Datasheet LTM4638 (Analog Devices) - 2
| 制造商 | Analog Devices |
| 描述 | 20VIN, 15A Step-Down DC/DC µModule Regulator |
| 页数 / 页 | 30 / 2 — ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1). (See Pin … |
| 修订版 | B |
| 文件格式/大小 | PDF / 2.3 Mb |
| 文件语言 | 英语 |
ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1). (See Pin Functions, Pin Configuration T. able). ORDER INFORMATION
该数据表的模型线
文件文字版本
link to page 7 LTM4638
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1) (See Pin Functions, Pin Configuration T able)
VIN ... –0.3V to 22V V TOP VIEW OUT ... –0.3V to 6V SW INTV T CC .. –0.3V to 3.6V SENSE– 7 RUN .. –0.3V to VIN T GND SENSE+ PGOOD, FREQ, COMPa, COMPb, 6 PGOOD PHMODE, CLKOUT, FB .. –0.3V to 3.6V VOUT 5 PHMODE MODE/CLKIN, TRACK/SS ...–0.3V to INTV RUN CC 4 VIN V + INTV OSNS ... –0.3V to 6V CC 3 VOUT V – OSNS .. –0.3V to 0.3V VOSNS– MODE/CLKIN TRACK/SS Internal Operating Temperature Range 2 VOSNS+ CLKOUT (Notes 2, 5) .. –40°C to 125°C 1 FB COMPb Storage Temperature Range .. –55°C to 125°C COMPa FREQ A B C D E F G Peak Solder Reflow Body Temperature ... 250°C BGA PACKAGE 49-LEAD (6.25mm × 6.25mm × 5.02mm) TJMAX = 125°C, θJCtop = 10°C/W, θJCbottom = 4.2°C/W, θJA = 16°C/W NOTE: 1) θ VALUES ARE DETERMINED BY SIMULATION PER JESD51 CONDITIONS, WEIGHT 660mg 2) θJA VALUE IS OBTAINED WITH DEMO BOARD 3) REFER TO PAGES 21, 22 FOR LAB MEASUREMENT AND DE-RATING INFORMATION
ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (NOTE 2)
LTM4638EY#PBF SAC305 (RoHS) 4638 e1 BGA 3 –40°C to 125°C LTM4638IY#PBF SAC305 (RoHS) 4638 e1 BGA 3 –40°C to 125°C LTM4638IY SnPb 4638 e0 BGA 3 –40°C to 125°C • Contact the factory for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609. Manufacturing Procedures • LGA and BGA Package and Tray Drawings Rev. B 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Decoupling Requirements Operation Applications Information Package Description Revision History Package Photo Related Parts
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1) (See Pin Functions, Pin Configuration T able)
VIN ... –0.3V to 22V V TOP VIEW OUT ... –0.3V to 6V SW INTV T CC .. –0.3V to 3.6V SENSE– 7 RUN .. –0.3V to VIN T GND SENSE+ PGOOD, FREQ, COMPa, COMPb, 6 PGOOD PHMODE, CLKOUT, FB .. –0.3V to 3.6V VOUT 5 PHMODE MODE/CLKIN, TRACK/SS ...–0.3V to INTV RUN CC 4 VIN V + INTV OSNS ... –0.3V to 6V CC 3 VOUT V – OSNS .. –0.3V to 0.3V VOSNS– MODE/CLKIN TRACK/SS Internal Operating Temperature Range 2 VOSNS+ CLKOUT (Notes 2, 5) .. –40°C to 125°C 1 FB COMPb Storage Temperature Range .. –55°C to 125°C COMPa FREQ A B C D E F G Peak Solder Reflow Body Temperature ... 250°C BGA PACKAGE 49-LEAD (6.25mm × 6.25mm × 5.02mm) TJMAX = 125°C, θJCtop = 10°C/W, θJCbottom = 4.2°C/W, θJA = 16°C/W NOTE: 1) θ VALUES ARE DETERMINED BY SIMULATION PER JESD51 CONDITIONS, WEIGHT 660mg 2) θJA VALUE IS OBTAINED WITH DEMO BOARD 3) REFER TO PAGES 21, 22 FOR LAB MEASUREMENT AND DE-RATING INFORMATION
ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (NOTE 2)
LTM4638EY#PBF SAC305 (RoHS) 4638 e1 BGA 3 –40°C to 125°C LTM4638IY#PBF SAC305 (RoHS) 4638 e1 BGA 3 –40°C to 125°C LTM4638IY SnPb 4638 e0 BGA 3 –40°C to 125°C • Contact the factory for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609. Manufacturing Procedures • LGA and BGA Package and Tray Drawings Rev. B 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Decoupling Requirements Operation Applications Information Package Description Revision History Package Photo Related Parts