ADN8831Data SheetABSOLUTE MAXIMUM RATINGS Absolute maximum ratings at 25°C, unless otherwise noted. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a Table 2. stress rating only; functional operation of the product at these or ParameterRating any other conditions above those indicated in the operational Supply Voltage 6 V section of this specification is not implied. Operation beyond the Input Voltage GND to VS + 0.3 V maximum operating conditions for extended periods may affect Storage Temperature Range −65°C to +150°C product reliability. Junction Temperature 125°C THERMAL CHARACTERISTICS Lead Temperature (Soldering, 60 sec) 300°C θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 3. Thermal Resistance Package TypeθJAθJCUnit 32-lead LFCSP (ACPZ) 33.4 1.02 °C/W ESD CAUTION Rev. C | Page 6 of 18 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY DETAILED BLOCK DIAGRAM SPECIFICATIONS ELECTRICAL CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS THERMAL CHARACTERISTICS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION OSCILLATOR CLOCK FREQUENCY Free-Run Operation External Clock Operation Connecting Multiple ADN8831 Devices OSCILLATOR CLOCK PHASE TEMPERATURE LOCK INDICATOR SOFT START ON POWER-UP SHUTDOWN MODE STANDBY MODE TEC VOLTAGE/CURRENT MONITOR Voltage Monitor Current Monitor MAXIMUM TEC VOLTAGE LIMIT Using a DAC Using a Resistor Divider MAXIMUM TEC CURRENT LIMIT APPLICATIONS INFORMATION SIGNAL FLOW THERMISTOR SETUP THERMISTOR AMPLIFIER (Chop1) PID COMPENSATION AMPLIFIER (Chop2) MOSFET DRIVER AMPLIFIER OUTLINE DIMENSIONS ORDERING GUIDE