Preliminary Datasheet BM77SPPx3MC2 (Microchip) - 9
| 制造商 | Microchip |
| 描述 | Bluetooth 4.0 Dual Mode Module |
| 页数 / 页 | 28 / 9 — BM77SPPx3MC2. FIGURE 1-6: BM77SPPS3MCS MODULE DIMENSIONS. (Side View) 1 … |
| 文件格式/大小 | PDF / 741 Kb |
| 文件语言 | 英语 |
BM77SPPx3MC2. FIGURE 1-6: BM77SPPS3MCS MODULE DIMENSIONS. (Side View) 1 2.0 10.2 22.0. 21.2
该数据表的模型线
- BM77SPP03MC2-0003AA BM77SPP03MC2-0004AA BM77SPP03MC2-0006AA BM77SPP03MC2-0007AA BM77SPP03MC2-0008AA BM77SPP03MC2-0009AA BM77SPP03MC2-000AAA BM77SPP03MC2-000BAA BM77SPP05MC2-0006AA BM77SPPS3MC2-0006AA BM77SPPS3MC2-0007AA BM77SPPS3MC2-0008AA BM77SPPS3MC2-000AAA BM77SPPS3MC2-PH07AA BM77SPPS3MC2-S00AAA BM77SPPS5MC2-0004AA
文件文字版本
BM77SPPx3MC2
FIGURE 1-6: BM77SPPS3MCS MODULE DIMENSIONS
(Side View) 1 2.0 10.2 22.0
21.2
20.1 21.5 33 19.9 18.0 18.95 17.3 18.0 16.95 shield mounting hole 14.90 13.9
12.8
11.7
10.6
9.5
8.4
7.3
6.2
5.1
4.0
2.9
1.8 13.9
12.8
11.7
10.6
9.5
8.4
7.3
6.2
5.1
4.0
2.9
1.8 1.0mm
0.7mm (Bottom View) 1.1mm 0.7 0.0 Dimentions are in millimeters
Tolerances: 0.0 0.7mm 0.5mm 9.3
8.2
7.1
6.0
4.9
3.8
2.7 2.4
0.6
0.0 shield
mounting
hole 11.2
12.0 2.7
3.8
4.9
6.0
7.1
8.2
9.3 0.0
0.8 0.0 12.0 22.0
21.2
20.1 (Bottom View) 11.2 0.8
2.0 (Top View) PCB Outline: +/-0.4 mm
PCB Thickness: +/-0.06 mm
1.0mm Pad Detail FIGURE 1-7: BM77SPPS3MC2 RECOMMEDED PCB FOOTPRINT 9.2 11.2 2.0 (Top View) 22.0
21.2
20.1 Top Copper
Keep Out Area 18.0 18.0
16.0
0.5mm
1.5mm 13.9
12.8
11.7
10.6
9.5
8.4
7.3
6.2
5.1
4.0
2.9
1.8 0.7mm
1.1mm © 2014 ISSC Technologies Corp. 12.0 2.7
3.8
4.9
6.0
7.1
8.2
9.3 0.0 0.0 Preliminary Revision 2.1.1 – June 16, 2015 Page 9
FIGURE 1-6: BM77SPPS3MCS MODULE DIMENSIONS
(Side View) 1 2.0 10.2 22.0
21.2
20.1 21.5 33 19.9 18.0 18.95 17.3 18.0 16.95 shield mounting hole 14.90 13.9
12.8
11.7
10.6
9.5
8.4
7.3
6.2
5.1
4.0
2.9
1.8 13.9
12.8
11.7
10.6
9.5
8.4
7.3
6.2
5.1
4.0
2.9
1.8 1.0mm
0.7mm (Bottom View) 1.1mm 0.7 0.0 Dimentions are in millimeters
Tolerances: 0.0 0.7mm 0.5mm 9.3
8.2
7.1
6.0
4.9
3.8
2.7 2.4
0.6
0.0 shield
mounting
hole 11.2
12.0 2.7
3.8
4.9
6.0
7.1
8.2
9.3 0.0
0.8 0.0 12.0 22.0
21.2
20.1 (Bottom View) 11.2 0.8
2.0 (Top View) PCB Outline: +/-0.4 mm
PCB Thickness: +/-0.06 mm
1.0mm Pad Detail FIGURE 1-7: BM77SPPS3MC2 RECOMMEDED PCB FOOTPRINT 9.2 11.2 2.0 (Top View) 22.0
21.2
20.1 Top Copper
Keep Out Area 18.0 18.0
16.0
0.5mm
1.5mm 13.9
12.8
11.7
10.6
9.5
8.4
7.3
6.2
5.1
4.0
2.9
1.8 0.7mm
1.1mm © 2014 ISSC Technologies Corp. 12.0 2.7
3.8
4.9
6.0
7.1
8.2
9.3 0.0 0.0 Preliminary Revision 2.1.1 – June 16, 2015 Page 9