Datasheet ADT7410 (Analog Devices) - 5

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Data Sheet ADT7410 ABSOLUTE MAXIMUM RATINGS Table 3.
Stresses at or above those listed under Absolute Maximum
Parameter Rating
Ratings may cause permanent damage to the product. This is a VDD to GND −0.3 V to +7 V stress rating only; functional operation of the product at these SDA Voltage to GND −0.3 V to VDD + 0.3 V or any other conditions above those indicated in the operational SCL Output Voltage to GND −0.3 V to VDD + 0.3 V section of this specification is not implied. Operation beyond A0 Input Voltage to GND −0.3 V to VDD + 0.3 V the maximum operating conditions for extended periods may A1 Input Voltage to GND −0.3 V to VDD + 0.3 V affect product reliability. CT and INT Output Voltage to GND −0.3 V to VDD + 0.3 V ESD Rating (Human Body Model) 2.0 kV
1.2
Operating Temperature Range −55°C to +150°C
) 1.0
Storage Temperature Range −65°C to +160°C
(W N
Maximum Junction Temperature, T
IO
JMAX 150°C
T 0.8
8-Lead SOIC-N (R-8)
PA
Power Dissipation1 W 2
ISSI
MAX = (TJMAX − TA )/θJA
D 0.6
Thermal Impedance3
ER W
θJA, Junction-to-Ambient (Still Air) 121°C/W
M PO 0.4
θJC, Junction-to-Case 56°C/W
MU
IR Reflow Soldering 220°C
XI MA 0.2
Peak Temperature (RoHS-Compliant 260°C (0°C)
MAX PD = 3.4mW AT 150°C
Package)
0
Time at Peak Temperature 20 sec to 40 sec
0
003
10 20 30 40 50 60 70 80 90 –55 –50 –40 –30 –20 –10 100 110 120 130 140 150
Ramp-Up Rate 3°C/sec maximum
TEMPERATURE (°C)
06560- Ramp-Down Rate −6°C/sec maximum Figure 3. SOIC_N Maximum Power Dissipation vs. Temperature Time from 25°C to Peak Temperature 8 minutes maximum 1 Values relate to package being used on a standard 2-layer PCB. This gives a
ESD CAUTION
worst-case θJA and θJC. See Figure 3 for a plot of maximum power dissipation vs. ambient temperature (TA). 2 TA = ambient temperature. 3 Junction-to-case resistance is applicable to components featuring a preferential flow direction, for example, components mounted on a heat sink. Junction-to-ambient is more useful for air-cooled, PCB-mounted components. Rev. C | Page 5 of 24 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS I2C TIMING SPECIFICATIONS Timing Diagram ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION CIRCUIT INFORMATION CONVERTER DETAILS TEMPERATURE MEASUREMENT ONE-SHOT MODE 1 SPS MODE CT and INT Operation in One-Shot Mode SHUTDOWN FAULT QUEUE TEMPERATURE DATA FORMAT TEMPERATURE CONVERSION FORMULAS 16-Bit Temperature Data Format 13-Bit Temperature Data Format 10-Bit Temperature Data Format 9-Bit Temperature Data Format REGISTERS ADDRESS POINTER REGISTER TEMPERATURE VALUE REGISTERS STATUS REGISTER CONFIGURATION REGISTER THIGH SETPOINT REGISTERS TLOW SETPOINT REGISTERS TCRIT SETPOINT REGISTERS THYST SETPOINT REGISTER ID REGISTER SERIAL INTERFACE SERIAL BUS ADDRESS WRITING DATA READING DATA RESET GENERAL CALL INT AND CT OUTPUTS UNDERTEMPERATURE AND OVERTEMPERATURE DETECTION Comparator Mode Interrupt Mode APPLICATIONS INFORMATION THERMAL RESPONSE TIME SUPPLY DECOUPLING TEMPERATURE MONITORING OUTLINE DIMENSIONS ORDERING GUIDE