Datasheet STPS745 (STMicroelectronics) - 4
| 制造商 | STMicroelectronics |
| 描述 | Power Schottky rectifier |
| 页数 / 页 | 14 / 4 — Characteristics. STPS745. Figure 7: Junction capacitance versus reverse. … |
| 文件格式/大小 | PDF / 524 Kb |
| 文件语言 | 英语 |
Characteristics. STPS745. Figure 7: Junction capacitance versus reverse. Figure 8: Forward voltage drop versus forward
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Characteristics STPS745 Figure 7: Junction capacitance versus reverse Figure 8: Forward voltage drop versus forward voltage applied (typical values) current (maximum values)
C(pF) 1000 F=1MHz VOS C=30mV RMS Tj=25°C 500 200 VR(V) 100 1 2 5 10 20 50
Figure 9: Thermal resistance junction to ambient versus copper surface under tab (epoxy printed board FR4, eCu: 35 µm)
80 D²PAK 70 60 ) 50 W/ C°() 40 a-j(htR 30 20 10 0 0 5 10 15 20 25 30 35 40 SCu(cm²) 4/14 DocID3516 Rev 8
C(pF) 1000 F=1MHz VOS C=30mV RMS Tj=25°C 500 200 VR(V) 100 1 2 5 10 20 50
Figure 9: Thermal resistance junction to ambient versus copper surface under tab (epoxy printed board FR4, eCu: 35 µm)
80 D²PAK 70 60 ) 50 W/ C°() 40 a-j(htR 30 20 10 0 0 5 10 15 20 25 30 35 40 SCu(cm²) 4/14 DocID3516 Rev 8