Datasheet ADT7302 (Analog Devices) - 5
| 制造商 | Analog Devices |
| 描述 | ±2°C Accurate, Micropower Digital Temperature Sensor |
| 页数 / 页 | 16 / 5 — ADT7302. ABSOLUTE MAXIMUM RATINGS. Table 3. Parameter. Rating. 1.2. 1.0. … |
| 修订版 | B |
| 文件格式/大小 | PDF / 244 Kb |
| 文件语言 | 英语 |
ADT7302. ABSOLUTE MAXIMUM RATINGS. Table 3. Parameter. Rating. 1.2. 1.0. 0.8. SOT-23. 0.6. 0.4. MSOP. 0.2. MAXIMUM POWER DISSIPATION (W). 100. 110. 120
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ADT7302 ABSOLUTE MAXIMUM RATINGS Table 3.
Stresses above those listed under Absolute Maximum Ratings
Parameter Rating
may cause permanent damage to the device. This is a stress V to GND −0.3 V to +7 V DD rating only; functional operation of the device at these or any Digital Input Voltage to GND −0.3 V to V + 0.3 V DD other conditions above those indicated in the operational Digital Output Voltage to GND −0.3 V to V + 0.3 V DD section of this specification is not implied. Exposure to absolute Operating Temperature Range −40°C to +125°C maximum rating conditions for extended periods may affect Storage Temperature Range −65°C to +150°C device reliability. Junction Temperature 150°C 6-Lead SOT-23 (RJ-6)
1.2
Power Dissipation1 W = (T max − T 2)/θ MAX J A JA Thermal Impedance
1.0
θ , Junction-to-Ambient (Still Air) 190.4°C/W JA
0.8
8-Lead MSOP (RM-8) Power Dissipation1 W = (T max − T 2)/θ
SOT-23
MAX J A JA
0.6
Thermal Impedance3 θ , Junction-to-Ambient (Still Air) 205.9°C/W JA
0.4 MSOP
θ , Junction-to-Case 43.74°C/W JC IR Reflow Soldering
0.2
Peak Temperature 220°C (0°C/5°C)
MAXIMUM POWER DISSIPATION (W)
Time at Peak Temperature 10 sec to 20 sec
0
Ramp-Up Rate 3°C/sec max
0
-003
40 30 20 10 10 20 30 40 50 60 70 80 90 – – – – 100 110 120 130 140 150
Ramp-Down Rate −6°C/sec
TEMPERATURE (
°
C)
04662 Time 25°C to Peak Temperature 6 minutes max Figure 3. Maximum Power Dissipation vs. Temperature IR Reflow Soldering—Pb-Free Package Peak Temperature 260°C (0°C)
ESD CAUTION
Time at Peak Temperature 20 sec to 40 sec Ramp-Up Rate 3°C/sec max Ramp-Down Rate −6°C/sec max Time 25°C to Peak Temperature 8 minutes max 1 Values relate to the package being used on a standard 2-layer PCB. Refer to Figure 3 for a plot of maximum power dissipation vs. ambient temperature (TA). 2 T A = ambient temperature. 3 Junction-to-case resistance is applicable to components featuring a preferential flow direction, for example, components mounted on a heat sink. Junction-to-ambient resistance is more useful for air-cooled, PCB- mounted components. Rev. B | Page 5 of 16 Document Outline Features Applications Functional Block Diagram General Description Product Highlights Revision History Specifications Timing Characteristics Absolute Maximum Ratings ESD Caution Pin Configurations and Function Descriptions Typical Performance Characteristics Theory of Operation Converter Details Temperature Value Register Temperature Conversion Equations Serial Interface Read Operation Write Operation Applications Information Microprocessor Interfacing ADT7302 to MC68HC11 Interface ADT7302 to 8051 Interface ADT7302 to PIC16C6x/7x and PIC16F873 Interface ADT7302 to ADSP-21xx Interface Mounting the ADT7302 Supply Decoupling Outline Dimensions Ordering Guide
ADT7302 ABSOLUTE MAXIMUM RATINGS Table 3.
Stresses above those listed under Absolute Maximum Ratings
Parameter Rating
may cause permanent damage to the device. This is a stress V to GND −0.3 V to +7 V DD rating only; functional operation of the device at these or any Digital Input Voltage to GND −0.3 V to V + 0.3 V DD other conditions above those indicated in the operational Digital Output Voltage to GND −0.3 V to V + 0.3 V DD section of this specification is not implied. Exposure to absolute Operating Temperature Range −40°C to +125°C maximum rating conditions for extended periods may affect Storage Temperature Range −65°C to +150°C device reliability. Junction Temperature 150°C 6-Lead SOT-23 (RJ-6)
1.2
Power Dissipation1 W = (T max − T 2)/θ MAX J A JA Thermal Impedance
1.0
θ , Junction-to-Ambient (Still Air) 190.4°C/W JA
0.8
8-Lead MSOP (RM-8) Power Dissipation1 W = (T max − T 2)/θ
SOT-23
MAX J A JA
0.6
Thermal Impedance3 θ , Junction-to-Ambient (Still Air) 205.9°C/W JA
0.4 MSOP
θ , Junction-to-Case 43.74°C/W JC IR Reflow Soldering
0.2
Peak Temperature 220°C (0°C/5°C)
MAXIMUM POWER DISSIPATION (W)
Time at Peak Temperature 10 sec to 20 sec
0
Ramp-Up Rate 3°C/sec max
0
-003
40 30 20 10 10 20 30 40 50 60 70 80 90 – – – – 100 110 120 130 140 150
Ramp-Down Rate −6°C/sec
TEMPERATURE (
°
C)
04662 Time 25°C to Peak Temperature 6 minutes max Figure 3. Maximum Power Dissipation vs. Temperature IR Reflow Soldering—Pb-Free Package Peak Temperature 260°C (0°C)
ESD CAUTION
Time at Peak Temperature 20 sec to 40 sec Ramp-Up Rate 3°C/sec max Ramp-Down Rate −6°C/sec max Time 25°C to Peak Temperature 8 minutes max 1 Values relate to the package being used on a standard 2-layer PCB. Refer to Figure 3 for a plot of maximum power dissipation vs. ambient temperature (TA). 2 T A = ambient temperature. 3 Junction-to-case resistance is applicable to components featuring a preferential flow direction, for example, components mounted on a heat sink. Junction-to-ambient resistance is more useful for air-cooled, PCB- mounted components. Rev. B | Page 5 of 16 Document Outline Features Applications Functional Block Diagram General Description Product Highlights Revision History Specifications Timing Characteristics Absolute Maximum Ratings ESD Caution Pin Configurations and Function Descriptions Typical Performance Characteristics Theory of Operation Converter Details Temperature Value Register Temperature Conversion Equations Serial Interface Read Operation Write Operation Applications Information Microprocessor Interfacing ADT7302 to MC68HC11 Interface ADT7302 to 8051 Interface ADT7302 to PIC16C6x/7x and PIC16F873 Interface ADT7302 to ADSP-21xx Interface Mounting the ADT7302 Supply Decoupling Outline Dimensions Ordering Guide