and are referenced from the center of the die.
Table 5. Bond Pad Coordinates Pad No. Pad Name X Coordinate (µm) Y Coordinate (µm)
1 SCLK −838 +1020 2 DOUT −838 +831 3 DIN −838 −863 4 CS −838 −1011 5 INT +838 −1011 6 CT +838 −863 7 GND +838 +508 8 GND +838 +702 9 VDD +838 +857 10 VDD +838 +1008 Rev. A | Page 7 of 24 Document Outline Features Applications General Description Product Highlights Functional Block Diagram Table of Contents Revision History Specifications SPI Timing Specifications Absolute Maximum Ratings ESD Caution Pad Configuration and Function Descriptions Die Bond Pad Coordinates Typical Performance Characteristics Theory of Operation Circuit Description Converter Architecture Normal Mode (Continuous Conversion Mode) One-Shot Mode CT and INT Operation in One-Shot Mode 1 SPS Mode Shutdown Mode Fault Queue Temperature Data Format Temperature Conversion Formulas 16-Bit Temperature Data Format 13-Bit Temperature Data Format 10-Bit Temperature Data Format 9-Bit Temperature Data Format Registers Status Register Configuration Register Temperature Value Register ID Register TCRIT Setpoint Register THYST Setpoint Register THIGH Setpoint Register TLOW Setpoint Register Serial Interface SPI Command Byte Writing Data Reading Data Interfacing to DSPs or Microcontrollers Resetting the Serial Interface INT and CT Outputs Undertemperature and Overtemperature Detection Comparator Mode Interrupt Mode Redundant Critical Generator Applications Information Thermal Response Time Supply Decoupling Powering from a Switching Regulator Temperature Monitoring Quick Guide to Measuring Temperature Outline Dimensions Ordering Guide Automotive Products
The following X and Y coordinates refer to the center of the bond pad and are referenced from the center of the die.
Table 5. Bond Pad Coordinates Pad No. Pad Name X Coordinate (µm) Y Coordinate (µm)
1 SCLK −838 +1020 2 DOUT −838 +831 3 DIN −838 −863 4 CS −838 −1011 5 INT +838 −1011 6 CT +838 −863 7 GND +838 +508 8 GND +838 +702 9 VDD +838 +857 10 VDD +838 +1008 Rev. A | Page 7 of 24 Document Outline Features Applications General Description Product Highlights Functional Block Diagram Table of Contents Revision History Specifications SPI Timing Specifications Absolute Maximum Ratings ESD Caution Pad Configuration and Function Descriptions Die Bond Pad Coordinates Typical Performance Characteristics Theory of Operation Circuit Description Converter Architecture Normal Mode (Continuous Conversion Mode) One-Shot Mode CT and INT Operation in One-Shot Mode 1 SPS Mode Shutdown Mode Fault Queue Temperature Data Format Temperature Conversion Formulas 16-Bit Temperature Data Format 13-Bit Temperature Data Format 10-Bit Temperature Data Format 9-Bit Temperature Data Format Registers Status Register Configuration Register Temperature Value Register ID Register TCRIT Setpoint Register THYST Setpoint Register THIGH Setpoint Register TLOW Setpoint Register Serial Interface SPI Command Byte Writing Data Reading Data Interfacing to DSPs or Microcontrollers Resetting the Serial Interface INT and CT Outputs Undertemperature and Overtemperature Detection Comparator Mode Interrupt Mode Redundant Critical Generator Applications Information Thermal Response Time Supply Decoupling Powering from a Switching Regulator Temperature Monitoring Quick Guide to Measuring Temperature Outline Dimensions Ordering Guide Automotive Products