Datasheet TIP31C (STMicroelectronics) - 7
| 制造商 | STMicroelectronics |
| 描述 | Power transistors |
| 页数 / 页 | 10 / 7 — TIP31C. Package mechanical data. 3 Package. mechanical. data |
| 文件格式/大小 | PDF / 140 Kb |
| 文件语言 | 英语 |
TIP31C. Package mechanical data. 3 Package. mechanical. data
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文件文字版本
TIP31C Package mechanical data 3 Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 7/10
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 7/10