Datasheet TMP05, TMP06 (Analog Devices) - 8

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TMP05/TMP06 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 4.
Stresses above those listed under Absolute Maximum Ratings
Parameter Rating
may cause permanent damage to the device. This is a stress V to GND –0.3 V to +7 V DD rating only; functional operation of the device at these or any Digital Input Voltage to GND –0.3 V to V + 0.3 V DD other conditions above those indicated in the operational Maximum Output Current (OUT) ±10 mA section of this specification is not implied. Exposure to absolute Operating Temperature Range1 –40°C to +150°C maximum rating conditions for extended periods may affect Storage Temperature Range –65°C to +160°C device reliability. Maximum Junction Temperature, T max 150°C J 5-Lead SOT-23 (RJ-5)
0.9
Power Dissipation2 W = (T max – T 3)/θ
0.8
MAX J A JA Thermal Impedance4
0.7
θ , Junction-to-Ambient (Still Air) 240°C/W JA
0.6
5-Lead SC-70 (KS-5) Power Dissipation2 W = (T max – T 3)/θ
0.5
MAX J A JA Thermal Impedance4
0.4 SOT-23
θ , Junction-to-Ambient 534.7°C/W JA
0.3
θ , Junction-to-Case 172.3°C/W JC IR Reflow Soldering
0.2
Peak Temperature 220°C (0°C/5°C)
MAXIMUM POWER DISSIPATION (W) SC-70 0.1
Time at Peak Temperature 10 sec to 20 sec
0
03340-0-040 Ramp-Up Rate 2°C/s to 3°C/s
0 10 20 30 40 50 60 70 80 90 –40 –30 –20 –10 100 110 120 130 140 150
Ramp-Down Rate −6°C/s
TEMPERATURE (
°
C)
Time 25°C to Peak Temperature 6 minutes max Figure 4. Maximum Power Dissipation vs. Ambient Temperature IR Reflow Soldering (Pb-Free Package) Peak Temperature 260°C (0°C) Time at Peak Temperature 20 sec to 40 sec Ramp-Up Rate 3°C/sec max Ramp-Down Rate –6°C/sec max Time 25°C to Peak Temperature 8 minutes max 1 It is not recommended to operate the device at temperatures above 125°C for more than a total of 5% (5,000 hours) of the lifetime of the device. Any exposure beyond this limit affects device reliability. 2 SOT-23 values relate to the package being used on a 2-layer PCB and SC-70 values relate to the package being used on a 4-layer PCB. See Figure 4 for a plot of maximum power dissipation vs. ambient temperature (TA). 3 TA = ambient temperature. 4 Junction-to-case resistance is applicable to components featuring a preferential flow direction, for example, components mounted on a heat sink. Junction-to-ambient resistance is more useful for air-cooled PCB mounted components.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. Rev. C | Page 8 of 28 Document Outline Features Applications Functional Block Diagram General Description Product Highlights Revision History Specifications TMP05A/TMP06A Specifications TMP05B/TMP06B Specifications Timing Characteristics Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Theory of Operation Circuit Information Converter Details Functional Description Operating Modes Continuously Converting Mode One Shot Mode Conversion Rate Daisy-Chain Mode TMP05 Output TMP06 Output Application Hints Thermal Response Time Self-Heating Effects Supply Decoupling Layout Considerations Temperature Monitoring Daisy-Chain Application TMP05 Program Code Example 1 Continuously Converting Application TMP05 Program Code Example 2 Outline Dimensions Ordering Guide