Datasheet ISM330DHCX (STMicroelectronics) - 3
| 制造商 | STMicroelectronics |
| 描述 | iNEMO inertial module with Machine Learning Core |
| 页数 / 页 | 167 / 3 — ISM330DHCX. Overview. DS13012. Rev 5. page 3/167 |
| 文件格式/大小 | PDF / 2.6 Mb |
| 文件语言 | 英语 |
ISM330DHCX. Overview. DS13012. Rev 5. page 3/167
该数据表的模型线
文件文字版本
ISM330DHCX Overview 1 Overview
The ISM330DHCX is a system-in-package featuring a high-accuracy and high-performance 3D digital accelerometer and 3D digital gyroscope tailored for Industry 4.0 applications. All the design aspects and the testing and calibration of the ISM330DHCX have been optimized to reach superior accuracy, stability, extremely low noise and full data synchronization. The ISM330DHCX has a 3D accelerometer capable of wide bandwidth, ultra-low noise and a selectable full-scale range of ±2/±4/±8/±16 g. The 3D gyroscope has an angular rate range of ±125/±250/±500/±1000/±2000/±4000 dps and offers superior stability over temperature and time along with ultra-low noise. The unique set of embedded features (Machine Learning Core, programmable FSM, 9 kbytes smart FIFO, sensor hub, event decoding and interrupts) facilitate the implementation of smart and complex sensor nodes which deliver high performance at very low power. The ISM330DHCX offers specific support, both for the gyroscope and the accelerometer, to applications requiring closed control loop (like OIS and other stabilization applications). The device, through a dedicated auxiliary SPI interface and a configurable signal processing path, can provide data for the control loop while, at the same time, a second fully independent path can output data for other applications. Like the entire portfolio of MEMS sensor modules, the ISM330DHCX leverages the robust and mature in-house manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element. In the ISM330DHCX, the sensing elements of the accelerometer and of the gyroscope are implemented on the same silicon die, thus guaranteeing superior stability and robustness. The ISM330DHCX is available in a small plastic land grid array (LGA) package of 2.5 x 3.0 x 0.83 mm.
DS13012
-
Rev 5 page 3/167
Document Outline Features Applications Description 1 Overview 2 Embedded low-power features 2.1 Finite State Machine 2.2 Machine Learning Core 3 Pin description 3.1 Pin connections 4 Module specifications 4.1 Mechanical characteristics 4.2 Electrical characteristics 4.3 Temperature sensor characteristics 4.4 Communication interface characteristics 4.4.1 SPI - serial peripheral interface 4.4.2 I²C - inter-IC control interface 4.5 Absolute maximum ratings 4.6 Terminology 