Datasheet LTM4626 (Analog Devices) - 3

制造商Analog Devices
描述20VIN, 12A Step-Down DC/DC µModule Regulator
页数 / 页28 / 3 — ELECTRICAL CHARACTERISTICS. The. denotes the specifications which apply …
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ELECTRICAL CHARACTERISTICS. The. denotes the specifications which apply over the specified internal

ELECTRICAL CHARACTERISTICS The denotes the specifications which apply over the specified internal

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link to page 2 LTM4626
ELECTRICAL CHARACTERISTICS The
l
denotes the specifications which apply over the specified internal operating temperature range (Note 2), otherwise specifications are at TA = 25°C. VIN = 12V per the typical application shown on the front page. SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
IQ(VIN) Input Supply Bias Current VIN = 12V, VOUT = 1.5V, MODE = INTVCC 100 mA VIN = 12V, VOUT = 1.5V, MODE = GND 18 mA Shutdown, RUN = 0, VIN = 12V 20 µA IS(VIN) Input Supply Current VIN = 12V, VOUT = 1.5V, IOUT = 12A 1.8 A IOUT(DC) Output Continuous Current VIN = 12V, VOUT = 1.5V 0 12 A Range ΔVOUT (Line)/VOUT Line Regulation Accuracy VOUT = 1.5V, VIN = 3.1V to 20V, IOUT = 0A l 0.04 0.15 %/V ΔVOUT (Load)/VOUT Load Regulation Accuracy VOUT = 1.5V, IOUT = 0A to 12A l 0.5 1.2 % VOUT(AC) Output Ripple Voltage IOUT = 0A, COUT = 100µF Ceramic, VIN = 12V, 5 mV VOUT = 1.5V ΔVOUT(START) Turn-On Overshoot IOUT = 0A, COUT = 100µF Ceramic, VIN = 12V, 30 mV VOUT = 1.5V tSTART Turn-On Time COUT = 100µF Ceramic, No Load, TRACK/SS = 0.01µF, 2.5 ms VIN = 12V, VOUT = 1.5V ΔVOUTLS Peak Deviation for Dynamic Load: 0% to 50% to 0% of Full Load, COUT = 47µF 160 mV Load Ceramic, VIN = 12V, VOUT = 1.5V tSETTLE Settling Time for Dynamic Load: 0% to 50% to 0% of Full Load, COUT = 47µF 40 µs Load Step Ceramic, VIN = 12V, VOUT = 1.5V IOUTPK Output Current Limit VIN = 12V, VOUT = 1.5V 14 A VFB Voltage at FB Pin IOUT = 0A, VOUT = 1.5V l 0.594 0.60 0.606 V IFB Current at FB Pin (Note 4) ±30 nA RFBHI Resistor Between VOUT and 60.05 60.40 60.75 kΩ FB Pins ITRACK/SS Track Pin Soft-Start Pull-Up TRACK/SS = 0V 6 10 µA Current VIN(UVLO) VIN Undervoltage Lockout VIN Falling 2.5 2.6 2.7 V VIN Hysteresis 300 mV tON(MIN) Minimum On-Time (Note 4) 25 ns tOFF(MIN) Minimum Off-Time (Note 4) 50 ns VPGOOD PGOOD Trip Level VFB With Respect to Set Output VFB Ramping Negative –12 –8 –5 % VFB Ramping Positive 5 8 12 % IPGOOD PGOOD Leakage 2 µA VPGL PGOOD Voltage Low IPGOOD = 1mA 0.02 0.1 V VINTVCC Internal VCC Voltage VIN = 4V to 20V 3.2 3.3 3.4 V fOSC Oscillator Frequency 600 kHz
Note 1:
Stresses beyond those listed under Absolute Maximum Ratings maximum ambient temperature consistent with these specifications is may cause permanent damage to the device. Exposure to any Absolute determined by specific operating conditions in conjunction with board Maximum Rating condition for extended periods may affect device layout, the rated package thermal resistance and other environmental reliability and lifetime. factors.
Note 2:
The LTM4626 is tested under pulsed load conditions such that
Note 3:
See output current derating curves for different VIN, VOUT and TA. TJ ≈ TA. The LTM4626E is guaranteed to meet performance specifications
Note 4:
100% tested at wafer level. over the 0°C to 125°C internal operating temperature range. Specifications
Note 5:
This IC includes overtemperature protection that is intended over the –40°C to 125°C internal operating temperature range are assured to protect the device during momentary overload conditions. Junction by design, characterization and correlation with statistical process temperature will exceed 125°C when overtemperature protection is active. controls. The LTM4626I is guaranteed to meet specifications over the Continuous operation above the specified maximum operating junction full –40°C to 125°C internal operating temperature range. Note that the temperature may impair device reliability. Rev B For more information www.analog.com 3 Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Electrical Characteristics Pin Configuration Typical Performance Characteristics Pin Functions Block Diagram Decoupling Requirements Operation Applications Information Package Description Revision History Package Photo Design Resources Related Parts