Datasheet HMC362S8G, 362S8GE (Analog Devices) - 3

HMC362S8G / 362S8GE
v04.0919
SMT GaAs HBT MMIC DIVIDE-BY-4, DC - 12 GHz Output Voltage Waveform, Pin= 0 dBm, Fout= 882 MHz, T= 25 °C Absolute Maximum Ratings
6 300 RF Input (Vcc = +5V) +13 dBm Vcc +5.5V 6 200 VLogic Vcc -1.6V to Vcc -1.2V T 100 Storage Temperature -65 to +150 °C (mV) T M Operating Temperature -40 to +85 °C 0 M -100 AMPLITUDE ELECTROSTATIC SENSITIVE DEVICE S - S -200 OBSERVE HANDLING PRECAUTIONS S - S R -300 R O 22.7 23.1 23.5 23.9 24.3 24.7
Typical Supply Current vs. Vcc
O T TIME (nS) Vcc (V) Icc (mA) T C 4.75 61 C E
8-Lead Standard Small Outline Package, with Exposed Pad [SOIC_N_EP] Narrow Body
5.0 68 E T
(RD-8-3)
T E 5.25 74
Dimensions shown in millimeters.
E Note: Divider will operate over full voltage range shown above
Outline Drawing
S & D
4.98 4.90
S & D R
3.50 4.80 0.53 REF 3.30
R E
3.00
E ID
8 5 3.99 6.20 2.50
ID IV
3.90 6.00 EXPOSED PAD 2.29 3.81 5.80 2.00
IV
1 4
Y D
1.27 TOP VIEW BOTTOM VIEW
Y D C
BSC 3.81 REF
C N
0.50 45°
N E
1.72 1.57 SIDE VIEW 0.25 END VIEW 0.25
E U
1.52 1.37 0.19
U Q
0.25 8° SEATING 1.04 REF
Q E
PLANE 0.10 0° 1.27 0.46
E R
COPLANARITY 0.41 0.36 0.10
R F F 8-Lead Standard Small Outline Package, with Exposed Pad [SOIC_N_EP]
PKG-006220 COMPLIANT TO JEDEC STANDARDS MS-012-BA
Narrow Body
04-10-2019-A
(RD-8-3) Dimensions shown in mil imeters.
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [3] HMC362S8G Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 [1] HMC362 XXXX HMC362S8GE RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [2] HMC362 XXXX [1] Max peak reflow temperature of 235 °C [2] Max peak reflow temperature of 260 °C [3] 4-Digit lot number XXXX For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
4 - 3
Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D