4.6.1 Sensitivity 4.6.2 Zero-g and zero-rate level 5 Digital interfaces 5.1 I²C/SPI interface 5.1.1 I²C serial interface 5.1.1.1 I²C operation 5.1.2 SPI bus interface 5.1.2.1 SPI read 5.1.2.2 SPI write 5.1.2.3 SPI read in 3-wire mode 5.2 Master I²C interface 5.3 Auxiliary SPI interface 6 Functionality 6.1 Operating modes 6.2 Gyroscope power modes 6.3 Accelerometer power modes 6.4 Block diagram of filters 6.4.1 Block diagrams of the accelerometer filters 6.4.2 Block diagrams of the gyroscope filters 6.5 FIFO 6.5.1 Bypass mode 6.5.2 FIFO mode 6.5.3 Continuous mode 6.5.4 Continuous-to-FIFO mode 6.5.5 Bypass-to-Continuous mode 6.5.6 Bypass-to-FIFO mode 6.5.7 FIFO reading procedure 7 Application hints 7.1 ISM330DHCX electrical connections in Mode 1 7.2 ISM330DHCX electrical connections in Mode 2 7.3 ISM330DHCX electrical connections in Mode 3 and Mode 4 8 Register mapping 9 Register description 9.1 FUNC_CFG_ACCESS (01h) 9.2 PIN_CTRL (02h) 9.3 FIFO_CTRL1 (07h) 9.4 FIFO_CTRL2 (08h) 9.5 FIFO_CTRL3 (09h) 9.6 FIFO_CTRL4 (0Ah) 9.7 COUNTER_BDR_REG1 (0Bh) 9.8 COUNTER_BDR_REG2 (0Ch) 9.9 INT1_CTRL (0Dh) 9.10 INT2_CTRL (0Eh) 9.11 WHO_AM_I (0Fh) 9.12 CTRL1_XL (10h) 9.13 CTRL2_G (11h) 9.14 CTRL3_C (12h) 9.15 CTRL4_C (13h) 9.16 CTRL5_C (14h) 9.17 CTRL6_C (15h) 9.18 CTRL7_G (16h) 9.19 CTRL8_XL (17h) 9.20 CTRL9_XL (18h) 9.21 CTRL10_C (19h) 9.22 ALL_INT_SRC (1A) 9.23 WAKE_UP_SRC (1Bh) 9.24 TAP_SRC (1Ch) 9.25 DRD_SRC (1Dh) 9.26 STATUS_REG (1Eh) / STATUS_SPIAux (1Eh) 9.27 OUT_TEMP_L (20h), OUT_TEMP_H (21h) 9.28 OUTX_L_G (22h) and OUTX_H_G (23h) 9.29 OUTY_L_G (24h) and OUTY_H_G (25h) 9.30 OUTZ_L_G (26h) and OUTZ_H_G (27h) 9.31 OUTX_L_A (28h) and OUTX_H_A (29h) 9.32 OUTY_L_A (2Ah) and OUTY_H_A (2Bh) 9.33 OUTZ_L_A (2Ch) and OUTZ_H_A (2Dh) 9.34 EMB_FUNC_STATUS_MAINPAGE (35h) 9.35 FSM_STATUS_A_MAINPAGE (36h) 9.36 FSM_STATUS_B_MAINPAGE (37h) 9.37 MLC_STATUS_MAINPAGE (38h) 9.38 STATUS_MASTER_MAINPAGE (39h) 9.39 FIFO_STATUS1 (3Ah) 9.40 FIFO_STATUS2 (3Bh) 9.41 TIMESTAMP0 (40h), TIMESTAMP1 (41h), TIMESTAMP2 (42h), and TIMESTAMP3 (43h) 9.42 TAP_CFG0 (56h) 9.43 TAP_CFG1 (57h) 9.44 TAP_CFG2 (58h) 9.45 TAP_THS_6D (59h) 9.46 INT_DUR2 (5Ah) 9.47 WAKE_UP_THS (5Bh) 9.48 WAKE_UP_DUR (5Ch) 9.49 FREE_FALL (5Dh) 9.50 MD1_CFG (5Eh) 9.51 MD2_CFG (5Fh) 9.52 INTERNAL_FREQ_FINE (63h) 9.53 INT_OIS (6Fh) 9.54 CTRL1_OIS (70h) 9.55 CTRL2_OIS (71h) 9.56 CTRL3_OIS (72h) 9.57 X_OFS_USR (73h) 9.58 Y_OFS_USR (74h) 9.59 Z_OFS_USR (75h) 9.60 FIFO_DATA_OUT_TAG (78h) 9.61 FIFO_DATA_OUT_X_L (79h) and FIFO_DATA_OUT_X_H (7Ah) 9.62 FIFO_DATA_OUT_Y_L (7Bh) and FIFO_DATA_OUT_Y_H (7Ch) 9.63 FIFO_DATA_OUT_Z_L (7Dh) and FIFO_DATA_OUT_Z_H (7Eh) 10 