Datasheet AD8428-KGD (Analog Devices) - 7
| 制造商 | Analog Devices |
| 描述 | Low Noise, Low Gain Drift, G = 2000 Instrumentation Amplifier |
| 页数 / 页 | 7 / 7 — Data Sheet. AD8428-KGD. OUTLINE DIMENSIONS. 1.755. 0.661. 0.717. 0.3048. … |
| 文件格式/大小 | PDF / 237 Kb |
| 文件语言 | 英语 |
Data Sheet. AD8428-KGD. OUTLINE DIMENSIONS. 1.755. 0.661. 0.717. 0.3048. 0.626. 0.979. 2.890. 0.665. DNC. 0.525. 0.337. 0.251 0.111. 0.092 × 0.092
该数据表的模型线
文件文字版本
link to page 7
Data Sheet AD8428-KGD OUTLINE DIMENSIONS 1.755 0.661 0.717 0.3048 0.626 8 1 0.979 2 2.890 0.665 DNC 7 0.525 0.337 DNC 3 0.251 0.111 4 0.092 × 0.092 0.839 (Pads 1-4, Pad 5 and Pads 7-8) 6 1.231 5 TOP VIEW SIDE VIEW (CIRCUIT SIDE) 0.092 × 0.200 0.538 A 0.682 2019- 11- 03-
Figure 3. 8-Pad Bare Die [CHIP] (C-8-16) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 4. Die Specifications Parameter Value Unit
Scribe Line Width 90 μm Die Size 1755 × 2890 μm Thickness 304.8 μm Backside None1 Not applicable Passivation 1 silicon oxide nitride/18 polyimide μm Bond Pads Opening (Minimum) 92 × 92 μm Bond Pad Composition 1.0 aluminum (Al), silicon(Si)/0.5 copper (Cu) % 1 If connecting the backside to a voltage potential, tie the backside to −VS. Otherwise, leave the backside floating.
Table 5. Assembly Recommendations Assembly Component Recommendation
Die Attach Hitachi EN4900GC conductive Bonding Method 0.8 mils, gold Bonding Sequence Unspecified
ORDERING GUIDE Model1 Temperature Range Package Description Package Option
AD8428-KGD-WP −40°C to +85°C 8-Pad Bare Die [CHIP], Waffle Pack C-8-16 1 The AD8428-KGD-WP is a RoHS compliant part.
©2019 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D20263-0-10/19(0)
Rev. 0 | Page 7 of 7 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS OUTLINE DIMENSIONS DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS ORDERING GUIDE
Data Sheet AD8428-KGD OUTLINE DIMENSIONS 1.755 0.661 0.717 0.3048 0.626 8 1 0.979 2 2.890 0.665 DNC 7 0.525 0.337 DNC 3 0.251 0.111 4 0.092 × 0.092 0.839 (Pads 1-4, Pad 5 and Pads 7-8) 6 1.231 5 TOP VIEW SIDE VIEW (CIRCUIT SIDE) 0.092 × 0.200 0.538 A 0.682 2019- 11- 03-
Figure 3. 8-Pad Bare Die [CHIP] (C-8-16) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 4. Die Specifications Parameter Value Unit
Scribe Line Width 90 μm Die Size 1755 × 2890 μm Thickness 304.8 μm Backside None1 Not applicable Passivation 1 silicon oxide nitride/18 polyimide μm Bond Pads Opening (Minimum) 92 × 92 μm Bond Pad Composition 1.0 aluminum (Al), silicon(Si)/0.5 copper (Cu) % 1 If connecting the backside to a voltage potential, tie the backside to −VS. Otherwise, leave the backside floating.
Table 5. Assembly Recommendations Assembly Component Recommendation
Die Attach Hitachi EN4900GC conductive Bonding Method 0.8 mils, gold Bonding Sequence Unspecified
ORDERING GUIDE Model1 Temperature Range Package Description Package Option
AD8428-KGD-WP −40°C to +85°C 8-Pad Bare Die [CHIP], Waffle Pack C-8-16 1 The AD8428-KGD-WP is a RoHS compliant part.
©2019 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D20263-0-10/19(0)
Rev. 0 | Page 7 of 7 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS OUTLINE DIMENSIONS DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS ORDERING GUIDE