Datasheet HMC434-EP (Analog Devices) - 5
| 制造商 | Analog Devices |
| 描述 | 0.2 GHz to 8 GHz, GaAs, HBT MMIC, Divide by 8 Prescaler |
| 页数 / 页 | 7 / 5 — Enhanced Product. HMC434-EP. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. … |
| 修订版 | B |
| 文件格式/大小 | PDF / 208 Kb |
| 文件语言 | 英语 |
Enhanced Product. HMC434-EP. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. NIC. OUT. GND. TOP VIEW. VCC. (Not to Scale)
该数据表的模型线
文件文字版本
Enhanced Product HMC434-EP PIN CONFIGURATION AND FUNCTION DESCRIPTIONS NIC 1 6 OUT HMC434-EP GND 2 TOP VIEW 5 VCC (Not to Scale) IN 3 4 NIC NOTES 1. NOT INTERNALLY CONNECTED. THESE PINS CAN BE CONNECTED TO RF AND DC GROUND WITHOUT AFFECTING PERFORMANCE. THE NIC PINS ARE
002
TYPICALLY TIED TO GND FOR ENHANCED THERMAL PERFORMANCE (BUT NOT REQUIRED).
15647- Figure 2. Pin Configuration
Table 4. Pin Function Descriptions Pin No. Mnemonic Description
1, 4 NIC Not Internally Connected. These pins can be connected to RF and dc ground without affecting performance. The NIC pins are typically tied to GND for enhanced thermal performance (but not required). 2 GND Ground. This pin must be connected to both RF and dc ground. 3 IN RF Input. This pin must be dc blocked. 5 VCC Supply Voltage (3 V). 6 OUT RF Output. This pin must be dc blocked.
INTERFACE SCHEMATICS GND VCC
003
50Ω
15647-
OUT
005 15647- Figure 3. GND Interface Schematic Figure 5. OUT Interface Schematic
VCC VCC 50Ω 8pF
006 004
IN
15647- 15647- Figure 4. IN Interface Schematic Figure 6. VCC Interface Schematic Rev. B | Page 5 of 7 Document Outline Features Enhanced Product Features Applications Functional Block Diagram General Description Revision History Specifications Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Outline Dimensions Ordering Guide
002
TYPICALLY TIED TO GND FOR ENHANCED THERMAL PERFORMANCE (BUT NOT REQUIRED).
15647- Figure 2. Pin Configuration
Table 4. Pin Function Descriptions Pin No. Mnemonic Description
1, 4 NIC Not Internally Connected. These pins can be connected to RF and dc ground without affecting performance. The NIC pins are typically tied to GND for enhanced thermal performance (but not required). 2 GND Ground. This pin must be connected to both RF and dc ground. 3 IN RF Input. This pin must be dc blocked. 5 VCC Supply Voltage (3 V). 6 OUT RF Output. This pin must be dc blocked.
INTERFACE SCHEMATICS GND VCC
003
50Ω
15647-
OUT
005 15647- Figure 3. GND Interface Schematic Figure 5. OUT Interface Schematic
VCC VCC 50Ω 8pF
006 004
IN
15647- 15647- Figure 4. IN Interface Schematic Figure 6. VCC Interface Schematic Rev. B | Page 5 of 7 Document Outline Features Enhanced Product Features Applications Functional Block Diagram General Description Revision History Specifications Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Outline Dimensions Ordering Guide