Embedded functions register mapping 11 Embedded functions register description 11.1 PAGE_SEL (02h) 11.2 EMB_FUNC_EN_A (04h) 11.3 EMB_FUNC_EN_B (05h) 11.4 PAGE_ADDRESS (08h) 11.5 PAGE_VALUE (09h) 11.6 EMB_FUNC_INT1 (0Ah) 11.7 FSM_INT1_A (0Bh) 11.8 FSM_INT1_B (0Ch) 11.9 MLC_INT1 (0Dh) 11.10 EMB_FUNC_INT2 (0Eh) 11.11 FSM_INT2_A (0Fh) 11.12 FSM_INT2_B (10h) 11.13 MLC_INT2 (11h) 11.14 EMB_FUNC_STATUS (12h) 11.15 FSM_STATUS_A (13h) 11.16 FSM_STATUS_B (14h) 11.17 MLC_STATUS (15h) 11.18 PAGE_RW (17h) 11.19 EMB_FUNC_FIFO_CFG (44h) 11.20 FSM_ENABLE_A (46h) 11.21 FSM_ENABLE_B (47h) 11.22 FSM_LONG_COUNTER_L (48h) and FSM_LONG_COUNTER_H (49h) 11.23 FSM_LONG_COUNTER_CLEAR (4Ah) 11.24 FSM_OUTS1 (4Ch) 11.25 FSM_OUTS2 (4Dh) 11.26 FSM_OUTS3 (4Eh) 11.27 FSM_OUTS4 (4Fh) 11.28 FSM_OUTS5 (50h) 11.29 FSM_OUTS6 (51h) 11.30 FSM_OUTS7 (52h) 11.31 FSM_OUTS8 (53h) 11.32 FSM_OUTS9 (54h) 11.33 FSM_OUTS10 (55h) 11.34 FSM_OUTS11 (56h) 11.35 FSM_OUTS12 (57h) 11.36 FSM_OUTS13 (58h) 11.37 FSM_OUTS14 (59h) 11.38 FSM_OUTS15 (5Ah) 11.39 FSM_OUTS16 (5Bh) 11.40 EMB_FUNC_ODR_CFG_B (5Fh) 11.41 EMB_FUNC_ODR_CFG_C (60h) 11.42 STEP_COUNTER_L (62h) and STEP_COUNTER_H (63h) 11.43 EMB_FUNC_SRC (64h) 11.44 EMB_FUNC_INIT_A (66h) 11.45 EMB_FUNC_INIT_B (67h) 11.46 MLC0_SRC (70h) 11.47 MLC1_SRC (71h) 11.48 MLC2_SRC (72h) 11.49 MLC3_SRC (73h) 11.50 MLC4_SRC (74h) 11.51 MLC5_SRC (75h) 11.52 MLC6_SRC (76h) 11.53 MLC7_SRC (77h) 12 Embedded advanced features pages 13 Embedded advanced features register description 13.1 Page 0 - Embedded advanced features registers 13.1.1 MAG_SENSITIVITY_L (BAh) and MAG_SENSITIVITY_H (BBh) 13.1.2 MAG_OFFX_L (C0h) and MAG_OFFX_H (C1h) 13.1.3 MAG_OFFY_L (C2h) and MAG_OFFY_H (C3h) 13.1.4 MAG_OFFZ_L (C4h) and MAG_OFFZ_H (C5h) 13.1.5 MAG_SI_XX_L (C6h) and MAG_SI_XX_H (C7h) 13.1.6 MAG_SI_XY_L (C8h) and MAG_SI_XY_H (C9h) 13.1.7 MAG_SI_XZ_L (CAh) and MAG_SI_XZ_H (CBh) 13.1.8 MAG_SI_YY_L (CCh) and MAG_SI_YY_H (CDh) 13.1.9 MAG_SI_YZ_L (CEh) and MAG_SI_YZ_H (CFh) 13.1.10 MAG_SI_ZZ_L (D0h) and MAG_SI_ZZ_H (D1h) 13.1.11 MAG_CFG_A (D4h) 13.1.12 MAG_CFG_B (D5h) 13.2 Page 1 - Embedded advanced features registers 13.2.1 FSM_LC_TIMEOUT_L (7Ah) and FSM_LC_TIMEOUT_H (7Bh) 13.2.2 FSM_PROGRAMS (7Ch) 13.2.3 FSM_START_ADD_L (7Eh) and FSM_START_ADD_H (7Fh) 13.2.4 PEDO_CMD_REG (83h) 13.2.5 PEDO_DEB_CONF (84h) 13.2.6 PEDO_SC_DELTAT_L (D0h) and PEDO_SC_DELTAT_H (D1h) 13.2.7 MLC_MAG_SENSITIVITY_L (E8h) and MLC_MAG_SENSITIVITY_H (E9h) 14 Sensor hub register mapping 15 Sensor hub register description 15.1 SENSOR_HUB_1 (02h) 15.2 SENSOR_HUB_2 (03h) 15.3 SENSOR_HUB_3 (04h) 15.4 SENSOR_HUB_4 (05h) 15.5 SENSOR_HUB_5 (06h) 15.6 SENSOR_HUB_6 (07h) 15.7 SENSOR_HUB_7 (08h) 15.8 SENSOR_HUB_8 (09h) 15.9 SENSOR_HUB_9 (0Ah) 15.10 SENSOR_HUB_10 (0Bh) 15.11 SENSOR_HUB_11 (0Ch) 15.12 SENSOR_HUB_12 (0Dh) 15.13 SENSOR_HUB_13 (0Eh) 15.14 SENSOR_HUB_14 (0Fh) 15.15 SENSOR_HUB_15 (10h) 15.16 SENSOR_HUB_16 (11h) 15.17 SENSOR_HUB_17 (12h) 15.18 SENSOR_HUB_18 (13h) 15.19 MASTER_CONFIG (14h) 15.20 SLV0_ADD (15h) 15.21 SLV0_SUBADD (16h) 15.22 SLAVE0_CONFIG (17h) 15.23 SLV1_ADD (18h) 15.24 SLV1_SUBADD (19h) 15.25 SLAVE1_CONFIG (1Ah) 15.26 SLV2_ADD (1Bh) 15.27 SLV2_SUBADD (1Ch) 15.28 SLAVE2_CONFIG (1Dh) 15.29 SLV3_ADD (1Eh) 15.30 SLV3_SUBADD (1Fh) 15.31 SLAVE3_CONFIG (20h) 15.32 DATAWRITE_SLV0 (21h) 15.33 STATUS_MASTER (22h) 16 Soldering information 17 Package information 17.1 LGA-14L package information 17.2 LGA-14 packing information Revision history Contents List of tables List of figures
The ISM330DHCX is a system-in-package featuring a high-accuracy and high-performance 3D digital accelerometer and 3D digital gyroscope tailored for Industry 4.0 applications. All the design aspects and the testing and calibration of the ISM330DHCX have been optimized to reach superior accuracy, stability, extremely low noise and full data synchronization. The ISM330DHCX has a 3D accelerometer capable of wide bandwidth, ultra-low noise and a selectable full-scale range of ±2/±4/±8/±16 g. The 3D gyroscope has an angular rate range of ±125/±250/±500/±1000/±2000/±4000 dps and offers superior stability over temperature and time along with ultra-low noise. The unique set of embedded features (Machine Learning Core, programmable FSM, 9 kbytes smart FIFO, sensor hub, event decoding and interrupts) facilitate the implementation of smart and complex sensor nodes which deliver high performance at very low power. The ISM330DHCX offers specific support, both for the gyroscope and the accelerometer, to applications requiring closed control loop (like OIS and other stabilization applications). The device, through a dedicated auxiliary SPI interface and a configurable signal processing path, can provide data for the control loop while, at the same time, a second fully independent path can output data for other applications. Like the entire portfolio of MEMS sensor modules, the ISM330DHCX leverages the robust and mature in-house manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element. In the ISM330DHCX, the sensing elements of the accelerometer and of the gyroscope are implemented on the same silicon die, thus guaranteeing superior stability and robustness. The ISM330DHCX is available in a small plastic land grid array (LGA) package of 2.5 x 3.0 x 0.83 mm.
