Datasheet ADAR1000 (Analog Devices) - 8
| 制造商 | Analog Devices |
| 描述 | 8 GHz to 16 GHz, 4-Channel, X Band and Ku Band Beamformer |
| 页数 / 页 | 65 / 8 — ADAR1000. Data Sheet. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table … |
| 修订版 | A |
| 文件格式/大小 | PDF / 1.7 Mb |
| 文件语言 | 英语 |
ADAR1000. Data Sheet. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table 3. Parameter. Rating. Table 4. Thermal Resistance
该数据表的模型线
文件文字版本
ADAR1000 Data Sheet ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 3. Parameter Rating
Thermal performance is directly linked to printed circuit board AVDD1 to GND −5.5 V (PCB) design and operating environment. The PCB thermal AVDD3 to GND 3.6 V design requires careful attention. Digital Input/Output Voltage to GND 2.0 V θJA is the junction to the ambient with the exposed pad soldered Maximum RF Input Power 20 dBm down, and θJC is the junction to the exposed pad. Operating Temperature Range −40°C to +85°C Storage Temperature Range −65°C to +150°C
Table 4. Thermal Resistance
Reflow Soldering
Package Type θJA θJC Unit
Peak Temperature 260°C CC-88-11 18.7 10.1 °C/W Junction Temperature (TJ) 135°C 1 Simulated based on PCB specified in JESD-51. Electrostatic Discharge (ESD) Charged Device Model (CDM) ±500 V
ESD CAUTION
Human Body Model (HBM) ±2500 V Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. A | Page 8 of 65 Document Outline Features Applications General Description Functional Block Diagram Revision History Specifications Timing Specifications Timing Diagrams SPI Block Write Mode SPI Write All Mode Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Theory of Operation RF Path Phase and Gain Control Power Detectors External Amplifier Bias DACs External Switch Control Transmit and Receive Control RF Subcircuit Bias Control and Enables ADC Operation Chip Addressing Memory Access Calibration Applications Information Gain Control Registers Switched Attenuator Control Phase Control Registers Transmit and Receive Subcircuit Control TR_SOURCE = 1 (TR Pin Control) TR_SOURCE = 0 (SPI Control) Transmit and Receive Switch Driver Control PA Bias Output Control LNA Bias Output Control Transmit/Receive Delay Control Transmit and Receive Mode Switching SPI Programming Example Powering the ADAR1000 Register Map Register Descriptions Outline Dimensions Ordering Guide
Thermal performance is directly linked to printed circuit board AVDD1 to GND −5.5 V (PCB) design and operating environment. The PCB thermal AVDD3 to GND 3.6 V design requires careful attention. Digital Input/Output Voltage to GND 2.0 V θJA is the junction to the ambient with the exposed pad soldered Maximum RF Input Power 20 dBm down, and θJC is the junction to the exposed pad. Operating Temperature Range −40°C to +85°C Storage Temperature Range −65°C to +150°C
Table 4. Thermal Resistance
Reflow Soldering
Package Type θJA θJC Unit
Peak Temperature 260°C CC-88-11 18.7 10.1 °C/W Junction Temperature (TJ) 135°C 1 Simulated based on PCB specified in JESD-51. Electrostatic Discharge (ESD) Charged Device Model (CDM) ±500 V
ESD CAUTION
Human Body Model (HBM) ±2500 V Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. A | Page 8 of 65 Document Outline Features Applications General Description Functional Block Diagram Revision History Specifications Timing Specifications Timing Diagrams SPI Block Write Mode SPI Write All Mode Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Theory of Operation RF Path Phase and Gain Control Power Detectors External Amplifier Bias DACs External Switch Control Transmit and Receive Control RF Subcircuit Bias Control and Enables ADC Operation Chip Addressing Memory Access Calibration Applications Information Gain Control Registers Switched Attenuator Control Phase Control Registers Transmit and Receive Subcircuit Control TR_SOURCE = 1 (TR Pin Control) TR_SOURCE = 0 (SPI Control) Transmit and Receive Switch Driver Control PA Bias Output Control LNA Bias Output Control Transmit/Receive Delay Control Transmit and Receive Mode Switching SPI Programming Example Powering the ADAR1000 Register Map Register Descriptions Outline Dimensions Ordering Guide