Datasheet BM90 (Microchip)

BM90
Bluetooth® 3.0 Multi-Speaker Stereo Audio Module Features Audio Codec
 16 bit DAC and 16 bit ADC codec
System Specification
  94dB SNR DAC playback Compliant with Bluetooth Specification v.3.0 + EDR in 2.4 GHz ISM band module  85 dB SNR ADC.  It supports following profiles : - Hands Free 1.5
Peripherals
- Headset 1.0  Built-in Lithium-ion battery charger (up to 350mA) - A2DP 1.0 - AVRCP 1.0  Integrate 3V, 1.8V configurable switching regulator and LDO
Baseband Hardware
 Built-in ADC for battery monitor and voltage sense.  Built-in 16MHz main clock input.  A line-in port for external audio input  Built-in internal ROM for program memory  Two LED drivers  Support to connect to two hosts ( phones, tablets…)  Built-in 32Kb EEPROM with HFP or A2DP profiles simultaneously  Adaptive Frequency Hopping (AFH) avoids
Flexible HCI interface
occupied RF channels  High speed HCI-UART (Universal Asynchronous  Fast Connection supported Receiver Transmitter) interface (up to 921600bps)
RF Hardware
 Fully Bluetooth 3.0 + EDR system in 2.4 GHz ISM band.  Combined TX/RX RF terminal simplifies external matching and reduces external antenna switches.  Max. +4dBm output power with 20 dB level control from register control.  Built-in T/R switch for Class 2/3 application  To avoid temperature variation, temperature sensor with temperature calibration is utilized into bias current and gain control.  Fully integrated synthesizer has been created. There requires no external VCO, varactor diode, resonator and loop filter.  Crystal oscillation with built-in digital trimming for temperature/process variations.
Package
 Built-in PCB antenna.  15x29mm2 40 pins package
Audio processor Description
 Support A-Law or -Law PCM format, or CVSD (Continuous Variable Slope Delta Modulation) for BM90 multi-speaker stereo audio module is a SCO channel operation. compact, highly integrated module for Bluetooth v3.0  Noise suppression with Enhanced Data Rate 2.4GHz applications. This  Echo suppression module is fully compliant with Bluetooth specification  SBC decoding and completely backward-compatible with Bluetooth  2.0 or 1.2 systems. Packet loss concealment  Build-in one languages (English) voice prompts and It incorporates IS1690S multi-speaker stereo audio 20 events for each one chip, 32Kb EEPROM, PCB antenna, and ISSC’s own  Bluetooth software stack to achieve the required BT Support SCMS-T v3.0 with EDR functions. page 1 Document Outline Bluetooth® 3.0 Multi-Speaker Stereo Audio Module Features Description Applications Table of Contents 1.0 DEVICE OVERVIEW FIGURE 1-1: APPLICATION BLOCK DIAGRAM Audio Interface FIGURE 1-2: Analog audio interface block diagram FIGURE 1-3: Twin Speaker Link block diagram 2.0 Key Features Table 3.0 PIN DESCRIPTION TABLE 3-1: BM90 PIN DESCRIPTION 4.0 SPECIFICATIONS 4.1 SPECIFICATIONS Table 4-1: Absolute Maximum Specifications Table 4-2: Recommended operating condition Table 4-3: Battery Charger Table 4-4: LED driver Table 4-5: Digital IO Table 4-6: Audio codec Digital to Analogue Converter Table 4-7: Audio codec Analogue to Digital Converter Table 4-8: Transmitter section for BDR Table 4-9: Transmitter section for EDR Table 4-10: Receiver section for BDR Table 4-11: Receiver section for EDR 4.2 PRINTED ANTENNA PERFORMANCE Table 4-12: Antenna Parameters FIGURE 4-1: Antenna 3D radiation pattern @2441 MHz 4.3 BQTF INFORMATION FIGURE 4-2: BQTF Information 4.4 CURRENT CONSUMPTION Table 4-13: Single Mode current consumption Table 4-14: Twin Mode: Master current consumption Table 4-15: Twin Mode: Slave current consumption 5.0 APPLICATIONS 5.1 EXTERNAL CONFIGURATION FIGURE 5-1: External Configuration Header Connections TABLE 5-1: SYSTEM CONFIGURATION SETTINGS 5.2 LED DRIVER 5.3 FUNCTION OF PIN TABLE 5-2: IOs for Buttons TABLE 5-3: IOs for added functions 5.4 Adaptive Frequency Hopping (AFH) 5.5 MULTI-SPEAKER 5.5.1 TWIN SPEAKER LINK TECHNOLOGY INTRODUCTION 5.5.1.1 TWIN SPEAKER LINK Figure 5-2 A2DP Twin Speaker Link Diagram 5.6 Mounting Details 5.7 Module Dimension FIGURE 5-3: BM90 module FIGURE 5-4: Outline Dimension FIGURE 5-5: Module Foot print 5.8 Main Board Antenna Area Layout Guide FIGURE 5-6: Mother Board Antenna Area Layout Guide 5.9 RFLOW PROFILE 5.9.1Soldering Recommendations FIGURE 5-7: Reflow profile 6.0 REFERENCE CIRCUIT FIGURE 6-1: BM90 reference circuit 7.0 PACKING INFORMATION 7.1 QR code label information 7.2 Storage standard 7.3 Ordering Information 7.4 Tray Dimensions 7.5 Packing Method