DS13012
-
Rev 5 page 3/167
Document Outline Features Applications Description 1 Overview 2 Embedded low-power features 2.1 Finite State Machine 2.2 Machine Learning Core 3 Pin description 3.1 Pin connections 4 Module specifications 4.1 Mechanical characteristics 4.2 Electrical characteristics 4.3 Temperature sensor characteristics 4.4 Communication interface characteristics 4.4.1 SPI - serial peripheral interface 4.4.2 I²C - inter-IC control interface 4.5 Absolute maximum ratings 4.6 Terminology 4.6.1 Sensitivity 4.6.2 Zero-g and zero-rate level 5 Digital interfaces 5.1 I²C/SPI interface 5.1.1 I²C serial interface 5.1.1.1 I²C operation 5.1.2 SPI bus interface 5.1.2.1 SPI read 5.1.2.2 SPI write 5.1.2.3 SPI read in 3-wire mode 5.2 Master I²C interface 5.3 Auxiliary SPI interface 6 Functionality 6.1 Operating modes 6.2 Gyroscope power modes 6.3 Accelerometer power modes 6.4 Block diagram of filters 6.4.1 Block diagrams of the accelerometer filters 6.4.2 Block diagrams of the gyroscope filters 6.5 FIFO 6.5.1 Bypass mode 6.5.2 FIFO mode 6.5.3 Continuous mode 6.5.4 Continuous-to-FIFO mode 6.5.5 Bypass-to-Continuous mode 6.5.6 Bypass-to-FIFO mode 6.5.7 FIFO reading procedure 7 Application hints 7.1 ISM330DHCX electrical connections in Mode 1 7.2 ISM330DHCX electrical connections in Mode 2 7.3 ISM330DHCX electrical connections in Mode 3 and Mode 4 8 Register mapping 9 Register description 9.1 FUNC_CFG_ACCESS (01h) 9.2 PIN_CTRL (02h) 9.3 FIFO_CTRL1 (07h) 9.4 FIFO_CTRL2 (08h) 9.5 FIFO_CTRL3 (09h) 9.6 FIFO_CTRL4 (0Ah) 9.7 COUNTER_BDR_REG1 (0Bh) 9.8 COUNTER_BDR_REG2 (0Ch) 9.9 INT1_CTRL (0Dh) 9.10 INT2_CTRL (0Eh) 9.11 WHO_AM_I (0Fh) 9.12 CTRL1_XL (10h) 9.13 CTRL2_G (11h) 9.14 CTRL3_C (12h) 9.15 CTRL4_C (13h) 9.16 CTRL5_C (14h) 9.17 CTRL6_C (15h) 9.18 CTRL7_G (16h) 9.19 CTRL8_XL (17h) 9.20 CTRL9_XL (18h) 9.21 CTRL10_C (19h) 9.22 ALL_INT_SRC (1A) 9.23 WAKE_UP_SRC (1Bh) 9.24 TAP_SRC (1Ch) 9.25 DRD_SRC (1Dh) 9.26 STATUS_REG (1Eh) / STATUS_SPIAux (1Eh) 9.27 OUT_TEMP_L (20h), OUT_TEMP_H (21h) 9.28 OUTX_L_G (22h) and OUTX_H_G (23h) 9.29 OUTY_L_G (24h) and OUTY_H_G (25h) 9.30 OUTZ_L_G (26h) and OUTZ_H_G (27h) 9.31 OUTX_L_A (28h) and OUTX_H_A (29h) 9.32 OUTY_L_A (2Ah) and OUTY_H_A (2Bh) 9.33 OUTZ_L_A (2Ch) and OUTZ_H_A (2Dh) 9.34 EMB_FUNC_STATUS_MAINPAGE (35h) 9.35 FSM_STATUS_A_MAINPAGE (36h) 9.36 FSM_STATUS_B_MAINPAGE (37h) 9.37 MLC_STATUS_MAINPAGE (38h) 9.38 STATUS_MASTER_MAINPAGE (39h) 9.39 FIFO_STATUS1 (3Ah) 9.40 FIFO_STATUS2 (3Bh) 9.41 TIMESTAMP0 (40h), TIMESTAMP1 (41h), TIMESTAMP2 (42h), and TIMESTAMP3 (43h) 9.42 TAP_CFG0 (56h) 9.43 TAP_CFG1 (57h) 9.44 TAP_CFG2 (58h) 9.45 TAP_THS_6D (59h) 9.46 INT_DUR2 (5Ah) 9.47 WAKE_UP_THS (5Bh) 9.48 WAKE_UP_DUR (5Ch) 9.49 FREE_FALL (5Dh) 9.50 MD1_CFG (5Eh) 9.51 MD2_CFG (5Fh) 9.52 INTERNAL_FREQ_FINE (63h) 9.53 INT_OIS (6Fh) 9.54 CTRL1_OIS (70h) 9.55 CTRL2_OIS (71h) 9.56 CTRL3_OIS (72h) 9.57 X_OFS_USR (73h) 9.58 Y_OFS_USR (74h) 9.59 Z_OFS_USR (75h) 9.60 FIFO_DATA_OUT_TAG (78h) 9.61 FIFO_DATA_OUT_X_L (79h) and FIFO_DATA_OUT_X_H (7Ah) 9.62 FIFO_DATA_OUT_Y_L (7Bh) and FIFO_DATA_OUT_Y_H (7Ch) 9.63 FIFO_DATA_OUT_Z_L (7Dh) and FIFO_DATA_OUT_Z_H (7Eh) 10 Embedded functions register mapping 11 Embedded functions register description 11.1 PAGE_SEL (02h) 11.2 EMB_FUNC_EN_A (04h) 11.3 EMB_FUNC_EN_B (05h) 11.4 PAGE_ADDRESS (08h) 11.5 PAGE_VALUE (09h) 11.6 EMB_FUNC_INT1 (0Ah) 11.7 FSM_INT1_A (0Bh) 11.8 FSM_INT1_B (0Ch) 11.9 MLC_INT1 (0Dh) 11.10 EMB_FUNC_INT2 (0Eh) 11.11 FSM_INT2_A (0Fh) 11.12 FSM_INT2_B (10h) 11.13 MLC_INT2 (11h) 11.14 EMB_FUNC_STATUS (12h) 11.15 FSM_STATUS_A (13h) 11.16 FSM_STATUS_B (14h) 11.17 MLC_STATUS (15h) 11.18 PAGE_RW (17h) 11.19 EMB_FUNC_FIFO_CFG (44h) 11.20 FSM_ENABLE_A (46h) 11.21 FSM_ENABLE_B (47h) 11.22 FSM_LONG_COUNTER_L (48h) and FSM_LONG_COUNTER_H (49h) 11.23 FSM_LONG_COUNTER_CLEAR (4Ah) 11.24 FSM_OUTS1 (4Ch) 11.25 FSM_OUTS2 (4Dh) 11.26 FSM_OUTS3 (4Eh) 11.27 FSM_OUTS4 (4Fh) 11.28 FSM_OUTS5 (50h) 11.29 FSM_OUTS6 (51h) 11.30 FSM_OUTS7 (52h) 11.31 FSM_OUTS8 (53h) 11.32 FSM_OUTS9 (54h) 11.33 FSM_OUTS10 (55h) 11.34 FSM_OUTS11 (56h) 11.35 FSM_OUTS12 (57h) 11.36 FSM_OUTS13 (58h) 11.37 FSM_OUTS14 (59h) 11.38 FSM_OUTS15 (5Ah) 11.39 FSM_OUTS16 (5Bh) 11.40 EMB_FUNC_ODR_CFG_B (5Fh) 11.41 EMB_FUNC_ODR_CFG_C (60h) 11.42 STEP_COUNTER_L (62h) and STEP_COUNTER_H (63h) 11.43 EMB_FUNC_SRC (64h) 11.44 EMB_FUNC_INIT_A (66h) 11.45 EMB_FUNC_INIT_B (67h) 11.46 MLC0_SRC (70h) 11.47 MLC1_SRC (71h) 11.48 