Datasheet LTM4653 (Analog Devices) - 2
| 制造商 | Analog Devices |
| 描述 | EN55022B Compliant 58V, 4A Step-Down DC/DC µModule Regulator |
| 页数 / 页 | 34 / 2 — ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1) (All Voltages … |
| 修订版 | A |
| 文件格式/大小 | PDF / 3.5 Mb |
| 文件语言 | 英语 |
ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1) (All Voltages Relative to V –. OUT Unless Otherwise Indicated)
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文件文字版本
LTM4653
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1) (All Voltages Relative to V – OUT Unless Otherwise Indicated)
Terminal Voltages TOP VIEW 1 2 3 4 5 6 7 VIN, VD, SVIN, SW, ISETa, VOUT, VOSNS ...–0.3V to 60V VIN A GND, ISETb, EXTVCC ... –0.3V to 28V CLKIN NC VD RUN .. GND–0.3V to PGND+60V B PGND INTV IMONb IMONa SVIN CC, PGDFB, VINREG, COMPa, COMPb, C IMONa, IMONb .. –0.3V to 4V PGOOD PGDFB VINREG GND D fSET ...–0.3V to INTVCC COMPb COMPa fSET SGND NC CLKIN, PGOOD (Relative to GND) ... –0.3V to 6V E ISETb ISETa EXTVCC RUN Terminal Currents F INTV INTVCC CC Peak Output Current (Note 8) ..30mA G TEMP+ ..–1mA to 10mA VOSNS SGND SW H TEMP– ...–10mA to 1mA TEMP+ TEMP– TEMP+ TEMP– Temperatures J PGND Internal Operating Temperature Range K VOUT NC (Note 2) ... –40°C to 125°C L Storage Temperature Range .. –55°C to 125°C BGA PACKAGE Peak Solder Reflow Package 77-PIN (15mm × 9mm × 5.01mm) TJ(MAX) = 125°C; θJA = 15.5°C/W; Body Temperature .. 245°C θJCtop = 20.6°C/W; θJCbot = 5.1°C/W; WEIGHT = 1.8 GRAMS NOTES: 1) θ VALUES ARE DETERMINED BY SIMULATION PER JESD51 CONDITIONS. 2) θJA VALUE IS OBTAINED WITH DEMO BOARD. 3) REFER TO APPLICATION INFORMATION SECTION FOR LAB MEASUREMENT AND DERATING INFORMATION.
ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTM4653EY#PBF SAC305 (RoHS) e1 –40°C to 125°C LTM4653IY#PBF SAC305 (RoHS) LTM4653Y e1 BGA 3 –40°C to 125°C LTM4653IY SnPb (63/37) e0 –40°C to 125°C • Contact the factory for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609. Procedures • LGA and BGA Package and Tray Drawings Rev. A 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Test Circuit Decoupling Requirements Operation Operation Operation Applications Information Typical Applications Package Photograph Package Description Typical Application Related Parts
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1) (All Voltages Relative to V – OUT Unless Otherwise Indicated)
Terminal Voltages TOP VIEW 1 2 3 4 5 6 7 VIN, VD, SVIN, SW, ISETa, VOUT, VOSNS ...–0.3V to 60V VIN A GND, ISETb, EXTVCC ... –0.3V to 28V CLKIN NC VD RUN .. GND–0.3V to PGND+60V B PGND INTV IMONb IMONa SVIN CC, PGDFB, VINREG, COMPa, COMPb, C IMONa, IMONb .. –0.3V to 4V PGOOD PGDFB VINREG GND D fSET ...–0.3V to INTVCC COMPb COMPa fSET SGND NC CLKIN, PGOOD (Relative to GND) ... –0.3V to 6V E ISETb ISETa EXTVCC RUN Terminal Currents F INTV INTVCC CC Peak Output Current (Note 8) ..30mA G TEMP+ ..–1mA to 10mA VOSNS SGND SW H TEMP– ...–10mA to 1mA TEMP+ TEMP– TEMP+ TEMP– Temperatures J PGND Internal Operating Temperature Range K VOUT NC (Note 2) ... –40°C to 125°C L Storage Temperature Range .. –55°C to 125°C BGA PACKAGE Peak Solder Reflow Package 77-PIN (15mm × 9mm × 5.01mm) TJ(MAX) = 125°C; θJA = 15.5°C/W; Body Temperature .. 245°C θJCtop = 20.6°C/W; θJCbot = 5.1°C/W; WEIGHT = 1.8 GRAMS NOTES: 1) θ VALUES ARE DETERMINED BY SIMULATION PER JESD51 CONDITIONS. 2) θJA VALUE IS OBTAINED WITH DEMO BOARD. 3) REFER TO APPLICATION INFORMATION SECTION FOR LAB MEASUREMENT AND DERATING INFORMATION.
ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTM4653EY#PBF SAC305 (RoHS) e1 –40°C to 125°C LTM4653IY#PBF SAC305 (RoHS) LTM4653Y e1 BGA 3 –40°C to 125°C LTM4653IY SnPb (63/37) e0 –40°C to 125°C • Contact the factory for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609. Procedures • LGA and BGA Package and Tray Drawings Rev. A 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Test Circuit Decoupling Requirements Operation Operation Operation Applications Information Typical Applications Package Photograph Package Description Typical Application Related Parts