Datasheet RN4020 (Microchip) - 5

RN4020 TABLE 1-1: PIN DESCRIPTION (CONTINUED) Pin Name Description Function
Hardware wake from Dormant state. Setting the WAKE_HW (pin15) high wakes the module from Dor- mant mode. During the module power up, if WAKE_HW pin is flipped high and low for three cycles (putting the WAKE_HW pin into high, low, and then high again is considered as one flip cycle) in the first five seconds, then the module performs a factory Reset. If the WAKE_SW pin is high when a factory Reset is performed, the factory Reset is a full reset. Otherwise, it is a partial reset that retains the device name, private service and scripts. Set WAKE_HW 15 WAKE_HW pin to low in order to lower power consumption in Active-high; internal pull down Deep Sleep and Dormant modes.
CAUTION
A full factory Reset erases scripts and sets the device name to the serialized name. For more information, refer to the SF Command in the RN4020 Bluetooth Low Energy User's Guide (DS70005191). 16 GND Ground Ground Input with internal pull down; 17 SPI/PIO SPI/PIO for pins 10-13; active-high selects SPI on pins 10-13 Reserved for RTS if hardware flow control on UART RTS is enabled. If the data transmission to RN4020 must • RTS (output) 18 PIO[6] be halted, assert RTS to high. RTS pin operates • PIO[6] independently from the CTS (pin 14). PWM4 PIO[7]; Spare PIO configurable as 19 Spare PIO PIO[7] input or output 20 RSVD Do not connect. Factory diagnostics. No Connect SDA Data line of the I2C interface. The RN4020 21 SDA SDA always acts as the I2C Master. 22 SCL I2C Clock SCL 23 VDD Supply voltage 1.8 to 3.6V 24 GND Ground Ground  2015 Microchip Technology Inc. DS50002279B-page 5 Document Outline Features Operational RF/Analog Features MAC/Baseband/Higher Layer Features Applications Description 1.0 Device Overview FIGURE 1-1: RN4020 Top View FIGURE 1-2: RN4020 Pin Diagram FIGURE 1-3: RN4020 Block Diagram TABLE 1-1: Pin Description 2.0 General Specifications TABLE 2-1: General Specifications TABLE 2-2: Weight and Dimensions TABLE 2-3: Electrical Characteristics TABLE 2-4: Current Consumption TABLE 2-5: Current Consumption vs RF TX Power 3.0 Microcontroller to RN4020 Interface 3.1 CTS/RTS Hardware Flow Control 3.2 Microchip Low-energy Data Profile (MLDP) FIGURE 3-1: Interface Description 4.0 Physical Dimensions FIGURE 4-1: RN4020 Module Dimensions FIGURE 4-2: RN4020 Recommended PCB Footprint FIGURE 4-3: RN4020 Module Mounting Details FIGURE 4-4: RN4020 HOST PCB EXAMPLE Layout 5.0 Typical Application Schematic FIGURE 5-1: RN4020 Typical Application Schematics 6.0 ASCII Command API 7.0 Supported Services TABLE 7-1: Supported Public Services on RN4020(1) 7.1 Public and Private Services 7.2 PCB Antenna TABLE 7-2: Antenna Characteristics FIGURE 7-1: Efficiency FIGURE 7-2: Antenna Plot FIGURE 7-3: 3D Radiation Pattern And Antenna Orientation 7.3 Soldering Recommendations 8.0 Regulatory Approval 8.1 United States 8.2 Canada 8.3 Europe TABLE 8-1: RN4020 European Compliance Testing 8.4 Australia 8.5 New Zealand 8.6 Japan 8.7 Korea 8.8 Taiwan 9.0 Ordering Information TABLE 9-1: Ordering Information Bluetooth® Low Energy Module Most Current Data Sheet Errata Customer Notification System Appendix A: Revision History Revision A (June 2014) Revision B (September 2015) The Microchip Web Site Customer Change Notification Service Customer Support AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Worldwide Sales and Service