MLC2_SRC (72h) 11.49 MLC3_SRC (73h) 11.50 MLC4_SRC (74h) 11.51 MLC5_SRC (75h) 11.52 MLC6_SRC (76h) 11.53 MLC7_SRC (77h) 12 Embedded advanced features pages 13 Embedded advanced features register description 13.1 Page 0 - Embedded advanced features registers 13.1.1 MAG_SENSITIVITY_L (BAh) and MAG_SENSITIVITY_H (BBh) 13.1.2 MAG_OFFX_L (C0h) and MAG_OFFX_H (C1h) 13.1.3 MAG_OFFY_L (C2h) and MAG_OFFY_H (C3h) 13.1.4 MAG_OFFZ_L (C4h) and MAG_OFFZ_H (C5h) 13.1.5 MAG_SI_XX_L (C6h) and MAG_SI_XX_H (C7h) 13.1.6 MAG_SI_XY_L (C8h) and MAG_SI_XY_H (C9h) 13.1.7 MAG_SI_XZ_L (CAh) and MAG_SI_XZ_H (CBh) 13.1.8 MAG_SI_YY_L (CCh) and MAG_SI_YY_H (CDh) 13.1.9 MAG_SI_YZ_L (CEh) and MAG_SI_YZ_H (CFh) 13.1.10 MAG_SI_ZZ_L (D0h) and MAG_SI_ZZ_H (D1h) 13.1.11 MAG_CFG_A (D4h) 13.1.12 MAG_CFG_B (D5h) 13.2 Page 1 - Embedded advanced features registers 13.2.1 FSM_LC_TIMEOUT_L (7Ah) and FSM_LC_TIMEOUT_H (7Bh) 13.2.2 FSM_PROGRAMS (7Ch) 13.2.3 FSM_START_ADD_L (7Eh) and FSM_START_ADD_H (7Fh) 13.2.4 PEDO_CMD_REG (83h) 13.2.5 PEDO_DEB_CONF (84h) 13.2.6 PEDO_SC_DELTAT_L (D0h) and PEDO_SC_DELTAT_H (D1h) 13.2.7 MLC_MAG_SENSITIVITY_L (E8h) and MLC_MAG_SENSITIVITY_H (E9h) 14 Sensor hub register mapping 15 Sensor hub register description 15.1 SENSOR_HUB_1 (02h) 15.2 SENSOR_HUB_2 (03h) 15.3 SENSOR_HUB_3 (04h) 15.4 SENSOR_HUB_4 (05h) 15.5 SENSOR_HUB_5 (06h) 15.6 SENSOR_HUB_6 (07h) 15.7 SENSOR_HUB_7 (08h) 15.8 SENSOR_HUB_8 (09h) 15.9 SENSOR_HUB_9 (0Ah) 15.10 SENSOR_HUB_10 (0Bh) 15.11 SENSOR_HUB_11 (0Ch) 15.12 SENSOR_HUB_12 (0Dh) 15.13 SENSOR_HUB_13 (0Eh) 15.14 SENSOR_HUB_14 (0Fh) 15.15 SENSOR_HUB_15 (10h) 15.16 SENSOR_HUB_16 (11h) 15.17 SENSOR_HUB_17 (12h) 15.18 SENSOR_HUB_18 (13h) 15.19 MASTER_CONFIG (14h) 15.20 SLV0_ADD (15h) 15.21 SLV0_SUBADD (16h) 15.22 SLAVE0_CONFIG (17h) 15.23 SLV1_ADD (18h) 15.24 SLV1_SUBADD (19h) 15.25 SLAVE1_CONFIG (1Ah) 15.26 SLV2_ADD (1Bh) 15.27 SLV2_SUBADD (1Ch) 15.28 SLAVE2_CONFIG (1Dh) 15.29 SLV3_ADD (1Eh) 15.30 SLV3_SUBADD (1Fh) 15.31 SLAVE3_CONFIG (20h) 15.32 DATAWRITE_SLV0 (21h) 15.33 STATUS_MASTER (22h) 16 Soldering information 17 Package information 17.1 LGA-14L package information 17.2 LGA-14 packing information Revision history Contents List of tables List of figures