Datasheet RN52 (Microchip) - 9

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RN52
1.1.3 ANALOG-TO-DIGITAL CONVERTER The ADC analog amplifier is a two-stage amplifier. The (ADC) first stage selects the correct gain for either micro- phone or line input. See Figure 1-7. The ADC consists of two second-order sigma delta (SD) converters, resulting in two separate channels with identical functionality. Each ADC supports the following sample rates: • 8 kHz • 16 kHz • 32 kHz • 44.1 kHz • 48 kHz
FIGURE 1-7: ADC ANALOG AMPLIFIER BLOCK DIAGRAM
Bypass or 24-dB Gain -3 to 18 dB Gain P – – P N + + N Line Mode/Microphone Mode Gain 0:7 1.1.4 DIGITAL-TO-ANALOG CONVERTER 1.1.4.2 Microphone Input (DAC) The RN52 audio input is intended for use from 1 μA at The DAC consists of two third-order SD converters, 94 dB SPL to about 10 μA at 94 dB SPL, which requires resulting in two separate channels with identical func- microphones with sensitivity between –40 and –60 tionality. Each DAC supports the following sample dBV. The RN52 microphone mode input impedance is rates: typically 6 kohm. The line mode input impedance is typ- ically between 6 kohm and 30 kohm. The overall gain • 8 kHz of the microphone input is approximately -3 dB to 42 dB • 16 kHz in 1.5 dB steps. MIC_BIAS requires a minimum load to • 32 kHz maintain regulation. MIC_BIAS maintains regulation • 44.1 kHz within 0.199 and 1.229 mA. Therefore, if you use a • 48 kHz microphone with specifications below these limits, the microphone output must be pre-loaded with a large 1.1.4.1 Speaker Output value resistor to ground. The speaker output is capable of driving a speaker with an impedance of at least 8 ohms directly. The overall gain of the speaker output is approximately -21 dB to 0 dB in 1.5 dB steps.  2015 Microchip Technology Inc. DS70005120A-page 9 Document Outline RN52 Features: Applications: RN52 Block Diagram: 1.0 Device Overview TABLE 1-1: General Specifications TABLE 1-2: Weight and Dimensions TABLE 1-3: Electrical Characteristics FIGURE 1-1: Module Dimensions FIGURE 1-2: Recommended PCB Footprint FIGURE 1-3: Pin Diagram TABLE 1-4: Pin Description(1) (Sheet 1 of 3) 1.1 Audio Interface Circuit Description 1.1.1 Digital Audio Interface FIGURE 1-4: I2S and SPDIF Connections 1.1.2 Analog Audio Interface FIGURE 1-5: RN52 Audio Interface Block Diagram FIGURE 1-6: Stereo CODEC Audio Input/Output Stages 1.1.3 Analog-to-Digital Converter (ADC) FIGURE 1-7: ADC Analog Amplifier Block Diagram 1.1.4 Digital-to-Analog Converter (DAC) 1.1.4.1 Speaker Output 1.1.4.2 Microphone Input TABLE 1-5: Digital to Analog Converter TABLE 1-6: AnaLog to Digital Converter 1.2 General Purpose IO (GPIO) Ports TABLE 1-7: Digital Input and Output Voltage Levels 1.3 Power Consumption TABLE 1-8: Power Consumption 2.0 Applications 2.1 Minimizing Radio Interference FIGURE 2-1: Minimizing Radio Interference FIGURE 2-2: PCB Example Layout 2.2 LED Interface FIGURE 2-3: LED interface TABLE 2-1: Status LED Functions 2.3 Device Firmware Updates FIGURE 2-4: USB DFU Port and GPIO3 Schematic 2.4 Restore Factory Defaults with GPIO4 2.5 Power Control and Regulation 2.6 Solder Reflow Profile TABLE 2-2: Paste Solder Recommendations FIGURE 2-5: Solder Reflow Temperature Profile FIGURE 2-6: Solder Reflow Curve 2.7 Typical Application Schematic FIGURE 2-7: Typical Application Circuit for A2DP Audio Streaming and AVRCP Remote Control 3.0 Bluetooth SIG Certification 4.0 Regulatory Approval 4.1 United States 4.1.1 Labeling and User Information Requirements 4.1.2 RF Exposure 4.1.3 HELPFUL WEB SITES 4.2 Canada 4.2.1 Labeling and User Information Requirements 4.2.2 Helpful Web Sites 4.3 Europe 4.3.1 Labeling and User Information Requirements 4.3.2 Antenna Requirements 4.3.3 Helpful Web Sites TABLE 4-1: European Compliance Testing 4.4 Australia 4.4.1 Helpful Web Sites 4.5 New Zealand 4.5.1 Helpful Web Sites 5.0 Ordering Information TABLE 5-1: Ordering Information(1) 6.0 Revision History Revision A (September 2015) Notes: RN52 Bluetooth® Audio Module AMERICAS Corporate Office Atlanta Austin, TX Boston Chicago Cleveland Dallas Detroit Houston, TX Indianapolis Los Angeles New York, NY San Jose, CA Canada - Toronto ASIA/PACIFIC Asia Pacific Office Hong Kong Australia - Sydney China - Beijing China - Chengdu China - Chongqing China - Dongguan China - Hangzhou China - Hong Kong SAR China - Nanjing China - Qingdao China - Shanghai China - Shenyang China - Shenzhen China - Wuhan China - Xian ASIA/PACIFIC China - Xiamen China - Zhuhai India - Bangalore India - New Delhi India - Pune Japan - Osaka Japan - Tokyo Korea - Daegu Korea - Seoul Malaysia - Kuala Lumpur Malaysia - Penang Philippines - Manila Singapore Taiwan - Hsin Chu Taiwan - Kaohsiung Taiwan - Taipei Thailand - Bangkok EUROPE Austria - Wels Denmark - Copenhagen France - Paris Germany - Dusseldorf Germany - Karlsruhe Germany - Munich Italy - Milan Italy - Venice Netherlands - Drunen Poland - Warsaw Spain - Madrid Sweden - Stockholm UK - Wokingham Worldwide Sales and Service