Datasheet TBU-RS (Bourns) - 6
| 制造商 | Bourns |
| 描述 | TBU-RSxxx-300-WH - TBU High-Speed Protector |
| 页数 / 页 | 9 / 6 — TBU-RSxxx-300-WH Series -. TBU® High-Speed Protector. Recommended Pad … |
| 文件格式/大小 | PDF / 682 Kb |
| 文件语言 | 英语 |
TBU-RSxxx-300-WH Series -. TBU® High-Speed Protector. Recommended Pad Layout. Reflow Profile. Profile Feature. Pb-Free Assembly
该数据表的模型线
文件文字版本
BOTTOM VIEW D5 TOP VIEW SIDE VIEW 2 D5 D4 D A E3 6 E4 5 N 7 E1 U 4 E Rxx30 YWWLL 2 E2 3 N 1 E1 U E3 H G PIN 1 INDICATOR CHAMFERED D6 D3 CORNER D1 FOR PIN 1
TBU-RSxxx-300-WH Series -
SIDE VIEW 1
TBU® High-Speed Protector
IDENTIFICATION D2 A1
Recommended Pad Layout
TBU® High-Speed Protectors have a 100 % matte-tin termination 0.90 finish. For improved thermal dissipation, the recommended layout (.035) 3.60 uses PCB copper areas which extend beyond the exposed solder 2.20 (.142) 1.40 pad. The exposed solder pads should be defined by a solder mask 2.30 (.087) (.055) which matches the pad layout of the TBU® device in size and spac- (.091) 1.30 0.40 (.051) (.016) ing. It is recommended that they should be the same dimension as 0.40 the TBU® pads but if smaller solder pads are used, they should be (.016) centered on the TBU® package terminal pads and not more than 0.10-0.12 mm (0.004-0.005 in.) smaller in overall width or length. Solder pad areas should not be larger than the TBU® pad sizes to ensure adequate clearance is maintained. The recommended 1.60 0.40 2.30 0.40 (.063) (.016) stencil thickness is 0.10-0.12 mm (0.004-0.005 in.) with a stencil 1.00 (.016) 1.30 (.091) opening size 0.025 mm (0.0010 in.) less than the solder pad size. (.039) 0.40 1.40 1.15 (.051) Extended copper areas beyond the solder pad significantly improv K e (.016) (.055) (.045) 0.70 the junction to ambient thermal resistance, resulting in operation J K (.028) J at lower junction temperatures with a corresponding benefit of B C E 2.625 F E N DIMENSIONS: MM (.103) reliability. (INCHES) 3 2 1 All pads should soldered to the PCB, including pads marked as NU A 3.55 H (.140) but no electrical connection should be made to these pads. Care should be taken to assure no resistive path exists between the NU pins to any other point to avoid unexpected p PIN 1 D erformance issues. N For minimum parasitic capacitance, it is recommended that signal, TOP VIEW SIDE VIEW BOTTOM VIEW ground or power signals are not routed beneath any pad.
Reflow Profile Profile Feature Pb-Free Assembly
Average Ramp-Up Rate (Tsmax to Tp) 3 °C/sec. max. Preheat - Temperature Min. (Tsmin) 150 °C - Temperature Max. (Tsmax) 200 °C - Time ts (tsmin to tsmax) 60-180 sec. Time maintained above: - Temperature (TL) 217 °C - Time (tL) 60-150 sec. Peak/Classification Temperature (Tp) 260 °C Time within 5 °C of Actual Peak Temp. (tp) 20-40 sec. Ramp-Down Rate 6 °C/sec. max. Time 25 °C to Peak Temperature t25C to Tp 8 min. max. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
TBU-RSxxx-300-WH Series -
SIDE VIEW 1
TBU® High-Speed Protector
IDENTIFICATION D2 A1
Recommended Pad Layout
TBU® High-Speed Protectors have a 100 % matte-tin termination 0.90 finish. For improved thermal dissipation, the recommended layout (.035) 3.60 uses PCB copper areas which extend beyond the exposed solder 2.20 (.142) 1.40 pad. The exposed solder pads should be defined by a solder mask 2.30 (.087) (.055) which matches the pad layout of the TBU® device in size and spac- (.091) 1.30 0.40 (.051) (.016) ing. It is recommended that they should be the same dimension as 0.40 the TBU® pads but if smaller solder pads are used, they should be (.016) centered on the TBU® package terminal pads and not more than 0.10-0.12 mm (0.004-0.005 in.) smaller in overall width or length. Solder pad areas should not be larger than the TBU® pad sizes to ensure adequate clearance is maintained. The recommended 1.60 0.40 2.30 0.40 (.063) (.016) stencil thickness is 0.10-0.12 mm (0.004-0.005 in.) with a stencil 1.00 (.016) 1.30 (.091) opening size 0.025 mm (0.0010 in.) less than the solder pad size. (.039) 0.40 1.40 1.15 (.051) Extended copper areas beyond the solder pad significantly improv K e (.016) (.055) (.045) 0.70 the junction to ambient thermal resistance, resulting in operation J K (.028) J at lower junction temperatures with a corresponding benefit of B C E 2.625 F E N DIMENSIONS: MM (.103) reliability. (INCHES) 3 2 1 All pads should soldered to the PCB, including pads marked as NU A 3.55 H (.140) but no electrical connection should be made to these pads. Care should be taken to assure no resistive path exists between the NU pins to any other point to avoid unexpected p PIN 1 D erformance issues. N For minimum parasitic capacitance, it is recommended that signal, TOP VIEW SIDE VIEW BOTTOM VIEW ground or power signals are not routed beneath any pad.
Reflow Profile Profile Feature Pb-Free Assembly
Average Ramp-Up Rate (Tsmax to Tp) 3 °C/sec. max. Preheat - Temperature Min. (Tsmin) 150 °C - Temperature Max. (Tsmax) 200 °C - Time ts (tsmin to tsmax) 60-180 sec. Time maintained above: - Temperature (TL) 217 °C - Time (tL) 60-150 sec. Peak/Classification Temperature (Tp) 260 °C Time within 5 °C of Actual Peak Temp. (tp) 20-40 sec. Ramp-Down Rate 6 °C/sec. max. Time 25 °C to Peak Temperature t25C to Tp 8 min. max. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.