link to page 11 link to page 11 link to page 6 HIP2210, HIP2211 2. Specifications 2.3Recommended Operating ConditionsParameter (Note 5)MinimumMaximumUnits Supply Voltage, VDD +6 +18 V HI, LI, EN Inputs 0 VDD V PWM, VREF Inputs 0 +5.5 V Resistor on RDT pin to VSS for Programmable Dead Time +10 +100 kΩ Boot Voltage, HB Referenced to HS VDD - 1 +18 V Bootstrap Voltage, HB - +115 V Continuous Voltage on HS The greater of +100 V [-10 or -(20 - VDD)] HS Slew Rate <50 V/ns Temperature -40°C +125 °C 2.4Electrical Specifications VDD = HB = EN = 12V; VSS = HS = 0V; HI = LI = 0; VREF = 5V; PWM = 2.5V. No load on LO or HO, unless otherwise specified. Boldface limits apply across the operating temperature range, -40°C to +125°C.MinMaxParametersSymbolTest Conditions(Note 11)Typ(Note 11)UnitsSupply Currents (HIP2211) VDD Quiescent Current IDDQ HI = LI = 0 - 390 628 µA VDD Operating Current IDDO fSW = 500kHz; HI = LI = 50% square - 1.5 1.69 mA wave to VDD HB to HS Quiescent Current IHBQ HI = 1; LI = 0 - 370 475 µA HB to HS Operating Current IHBO fSW = 500kHz; HI = LI = 50% square - 1.4 1.6 mA wave to VDD HB to VSS Current, Operating IHBSO fSW = 500kHz; HI = LI =50% square - 88 110 µA wave to VDD; VHB = 115V; VHS = 100V HB to VSS Leakage Current IHBS HI = LI = 0; VHB = V HS = 100V - 29 47 µA Supply Currents (HIP2210) VDD Quiescent Current IDDQ PWM = 0.5 x VREF; EN = 1; - 455 700 µA RDT = 1kΩ; 100kΩ VDD Quiescent Current IDDQ PWM = 0.5 x VREF; EN = 1; - 800 1000 µA RDT = 10kΩ VDD Operating Current IDDO fSW = 500kHz; PWM = 50% square - 2 2.32 mA wave to VREF; RDT = 10kΩ VDD Disabled Current IDDSD EN = 0; RDT = 1kΩ; 100kΩ - 440 580 µA VDD Disabled Current IDDSD EN = 0; RDT = 10kΩ - 780 900 µA HB to HS Quiescent Current IHBQ PWM = VREF; EN = 1 - 370 475 µA HB to HS Operating Current IHBO fSW = 500kHz; PWM = 50% square - 1.7 2 mA wave to VREF; RDT = 100kΩ HB to VSS Current, Operating IHBSO fSW = 500kHz; PWM = 50% square - 95 126 µA wave to VREF; VHB = 115V; VHS = 100V; RDT = 100kΩ HB to VSS Leakage Current IHBS PWM = 0.5 x VREF; - 28 52 µA VHB = VHS = 100V FN9347 Rev.1.01 Page 7 of 27 Jun.23.20 Document Outline Related Literature Features Applications Contents 1. Overview 1.1 Block Diagrams 1.2 Ordering Information 1.3 Pin Configurations 1.4 Pin Descriptions 2. Specifications 2.1 Absolute Maximum Ratings 2.2 Thermal Information 2.3 Recommended Operating Conditions 2.4 Electrical Specifications 2.5 Switching Specifications 2.6 Timing Diagrams 3. Typical Performance Curves 4. Functional Description 4.1 Gate Drive for NMOS Half-Bridge 4.2 Functional Overview 5. Applications Information 5.1 HI/LI Input Control (HIP2211 Only) 5.2 PWM Input Control (HIP2210 Only) 5.3 VREF Input (HIP2210 Only) 5.4 EN Pin (HIP2210 Only) 5.5 Power Sequencing HIP2210 5.6 Selecting the Boot Capacitor Value 5.7 VDD Decoupling Capacitor 5.8 RDT and Dead Time Delay (HIP2210 Only) 5.9 HO and LO Outputs 5.10 Power Dissipation 5.10.1 Gate Power (for the HO and LO Outputs) 5.10.2 Boot Diode Dissipation 5.10.3 Dynamic Operating Current 5.10.4 Total Power Dissipation 5.10.5 Junction Operating Temperature 6. PCB Layout Guidelines 6.1 PCB Layout and EPAD Recommendation 7. Revision History 8. Package Outline Drawings