Datasheet ADP1032 (Analog Devices) - 9

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Data Sheet ADP1032 ABSOLUTE MAXIMUM RATINGS Table 7. THERMAL RESISTANCE Parameter Rating
Thermal performance is directly linked to printed circuit board VINP to PGNDP 61 V (PCB) design and operating environment. Close attention to SWP to VINP VINP + 70 V or 110 V, PCB thermal design is required. whichever is lower θJA is the natural convection, junction to ambient thermal SLEW to GNDP −0.3 V to VINP + 0.3 V resistance measured in a one cubic foot sealed enclosure. θJC is EN to GNDP −0.3 V to +61 V measured at the top of the package and is independent of the VOUT1 to SGND2 35 V PCB. The ΨJT value is appropriate for calculating junction to FB1 to SGND2 −0.3 V to VOUT1 + 0.3 V case temperature in the application. SW2 to SGND2 −0.3 V to VOUT1 + 0.3 V VOUT2 to SGND2 6 V
Table 8. Thermal Resistance
SVDD1 to SGND1 6.0 V
Package Type1, 2, 3, 4 θJA θJC ΨJT Unit
SVDD2 to SGND2 6.0 V CP-41-1 50.4 33.1 25 °C/W SSS, SCK, SI, SO to SGND1 −0.3 V to SVDD1 + 0.3 V 1 9 mm × 7 mm LFCSP with omitted pins for isolation purposes. SGPO1, SGPO2, SGPI3 to SGND2 −0.3 V to SVDD2 + 0.3 V 2 Thermal impedance simulated values are based on a JEDEC 2S2P thermal SYNC to SGND2 −0.3 V to +6 V test board with 19 thermal vias. See JEDEC JESD-51. 3 Case temperature was measured at the center of the package. MVDD to MGND 6.0 V 4 Board temperature was measured near Pin 1. MSS, MCK, MO, MI to MGND −0.3 V to MVDD + 0.3 V MGPI1, MGPI2, MGPO3 to MGND −0.3 V to MVDD + 0.3 V
ESD CAUTION
PWRGD to MGND −0.3 V to MVDD + 0.3 V Common-Mode Transients ±100 kV/µs Operating Junction Temperature −40°C to +125°C Range1 Storage Temperature Range −65°C to +150°C Soldering Conditions JEDEC J-STD-020 1 Power dissipated on chip must be derated to keep the junction temperature below 125°C. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability.
Table 9. Maximum Continuous Working Voltage1 Parameter Value Constraint
60 Hz AC Voltage 300 V rms 20-year lifetime at 0.1% failure rate, zero average voltage DC Voltage 424 VPEAK Limited by the creepage of the package, Pollution Degree 2, Material Group II2, 3 1 See the Insulation Lifetime section for more details. 2 Other pollution degrees and material group requirements yield a different limit. 3 Some system level standards allow components to use the printed wiring board (PWB) creepage values. The supported dc voltage may be higher for those standards. Rev. 0 | Page 9 of 37 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION TYPICAL APPLICATION CIRCUIT COMPANION PRODUCTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS REGULATORY INFORMATION ELECTROMAGNECTIC COMPATIBILITY INSULATION AND SAFETY RELATED SPECIFICATIONS DIN V VDE 0884-10 (VDE V 0884-10) INSULATION CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION FLYBACK REGULATOR Flyback Regulator Operation Power Saving Mode (PSM) Flyback Undervoltage Lockout (UVLO) Flyback Regulator Precision Enable Control Flyback Regulator Soft Start Flyback Slew Rate Control Flyback Regulator Overcurrent Protection Flyback Regulator Overvoltage Protection BUCK REGULATOR Buck Regulator Operation Buck Regulator UVLO Buck Regulator Soft Start Buck Regulator Current-Limit Protection Buck Regulator Active Pull-Down Resistor Buck Regulator OVP POWER GOOD POWER-UP SEQUENCE OSCILLATOR AND SYNCHRONIZATION THERMAL SHUTDOWN DATA ISOLATION High Speed SPI Channels GPIO Data Channels APPLICATIONS INFORMATION COMPONENT SELECTION Feedback Resistors Capacitor Selection FLYBACK REGULATOR COMPONENTS SELECTION Input Capacitor Output Capacitor Ripple Current vs. Capacitor Value Schottky Diode Transformer Turn Ratio Primary Inductance Flyback Transformer Saturation Current Series Winding Resistance Leakage Inductance and Clamping Circuits Clamping Resistor Clamping Capacitor Clamping Diode Diode, Zener Diode Clamp Ripple Current (IAC) vs. Inductance Maximum Output Current Calculation BUCK REGULATOR COMPONENTS SELECTION Inductor Output Capacitor INSULATION LIFETIME Surface Tracking Insulation Wear Out Calculation and Use of Parameters Example THERMAL ANALYSIS TYPICAL APPLICATION CIRCUIT PCB LAYOUT CONSIDERATIONS OUTLINE DIMENSIONS ORDERING GUIDE